Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Determination of relevant material behavior for use in stretchable electronics
Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D.
Conference Paper
2017Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O.
Journal Article
2016Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden
Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D.
Conference Paper
2016Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques
Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D.
Conference Paper
2016Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications
Weber, Constanze; Walter, Hans; Dijk, Marius van; Hutter, Matthias; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2016Ensuring system reliability of a piezoelectric energy harvester
Wittler, O.; Hölck, O.; Benecke, S.; Dobs, T.; Dijk, M. van; Keller, J.; Schulz, M.; Bittner, P.; Schlosser, I.; Vergara, F.; Yacoub, T.; Bader, V.; Braun, T.; Lang, K.-D.
Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2015Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article, Conference Paper
2015A geometry-independent lifetime modelling method for aluminum heavy wire bond joints
Grams, A.; Höfer, J.; Middendorf, A.; Schmitz, S.; Wittler, O.; Lang, K.-D.
Conference Paper
2015Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Laser cuts increase the reliability of heavy-wire bonds and enables on-line process control with thermography
Middendorf, A.; Grams, A.; Lang, K.-D.; Schmitz, S.; Wittler, O.
Conference Paper
2015Microstructural evolution of ultrasonic-bonded aluminum wires
Broll, M.S.; Geissler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.D.
Journal Article
2015Microstructural evulotion of ultrosonic-bonded aluminum wires
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.-D.
Journal Article
2015Numerical modelling in design for reliability of power modules
Grams, Arian; Schneider-Ramelow, M.; Wittler, O.; Wüst, F.
Journal Article
2014Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH)
Walter, H.; Kaltwasser, A.; Broll, M.; Huber, S.; Wittler, O.; Lang, K.-D.
Conference Paper
2014Assessment of high temperature reliability of molded smart power modules
Thomas, Tina; Becker, Karl-Friedrich; Braun, Tanja; Dijk, Marius van; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Combined Loads and Mechanisms
Wittler, Olaf; Rothe, Michael; Grams, Arian; Schmitz, Stefan; Middendorf, Andreas; Lang, Klaus-Dieter
Presentation
2014A critical review of corrosion phenomena in microelectronic systems
Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf
Conference Paper
2014Development of process and design criteria for stress management in through silicon vias
Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Establishing ecoreliability of electronic devices in manufacturing environments
Middendorf, Andreas; Benecke, Stephan; Nissen, Nils; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper, Journal Article
2014Fracture mechanics in new designed power module under thermo-mechanical loads
Durand, C.; Klingler, M.; Coutellier, D.; Naceur, H.; Grams, A.; Wittler, O.
Conference Paper
2014Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter
Conference Paper
2014Improving the FE simulation of molded packages using warpage measurements
Huber, Saskia; Van Dijk, Marius; Walter, Hans; Wittler, Olaf; Thomas, Tina; Lang, Klaus-Dieter
Conference Paper, Journal Article
2014Indentation zur Ermittlung elastisch-plastischer Werkstoffeigenschaften von metallischen Mikrostrukturen
Broll, Marian; Walter, Hans; Kaltwasser, Arved; Schauer, Kai; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Korrosionsphänomene im mikroelektronischen System
Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter
Journal Article
2014Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law
Grams, A.; Prewitz, T.; Wittler, O.; Schmitz, S.; Middendorf, A.; Lang, K.-D.
Conference Paper
2014Reliability assessment of molded smart power modules
Thomas, Tina; Lang, Klaus-Dieter; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Jörg
Conference Paper
2014Thermo-mechanical simulation of sintered Ag die attach for high temperature applications
Moreira de Sousa, Micaela; Dijk, Marius van; Walter, Hans; Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2013Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
Wunderle, B.; Heilmann, J.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Conference Paper
2013Approach for reliability of thermal interface materials in battery cell sensors
Nowak, T.; Müller, M.; Walter, H.; Hölck, O.; Wüst, F.; Wittler, O.; Lang, K.-D.
Conference Paper
2013Mechanically relevant chemical shrinkage of epoxy molding compounds
Sousa, M.F.; Hölck, O.; Braun, T.; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.D.
Conference Paper
2013Moisture induced swelling in epoxy moulding compounds
Walter, H.; Hölck, O.; Dobrinski, H.; Stuermann, J.; Braun, T.; Bauer, J.; Wittler, O.; Lang, K.D.
Conference Paper
2013Moisture transport and swelling stresses at moulding-compound substrate interfaces investigated by molecular modeling and finite element simulations
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.; Lang, K.D.
Conference Paper
2013Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
Heilmann, J.; Wunderle, B.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Conference Paper
2013Simulation of an aluminum thick wire bond fatigue crack by means of the cohesive zone method
Grams, A.; Prewitz, T.; Wittler, O.; Kripfgans, J.; Schmitz, S.; Middendorf, A.; Müller, W.H.; Lang, K.-D.
