Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Cobalt integration solutions - integration (R&D accelerator)
Gerlich, Lukas; Wislicenus, Markus; Koch, Johannes; Dhavamani, Abitha; Esmaeili, Sajjad; Uhlig, Benjamin
Presentation
2018Rapid Synthesis of Sub‐10 nm Hexagonal NaYF4‐Based Upconverting Nanoparticles using Therminol® 66
Hesse, J.; Klier, D.T.; Sgarzi, M.; Nsubuga, A.; Bauer, C.; Grenzer, J.; Hübner, R.; Wislicenus, M.; Joshi, T.; Kumke, M.U.; Stephan, H.
Journal Article
2018Understanding Electromigration in Cu-CNT Composite Interconnects
Lee, J.; Berrada, S.; Adamu-Lema, F.; Nagy, N.; Georgiev, V.P.; Sadi, T.; Liang, J.; Ramos, R.; Carrillo-Nunez, H.; Kalita, D.; Lilienthal, K.; Wislicenus, M.; Pandey, R.; Chen, B.; Teo, K.B.K.; Goncalves, G.; Okuno, H.; Uhlig, B.; Todri-Sanial, A.; Dijon, J.; Asenov, A.
Journal Article
2017Seed-layer resistance and its impact on the electrochemical copper deposition
Wislicenus, Marcus; Gerlich, Lukas; Koch, Johannes; Uhlig, Benjamin
Presentation
2017A survey of carbon nanotube interconnects for energy efficient integrated circuits
Todri-Sanial, A.; Ramos, R.; Okuno, H.; Dijon, J.; Dhavamani, A.; Wislicenus, M.; Lilienthal, K.; Uhlig, B.; Sadi, T.; Georgiev, V.; Asenov, A.; Amoroso, S.; Pender, A.; Brown, A.; Millar, C.; Motzfeld, F.; Gotsmann, B.; Liang, J.; Goncalves, G.; Rupesinghe, N.; Teo, K.
Journal Article
2016CVD-CoXN for advanced semiconductor metallization
Dhavamani, Abitha; Wislicenus, Marcus; Gerlich, Lukas; Uhlig, Benjamin
Presentation
2016The influence of adsorption kinetics on copper superfilling for dual damascene
Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel
Journal Article
2015Cobalt advanced barrier metallization: A resistivity composition analysis
Wislicenus, M.; Liske, R.; Gerlich, L.; Vasilev, B.; Preusse, A.
Journal Article, Conference Paper
2015Organosilane Downstream Plasma On Ultra Low-k Dielectrics: Comparing Repair With Post Etch Treatment
Calvo, J.; Steinke, P.; Wislicenus, M.; Gerlich, L.; Seidel, R.; Clauss, E.; Uhlig, B.
Conference Paper
2015Theory of co-adsorption and its application to copper superfilling
Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel
Presentation
2014CMP process development for Cobalt liner integration at the 28-nm-node
Koch, J.; Bott, S.; Wislicenus, M.; Krause, R.; Gerlich, L.; Uhlig, B.; Liske, R.; Vasilev, B.; Preusse, A.
Conference Paper
2014Cobalt advanced barrier metallization: A resist composition analysis
Wislicenus, Marcus; Liske, Romy; Gerlich, Lukas; Vasilev, Boris; Preusse, Axel
Conference Paper