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| 2012 | Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B. | Journal Article |
| 2012 | Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R. | Journal Article |
| 2012 | Eco-reliability - a combined approach to balance environment with reliability
Nissen, Nils F.; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2012 | In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, H.; Bauer, J.; Braun, T.; Hölck, O.; Wunderle, B.; Wittler, O. | Conference Paper |
| 2012 | Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B. | Conference Paper |
| 2011 | Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens
Walter, Hans; Wunderle, Bernhard; Keller, Jürgen; Hölck, Ole; Wittler, Olaf; Michel, Bernd | Conference Paper |
| 2011 | Characterization of deformation properties of metals in 3D ICs
Wittler, O.; Mroßko, R.; Huber, S.; Dowhan, L.; Lang, K.-D. | Conference Paper |
| 2011 | Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B. | Conference Paper |
| 2011 | Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R. | Conference Paper |
| 2011 | Eco-Reliability - A Fusion of GreenTech and HighTech
Nissen, N. F.; Wittler, O.; Middendorf, A.; Lang, K.-D. | Journal Article |
| 2011 | Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards
Nowak, T.; Schacht, R.; Walter, H.; Wunderle, B.; Ras, M.A.; May, D.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2011 | Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Lang, Klaus Dieter; Michel, Bernd; Wunderle, Bernhard | Conference Paper |
| 2011 | Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods
Dowha, L.; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O. | Journal Article |
| 2011 | Investigation of thin films by nanoindentation with doe and numerical methods
Dowha, .; Wymysowski, A.; Wittler, O. | Conference Paper |
| 2011 | Modelling of metal degradation in power devices under active cycling conditions
Kanert, W.; Pufall, R.; Wittler, O.; Dudek, R.; Bouazza, M. | Conference Paper |
| 2011 | Packaging of MEMS/MOEMS and nanodevices: Reliability, testing, and characterization aspects
Tekin, T.; Ngo, H.-D.; Wittler, O.; Bouhlal, B.; Lang, K.-D. | Conference Paper |
| 2010 | Adhesion of moulding compounds on various surfaces: A study on moisture influence and degradation after high temperature storage
Pufall, R.; Goroll, M.; Bouazza, M.; Wittler, O.; Michel, B. | Conference Paper |
| 2010 | Application of multi-criteria optimization algorithms to numerical material extraction of thin layers through nanoindentaion technique
Dowha, .; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O. | Conference Paper |
| 2010 | Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis
Wymyslowski, A.; Dowha, L.; Wittler, O.; Mrossko, R.; Dudek, R. | Journal Article |
| 2010 | Application of numerical optimization algorithms used to investigation of thin films in nanoindentation test
Dowhán, L.; Wymyslowski, A.; Wittler, O.; Mrosko, R. | Conference Paper |
| 2010 | DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B. | Conference Paper |
| 2010 | Hermeticity of eutectic bond layers for sensor packages on wafer-level
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H. | Conference Paper |
| 2010 | Investigation of the Reliability of Electronic Components Under Combined Loads (Vibration, Humidity, Temperature)
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B. | Conference Paper |
| 2010 | Eine neue Methode zur Charakterisierung und Detektion der Degradation von Die-Attach Materialien durch In-Situ Zustandsüberwachung der thermischen Eigenschaften
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B. | Conference Paper |
| 2010 | A new Method for Detection of Degradation in Die-Attach Materials by In-Situ Monitoring of Thermal Properties
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B. | Book Article |
| 2010 | Novel test structures for hermeticity testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H. | Conference Paper, Abstract |
| 2010 | Novel test structures for hermetictiy testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H. | Conference Paper |
| 2010 | Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B. | Conference Paper |
| 2010 | Simulationsgestützte Zuverlässigkeitsbewertung im Mikro-Nano Übergangsbereich
Wittler, O.; Huber, S.; Mroßko, R.; Walter, H.; Auerswald, E.; Michel, B. | Conference Paper |
| 2009 | Characterisation and modelling of the nanoindentation experiment in Au layers
Wittler, O.; Mrossko, R.; Huber, S.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2009 | Detection of degradation in die-attach materials by in-situ monitoring of thermal properties
Wittler, O.; Nejadari, A.M.; Michel, B. | Conference Paper |
| 2009 | Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages
Wunderle, B.; Wittler, O.; Walter, H.; Michel, B.; Shirangi, M.H. | Conference Paper |
| 2009 | Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, A.; Wittler, O.; Mrossko, R.; Dudek, R.; Auersperg, J.; Dowhan, L. | Conference Paper |
| 2009 | Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H. | Journal Article |
| 2009 | Verfahren und Vorrichtung zur thermischen Ueberwachung von Ausfallprozessen
Wittler, O.; Wunderle, B.; Mazloum Nejadari, S.; Schacht, R.; Michel, B. | Patent |
| 2008 | Encapsulation of systems in package - process characterization and optimization