Conference Paper
2013System reliability as a key for managing complex requirements, such as robust design of microsystems
Straube, Stefan; Hahn, Daniel; Jerchel, Kathleen; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2013Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, Ole; Bauer, Jörg; Braun, Tanja; Walter, Hans; Wittler, Olaf; Wunderle, Bernhard; Lang, Klaus-Dieter
Journal Article
2012Combined reliability testing: An approach to assure reliability under complex loading conditions
Wittler, O.; Jaeschke, J.; Bochow-Ness, O.; Middendorf, A.; Lang, K.-D.
Conference Paper
2012Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.
Journal Article
2012Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Journal Article
2012Eco-reliability - a combined approach to balance environment with reliability
Nissen, Nils F.; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2012Eco-reliability as a new approach of multi-criteria optimisation
Middendorf, A.; Nissen, N.F.; Stobbe, L.; Wittler, O.; Lang, K.-D.
Conference Paper
2012Experimentelle und numerische Untersuchungen zur Lebensdauerabschätzung von Durchkontaktierungen in Leiterplatten
Schacht, R.; Nowak, T.; Walter, H.; Wunderle, B.; Abo Ras, M.; May, D.; Wittler, O.; Lang, K.-D.
Conference Paper
2012In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, B.; Wittler, O.
Conference Paper
2012Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.
Conference Paper
2011Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens
Walter, Hans; Wunderle, Bernhard; Keller, Jürgen; Hölck, Ole; Wittler, Olaf; Michel, Bernd
Conference Paper
2011Characterization of deformation properties of metals in 3D ICs
Wittler, O.; Mroßko, R.; Huber, S.; Dowhan, L.; Lang, K.-D.
Conference Paper
2011Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.
Conference Paper
2011Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Conference Paper
2011Eco-Reliability - A Fusion of GreenTech and HighTech
Nissen, N.F.; Wittler, O.; Middendorf, A.; Lang, K.-D.
Journal Article
2011Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards
Nowak, T.; Schacht, R.; Walter, H.; Wunderle, B.; Ras, M.A.; May, D.; Wittler, O.; Lang, K.-D.
Conference Paper
2011Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Lang, Klaus Dieter; Michel, Bernd; Wunderle, Bernhard
Conference Paper
2011Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods
Dowha, L.; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O.
Journal Article
2011Investigation of thin films by nanoindentation with doe and numerical methods
Dowha, .; Wymysowski, A.; Wittler, O.
Conference Paper
2011Modelling of metal degradation in power devices under active cycling conditions
Kanert, W.; Pufall, R.; Wittler, O.; Dudek, R.; Bouazza, M.
Conference Paper
2011Packaging of MEMS/MOEMS and nanodevices: Reliability, testing, and characterization aspects
Tekin, T.; Ngo, H.-D.; Wittler, O.; Bouhlal, B.; Lang, K.-D.
Conference Paper
2010Adhesion of moulding compounds on various surfaces: A study on moisture influence and degradation after high temperature storage
Pufall, R.; Goroll, M.; Bouazza, M.; Wittler, O.; Michel, B.
Conference Paper
2010Application of multi-criteria optimization algorithms to numerical material extraction of thin layers through nanoindentaion technique
Dowha, .; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O.
Conference Paper
2010Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis
Wymyslowski, A.; Dowha, L.; Wittler, O.; Mrossko, R.; Dudek, R.
Journal Article
2010Application of numerical optimization algorithms used to investigation of thin films in nanoindentation test
Dowhán, L.; Wymyslowski, A.; Wittler, O.; Mrosko, R.
Conference Paper
2010DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B.
Conference Paper
2010Hermeticity of eutectic bond layers for sensor packages on wafer-level
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Conference Paper
2010Investigation of the Reliability of Electronic Components Under Combined Loads (Vibration, Humidity, Temperature)
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B.
Conference Paper
2010Eine neue Methode zur Charakterisierung und Detektion der Degradation von Die-Attach Materialien durch In-Situ Zustandsüberwachung der thermischen Eigenschaften
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B.
Conference Paper
2010A new Method for Detection of Degradation in Die-Attach Materials by In-Situ Monitoring of Thermal Properties
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B.
Book Article
2010Novel test structures for hermeticity testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Abstract
2010Novel test structures for hermetictiy testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Conference Paper
2010Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B.
Conference Paper
2010Simulationsgestützte Zuverlässigkeitsbewertung im Mikro-Nano Übergangsbereich
Wittler, O.; Huber, S.; Mroßko, R.; Walter, H.; Auerswald, E.; Michel, B.
Conference Paper
2009Characterisation and modelling of the nanoindentation experiment in Au layers
Wittler, O.; Mrossko, R.; Huber, S.; Gollhardt, A.; Michel, B.
Conference Paper
2009Detection of degradation in die-attach materials by in-situ monitoring of thermal properties
Wittler, O.; Nejadari, A.M.; Michel, B.
Conference Paper
2009Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages
Wunderle, B.; Wittler, O.; Walter, H.; Michel, B.; Shirangi, M.H.
