Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga
Patent
2016BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei
Conference Paper
2016Development of edgeless TSV X-ray detectors
Sarajlic, M.; Zhang, J.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Wilke, M.; Zoschke, K.; Graafsma, H.
Journal Article, Conference Paper
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D.
Conference Paper
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B.
Dissertation
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, C.-A.; Zoschke, K.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.; Lang, K.-D.
Conference Paper
2015Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, K.; Manier, C.-A.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Conference Paper
2015Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.
Conference Paper
2014Advanced packaging methods for high-power LED modules
Jordan, R.C.; Weber, C.; Ehrhardt, C.; Wilke, M.
Conference Paper
2014Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, K.; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.
Conference Paper
2013Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Conference Paper
2013Verfahren zum Herstellen einer Beschichtung eines Substrats
Wilke, Martin; Töpper, Michael
Patent
2012Coating techniques for 3D-packaging applications
Töpper, M.; Wilke, M.; Röder, J.; Fischer, T.; Lopper, C.
Conference Paper
2012Development of rechargeable micro batteries based on micro channel structures
Hahn, R.; Höppner, K.; Marquardt, K.; Eisenreich, M.; Ferch, M.; Wilke, M.; Lang, K.-D.
Conference Paper
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael
Journal Article
2012Innovation Driver of the Next Decade: Technology Follows Application
Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M.
Book Article
2012Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Barth, R.; Knoll, D.; Korndorfer, F.; Scholz, R.; Schulz, K.; Wipf, C.; Tillack, B.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Ulusoy, A.C.; Purtova, T.; Liu, G.; Schumacher, H.
Conference Paper
2012Process modeling of dry etching for the 3D-integration with tapered TSVs
Wilke, M.; Töpper, M.; Huynh, H.Q.; Lang, K.D.
Conference Paper
2012RF-MEMS switch module in a 0.25 µm BiCMOS technology
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Scholz, R.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Elkhouly, M.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Mühlhaus, V.; Liu, G.; Purtova, T.; Ulusoy, A.C.; Schumacher, H.; Tillack, B.
Conference Paper
2012Silicon integrated micro batteries based on deep reactive ion etching and through silicon via technologies
Hahn, R.; Marquardt, K.; Thunman, M.; Töpper, M.; Wilke, M.; Ferch, M.; Huynh, Q.H.; Lang, K.D.
Conference Paper
2011Prospects and limits in wafer-level-packaging of image sensors
Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D.
Conference Paper
2011TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.
Conference Paper
2010Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
Zoschke, K.; Wegner, M.; Wilke, M.; Jürgensen, N.; Lopper, C.; Kuna, I.; Glaw, V.; Röder, J.; Wünsch, O.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Hahn, R.; Marquardt, K.; Blechert, M.; Lehmann, M.; Töpper, M.; Wilke, M.; Semionyk, P.; Reichl, H.
Conference Paper
2007Electromagnetic compatibility of two novel packaging concepts of an inductively powered neural interface
Kim, S.; Wilke, M.; Klein, M.; Toepper, M.; Solzbacher, F.
Conference Paper
2007Packaging concepts for neuroprosthetic implants
Töpper, M.; Klein, M.; Wilke, M.; Oppermann, H.; Kim, S.; Tathireddy, P.; Solzbacher, F.; Reichl, H.
Conference Paper