Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films in Cu/low-k interconnects
Wojcik, H.; Hossbach, C.; Kubasch, C.; Verdonck, P.; Barbarin, Y.; Merkel, U.; Bartha, J.W.; Hübner, R.; Engelmann, H.-J.; Friedemann, M.
Journal Article
2012Electrical evaluation of Ru-W(-N), Ru-Ta(-N) and Ru-Mn films as Cu diffusion barriers
Wojcik, H.; Kaltofen, R.; Merkel, U.; Krien, C.; Strehle, S.; Gluch, J.; Knaut, M.; Wenzel, C.; Preusse, A.; Bartha, J.W.; Geidel, M.; Adolphi, B.; Neumann, V.; Liske, R.; Munnik, F.
Journal Article, Conference Paper
2012Physical characterization of PECVD and PEALD Ru(-C) films and comparison with PVD ruthenium film properties
Wojcik, H.; Junige, M.; Bartha, W.; Albert, M.; Neumann, V.; Merkel, U.; Peeva, A.; Gluch, J.; Menzel, S.; Munnik, F.; Liske, R.; Utess, D.; Richter, I.; Klein, C.; Engelmann, H.J.; Ho, P.; Hossbach, C.; Wenzel, C.
Journal Article
2011Comparison of PVD, PECVD and PEALD Ru-TaN films with high Ru concentration for direct Cu plating
Wojcik, H.; Merkel, U.; Bartha, J.W.; Li, J.; Lehninger, D.; Engelmann, H.J.; Popatov, P.; Gluch, J.; Knaut, M.; Strehle, S.; Wenzel, C.; Adolphi, B.; Neumann, V.; Liske, R.
Conference Paper
2011Investigations on Ru-Mn films as plateable Cu diffusion barriers
Wojcik, H.; Kaltofen, R.; Krien, C.; Merkel, U.; Wenzel, C.; Bartha, J.W.; Friedemann, M.; Adolphi, B.; Liske, R.; Neumann, V.; Geidel, M.
Conference Paper
2010Assessment of mechanical properties of nanoscale structures for microprocessor manufacturing
Niese, S.; Hecker, M.; Liske, R.; Ritz, Y.; Zschech, E.; Wojcik, H.; Bartha, J.; Wu, Z.; Ho, P.S.
Conference Paper
2009Properties of plasma-enhanced atomic layer deposition-grown tantalum carbonitride thin films
Hossbach, C.; Teichert, S.; Thomas, J.; Wilde, L.; Wojcik, H.; Schmidt, D.; Adolphi, B.; Bertram, M.; Mühle, U.; Albert, M.; Menzel, S.; Hintze, B.; Bartha, J.W.
Journal Article