Conference Paper
2009Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, A.; Wittler, O.; Mrossko, R.; Dudek, R.; Auersperg, J.; Dowhan, L.
Conference Paper
2009Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H.
Journal Article
2009Verfahren und Vorrichtung zur thermischen Ueberwachung von Ausfallprozessen
Wittler, O.; Wunderle, B.; Mazloum Nejadari, S.; Schacht, R.; Michel, B.
Patent
2008Encapsulation of systems in package - process characterization and optimization
Schreier-Alt, T.; Schindler-Saefkow, F.; Wittler, O.; Kittel, H.
Conference Paper
2008Experimental Methods of Thermal Validation and Optimization for Micro-electronic Assemblies Focusing on the Non-Destructive Failure Analysis Using Passive and Active IR-Thermography
Schacht, R.; May, D.; Kreyßig, K.; Wittler, O.; Wunderle, B.; Michel, B.
Journal Article, Conference Paper
2008Mechanical Characterisation of Thin Metal Layers by Modelling of the Nanoindentation Experiment
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper
2008A method for reliability characterisation of die attach materials
Wittler, O.; Mazloum Nejadari, S.A.; Michel, B.
Conference Paper, Journal Article
2008Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Journal Article, Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Kittel, H.; Michel, B.
Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B.
Conference Paper
2008Reliability Investigations on Highly Integrated TPMS
Kaulfersch, E.; Maaike, M.; Taklo, M.M.V.; Weber, J.; Wunderle, B.; Wittler, O.; Mroßko, R.
Journal Article, Conference Paper
2007Charakterisierungsmethodik für dünne Schichten im Sub-Mikrometerbereich
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2007Design for reliability with AuSn interconnects
Dudek, R.; Wittler, O.; Faust, W.; Brämer, B.; Klein, M.; Jun, W.; Michel, B.
Conference Paper
2007Experimental characterization of thin Copper foils
Auerswald, E.; Walter, H.; Wittler, O.; Gollhardt, A.; Michel, B.
Conference Paper
2007A methodology to characterise thin films in the sub-micron range
Wittler, O.; Mroßke, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2007A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2007Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon
Wunderle, B.; Mrossko, R.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michl, B.; Reichl, H.
Conference Paper
2007Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H.
Conference Paper
2006Characterization of thermal interface materials
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.
Conference Paper
2006Characterization of thermal interface materials to support thermal simulation
Schacht, R.; May, D.; Gollhardt, A.; Wittler, O.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2006Deformation and fatigue behaviour of AuSn interconnects
Wittler, O.; Walter, H.; Dudek, R.; Faust, W.; Jun, W.; Michel, B.
Conference Paper
2006Experimentelle Charakterisierung von Thermischen Interface Materialien für die thermische Simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2006Modelling effects of packaging on pull-in behaviour of doubly-anchored beams
Lishchynska, M.; O'Mahony, C.; Slattery, O.; Wittler, O.
Conference Paper
2006Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging
Wittler, O.; Walter, H.; Keller, J.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2006Thermal management in a 3D-PCB-package with water cooling
Schindler-Saefkow, F.; Wittler, O.; May, D.; Michel, B.
Conference Paper
2005Characterization of thermal interface materials for thermal simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2005A combined simulative and experimental approach to reliability optimization of MEMS
Wittler, O.; Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2005Design methodology of microstructures for enhanced mechanical reliability
Wittler, O.; Walter, H.; Vogel, D.; Keller, J.; Michel, B.
Conference Paper
2005Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Thermal Analysis of Electronic Components and Systems
Wittler, O.; Schacht, R.; Wunderle, B.; Michel, B.
Conference Paper
2005Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Journal Article, Conference Paper
2004Bruchmechanische Analyse von viskoelastischen Werkstoffen in elektronischen Bauteilen
Wittler, O.
Dissertation
2004Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B.; Auersperg, J.; Grosser, V.; Kaulfersch, E.; Wittler, O.; Michel, B.
Journal Article
2004Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H.
Conference Paper
2004Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Conference Paper
2004Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B.
Conference Paper
2003Design process supporting simulations on wafer level packages
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Conference Paper
2003Thermal management in stacks of MATCH-X MOEMS
Schindler-Saefkow, F.; Wittler, O.; May, D.; Schacht, R.; Großer, V.; Michel, B.
Conference Paper
2003Thermal performance, mechanical reliability and technological features of different cooling concepts for high power chip modules
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H.
Conference Paper
2001Fracture mechanical analysis of cracks in polymer encapsulated metal structures
Wittler, O.; Sprafke, P.; Auersperg, J.; Michel, B.; Reichl, H.
Journal Article, Conference Paper
2000Measurement of material properties by a modified microDAC approach
Vogel, D.; Luczak, F.; Wittler, O.; Gollhardt, A.; Walter, H.; Michel, B.
Conference Paper
2000Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications
Wittler, O.; Walter, H.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B.
Conference Paper