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| 2012 | FEM stress analysis in BGA components subjected to JEDEC drop test applying high strain rate lead-free solder material models
Kraemer, F.; Meier, K.; Wiese, S.; Rzepka, S. | Conference Paper |
| 2011 | The creep behaviour and microstructure of ultra small solder joints
Wiese, S.; Mueller, M.; Panchenko, I.; Metasch, R.; Wolter, K.-J. | Conference Paper |
| 2011 | Mechanical problems of manufacturing processes for photovoltaic modules
Wiese, S.; Kraemer, F.; Meier, R.; Schindler, S. | Conference Paper |
| 2011 | Solidification processes in the Sn-rich part of the SnCu system
Panchenko, I.; Mueller, M.; Wiese, S.; Schindler, S.; Wolter, K.-J. | Conference Paper |
| 2011 | Solidification processes of SnCu, SnAg and SnAgCu solder alloys and interface reactions to charactize solar cell interconnections processes
Schindler, S.; Wiese, S. | Conference Paper |
| 2010 | BGA lifetime prediction in JEDEC drop tests accounting for copper trace routing effects
Kraemer, F.; Wiese, S.; Rzepka, S.; Lienig, J. | Conference Paper |
| 2010 | Characterisation of the mechanical behaviour of SAC solder at high strain rates
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J. | Conference Paper |
| 2010 | A detailed investigation of the failure formation of copper trace cracks during drop tests
Kraemer, F.; Wiese, S.; Rzepka, S.; Faust, W.; Lienig, J. | Conference Paper |
| 2010 | The effect of copper trace routing on the drop test reliability of BGA modules
Kraemer, F.; Rzepka, S.; Wiese, S.; Lienig, J. | Conference Paper |
| 2010 | Interconnection technologies for photovoltaic modules - analysis of technological and mechanical problems
Wiese, S.; Kraemer, F.; Betzl, N.; Wald, D. | Conference Paper |
| 2010 | Investigation of wettability and interface reactions of Sn-Pb, Sn-Cu, Sn-Ag and Sn-Ag-Cu solders for solar cell interconnections
Schindler, S.; Wiese, S. | Conference Paper |
| 2010 | Mechanical behaviour and fatigue of copper ribbons used as solar cell interconnectors
Wiese, S.; Meier, R.; Kraemer, F. | Conference Paper |
| 2010 | Mechanical behaviour of typical lead-free solders at high strain rate conditions
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J. | Conference Paper |
| 2010 | Mechanical solder characterisation under high strain rate conditions
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J. | Conference Paper |
| 2010 | The packaging technologies for photovoltaic modules - technological challenges and mechanical integrity
Wiese, S.; Kraemer, F.; Betzl, N.; Wald, D. | Conference Paper |
| 2010 | Rate dependent mechanical behaviour of SAC solder in fast tensile experiments
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J. | Conference Paper |
| 2010 | Realistic stress representation in 2nd level interconnections of productive BGA components during drop test simulations
Kraemer, F.; Rzepka, S.; Wiese, S.; Lienig, J. | Conference Paper |
| 2010 | Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J. | Conference Paper |
| 2010 | The scaling effect on microstructure and creep properties of Sn-based solders
Wiese, S.; Mueller, M.; Panchenko, I.; Metasch, R.; Roellig, M.; Wolter, K.-J. | Conference Paper |
| 2010 | Thermal cycling induced load on copper-ribbons in crystalline photovoltaic modules
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J. | Conference Paper |
| 2009 | Combining experimental and simulation methods for the mechanical characterisation of lead free solder alloys under high strain rate loads
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J. | Conference Paper |
| 2009 | Constitutive behaviour of copper ribbons used in solar cell assembly processes
Wiese, S.; Meier, R.; Kraemer, F.; Bagdahn, J. | Conference Paper |
| 2009 | Mechanical characterisation of Lead free solder alloys under high strain rate loads
Meier, K.; Wiese, S.; Roellig, M.; Wolter, K.-J. | Conference Paper |
| 2009 | Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens
Metasch, R.; Boareto, J.C.; Röllig, M.; Wiese, S.; Wolter, K.-J. | Conference Paper |
| 2009 | The twinning phenomenon in SnAgCu solder balls
Mueller, M.; Wiese, S.; Wolter, K.-J. | Conference Paper |
| 2008 | Scaling effects on grain size and texture of lead free interconnects - investigations by electron backscatter diffraction and nanoindentation
Krause, M.; Müller, M.; Petzold, M.; Wiese, S.; Wolter, K.-J. | Conference Paper |
| 2007 | Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B. | Journal Article |
| 2007 | Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditions
Dudek, R.; Faust, W.; Wiese, S.; Röllig, M.; Michel, B. | Conference Paper |
| 2007 | The size effect on the creep properties of SnAgCu-solder alloys
Wiese, S.; Roellig, M.; Mueller, M.; Wolter, K.-J.; Bennemann, S.; Petzold, M. | Conference Paper |
| 2006 | Analytical and mechanical methods for material property investigations of SnAgCu-solder
Petzold, M.; Bennemann, S.; Graff, A.; Krause, M.; Müller, M.; Wiese, S.; Wolter, K.-J. | Conference Paper |
| 2006 | Compositional effects on the creep properties of SnAgCu solder
Wiese, S.; Krämer, F.; Müller, M.; Röllig, M.; Wolter, K.-J.; Krause, M.; Bennemann, S.; Petzold, M. | Conference Paper |
| 2006 | Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B. | Conference Paper |
| 2005 | Novell test concept for experimental lifetime prediction of miniaturized lead-free solder
Röllig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B. | Conference Paper |
| 2001 | Constitution behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints
Wiese, S.; Schubert, A.; Walter, H.; Dudek, R.; Meusel, E.; Michel, B. | Conference Paper |
| 1997 | Load free determination of the coefficient of thermal expansion of polymer foils
Feustel, F.; Vogel, D.; Wiese, S. | Conference Paper |
| 1996 | Critical use conditions and their effect on the reliability of soldered interconncects in under the hood application
Ahrens, T.; Wulff, F.W.; Wiese, S.; Nitopi, L. | Conference Paper |