Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Electrical Characterization of Low Temperature PECVD Oxides for TSV Applications
Mackowiak, Piotr; Abdallah, Rachid; Wilke, Martin; Patel, Jash; Ashraf, Huma; Buchanan, Keith; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Ngo, Ha-Duong
Journal Article
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga
Patent
2016BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei
Conference Paper
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, Markus; Juergensen, Nils; Lutz, Mario; Wilke, Martin; Duan, Xiaomin; Ndip, Ivan; Töpper, Michael; Lang, Klaus-Dieter
Conference Paper
2016Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B.
Dissertation
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, Charles-Alix; Zoschke, Kai; Wilke, Martin; Oppermann, Hermann; Ruffieux, David; Piazza, Silvio dalla; Suni, Tommi; Dekker, James; Allegato, Giorgio; Lang, Klaus-Dieter
Conference Paper
2015Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Oppermann, Hermann; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Piazza, S. dalla; Allegato, G.; Lang, Klaus-Dieter
Conference Paper
2015Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.
Conference Paper
2013Verfahren zum Herstellen einer Beschichtung eines Substrats
Wilke, Martin; Töpper, Michael
Patent
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael
Journal Article