Schreier-Alt, T.; Schindler-Saefkow, F.; Wittler, O.; Kittel, H. | Conference Paper |
| 2008 | Experimental Methods of Thermal Validation and Optimization for Micro-electronic Assemblies Focusing on the Non-Destructive Failure Analysis Using Passive and Active IR-Thermography
Schacht, R.; May, D.; Kreyßig, K.; Wittler, O.; Wunderle, B.; Michel, B. | Journal Article, Conference Paper |
| 2008 | Mechanical Characterisation of Thin Metal Layers by Modelling of the Nanoindentation Experiment
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Conference Paper |
| 2008 | A method for reliability characterisation of die attach materials
Wittler, O.; Mazloum Nejadari, S.A.; Michel, B. | Conference Paper, Journal Article |
| 2008 | Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Journal Article, Conference Paper |
| 2008 | Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Kittel, H.; Michel, B. | Conference Paper |
| 2008 | Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B. | Conference Paper |
| 2008 | Reliability Investigations on Highly Integrated TPMS
Kaulfersch, E.; Maaike, M.; Taklo, M.M.V.; Weber, J.; Wunderle, B.; Wittler, O.; Mroßko, R. | Journal Article, Conference Paper |
| 2007 | Charakterisierungsmethodik für dünne Schichten im Sub-Mikrometerbereich
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Conference Paper, Journal Article |
| 2007 | Design for reliability with AuSn interconnects
Dudek, R.; Wittler, O.; Faust, W.; Brämer, B.; Klein, M.; Jun, W.; Michel, B. | Conference Paper |
| 2007 | Experimental characterization of thin Copper foils
Auerswald, E.; Walter, H.; Wittler, O.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2007 | A methodology to characterise thin films in the sub-micron range
Wittler, O.; Mroßke, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Conference Paper, Journal Article |
| 2007 | A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B. | Conference Paper, Journal Article |
| 2007 | Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon
Wunderle, B.; Mrossko, R.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michl, B.; Reichl, H. | Conference Paper |
| 2007 | Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H. | Conference Paper |
| 2006 | Characterization of thermal interface materials
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2006 | Characterization of thermal interface materials to support thermal simulation
Schacht, R.; May, D.; Gollhardt, A.; Wittler, O.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2006 | Deformation and fatigue behaviour of AuSn interconnects
Wittler, O.; Walter, H.; Dudek, R.; Faust, W.; Jun, W.; Michel, B. | Conference Paper |
| 2006 | Experimentelle Charakterisierung von Thermischen Interface Materialien für die thermische Simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2006 | Modelling effects of packaging on pull-in behaviour of doubly-anchored beams
Lishchynska, M.; O'Mahony, C.; Slattery, O.; Wittler, O. | Conference Paper |
| 2006 | Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging
Wittler, O.; Walter, H.; Keller, J.; Dudek, R.; Vogel, D.; Michel, B. | Conference Paper |
| 2006 | Thermal management in a 3D-PCB-package with water cooling
Schindler-Saefkow, F.; Wittler, O.; May, D.; Michel, B. | Conference Paper |
| 2005 | Characterization of thermal interface materials for thermal simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2005 | Design methodology of microstructures for enhanced mechanical reliability
Wittler, O.; Walter, H.; Vogel, D.; Keller, J.; Michel, B. | Conference Paper |
| 2005 | Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Thermal Analysis of Electronic Components and Systems
Wittler, O.; Schacht, R.; Wunderle, B.; Michel, B. | Conference Paper |
| 2005 | Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Journal Article, Conference Paper |
| 2004 | Bruchmechanische Analyse von viskoelastischen Werkstoffen in elektronischen Bauteilen
Wittler, O. | Dissertation |
| 2004 | Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B.; Auersperg, J.; Grosser, V.; Kaulfersch, E.; Wittler, O.; Michel, B. | Journal Article |
| 2004 | Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H. | Conference Paper |
| 2004 | Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Conference Paper |
| 2004 | Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2003 | Design process supporting simulations on wafer level packages
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Conference Paper |
| 2003 | Thermal management in stacks of MATCH-X MOEMS
Schindler-Saefkow, F.; Wittler, O.; May, D.; Schacht, R.; Großer, V.; Michel, B. | Conference Paper |
| 2003 | Thermal performance, mechanical reliability and technological features of different cooling concepts for high power chip modules
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H. | Conference Paper |
| 2001 | Fracture mechanical analysis of cracks in polymer encapsulated metal structures
Wittler, O.; Sprafke, P.; Auersperg, J.; Michel, B.; Reichl, H. | Journal Article, Conference Paper |
| 2000 | Measurement of material properties by a modified microDAC approach
Vogel, D.; Luczak, F.; Wittler, O.; Gollhardt, A.; Walter, H.; Michel, B. | Conference Paper |
| 2000 | Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications
Wittler, O.; Walter, H.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B. | Conference Paper |