Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20183D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M.
Conference Paper
2018Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Towards Microsystems Application
Al Farisi, M.S.; Hertel, S.; Wiemer, M.; Otto, T.
Journal Article
2018Electrochemical deposition of reactive material systems for assembly and packaging applications
Hertel, Silvia; Schulte, Wiebke; Weiser, Mathias; Becker, Mike; Wiemer, Maik; Otto, Thomas
Conference Paper
2018Elektrochemische Abscheidung für die Leiterplatte
Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S.
Conference Paper
2018Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S.
Conference Paper
2018An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization
Baum, M.; Saeidi, N.; Vogel, K.; Schroeder, T.; Selvam, K.G.M.; Wiemer, M.; Otto, T.
Conference Paper
2018Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors
Zeiner, C.; Polomoshnov, M.; Müller, M.; Sowade, E.; Günther, A.; Neumann, N.; Seifert, T.; Blaudeck, T.; Hermann, S.; Baumann, R.R.; Wiemer, M.; Otto, T.
Conference Paper
2018Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application
Farisi, M.S.A.; Hertel, S.; Wiemer, M.; Otto, T.
Conference Paper
2018Parylene as a Dielectric Material for Electronic Applications in Space
Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T.
Conference Paper
2018Reactive bonding with oxide based reactive multilayers
Vogel, K.; Roscher, F.; Wiemer, M.; Zimmermann, S.; Otto, T.
Conference Paper
20173D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T.
Journal Article, Conference Paper
20173D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael
Conference Paper
2017Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T.
Journal Article
2017Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel
Hofmann, C.; Kurth, F.; Wiemer, M.; Otto, T.; Hiller, K.
Conference Paper
2017Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas
Conference Paper
2017Integration of self-healing agent into MEMS bonding frames
Kurth, F.; Hofmann, C.; Hertel, S.; Braun, P.; Schroeder, T.J.; Wiemer, M.
Conference Paper
2017Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T.
Conference Paper
2017Overview on an implantable multi sensor system for cardiovascular monitoring
Görtz, Michael; Grabmaier, Anton; Wiemer, Maik; Storsberg, Joachim; Duschl, Claus; Vom Bögel, Gerd
Journal Article, Conference Paper
2017Prüfvorrichtung und Verfahren zur Ermittlung einer Abreißfestigkeit
Roscher, Frank; Vogel, Klaus; Wiemer, Maik; Bräuer, Jörg; Schade, Dirk
Patent
2017Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael
Journal Article, Conference Paper
2017Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T.
Conference Paper
20163D integration technologies for MEMS
Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S.
Conference Paper
2016Array-type miniature interferometer as the core optical microsystem of an optical coherence tomography device for tissue inspection
Passilly, N.; Perrin, S.; Lullin, J.; Albero, J.; Bargiel, S.; Froehly, L.; Gorecki, C.; Krauter, J.; Osten, W.; Wang, W.-S.; Wiemer, M.
Conference Paper
2016Centrifugation of micro particles and self-assembly of nano particles by capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Wang, W.-S.; Wiemer, M.
Conference Paper
2016Concept for a miniaturized cardiovascular multi sensor implant
Dogan, Özgü; Weidenmüller, Jens; Gembaczka, Pierre; Stanitzki, Alexander; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Görtz, Michael
Abstract
2016Deposition of parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2016A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system
Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü
Abstract
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding
Tanaka, K.; Wang, W.-S.; Baum, M.; Froemel, J.; Hirano, H.; Tanaka, S.; Wiemer, M.; Otto, T.
Journal Article
2016Low temperature thermo compression bonding with printed intermediate bonding layers
Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T.
Conference Paper
2016A new approach for 3D Integration based on printed multilayers and through polymer vias
Roscher, F.; Saeidi, N.; Enderlein, T.; Selbmann, F.; Wiemer, M.; Gessner, T.
Conference Paper
2016Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2016Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding
Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C.
Conference Paper
2015Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing
Seifert, T.; Sowade, E.; Roscher, F.; Wiemer, M.; Gessner, T.; Baumann, R.R.
Journal Article
2015Aerosol jet printing of nano particle based electrical chip interconnects
Seifert, T.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2015Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application
Vogel, K.; Wiemer, M.; Gessner, T.; Vogel, J.; Lin, Y.-C.; Tsai, Y.-C.; Esashi, M.; Tanaka, S.
Conference Paper
2015Fügeverfahren, Material- oder Phasentransformationsverfahren, Sicherungsverfahren, Fügemittel und Sicherheitssystem unter Verwendung reaktiver Materialsysteme
Bräuer, Jörg; Besser, Jan; Roscher, Frank; Seifert, Tobias; Wiemer, Maik
Patent
2015Low-temperature wafer bonding using solid-liquid inter-diffusion mechanism
Froemel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Journal Article
2015Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems
Baranski, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Jia, C.P.; Frömel, J.; Wiemer, M.
Journal Article
2015Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer
Wang, W.S.; Lullin, J.; Froemel, J.; Wiemer, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Gessner, T.
Conference Paper
2015Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Bodny, F.; Wiemer, M.; Gessner, T.; Brunschwiler, T.; Zürcher, J.; Burg, B.R.; Zimmermann, S.
Conference Paper
2015Technological platform for vertical multi-wafer integration of miniature imaging instruments
Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S.
Conference Paper
2014Ceramic wafer bonding for vertically integrated MEMS
Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2014Fügen mit iRMS: Eine neue Raumtemperatur - Aufbau- und Verbindungstechnik in der Informationstechnik
Bräuer, J.; Besser, J.; Schneider, W.; Wiemer, M.; Gessner, T.
Conference Paper
2014Functional nano patterns realized by aligned nano imprint lithography
Baum, M.; Besser, J.; Wiemer, M.; Thanner, C.; Kreindl, G.; Wimplinger, M.; Gessner, T.
Conference Paper
2014Implantable MEMS sensors and medical MEMS packaging issues for future implants
Baum, M.; Haubold, M.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2014Improvement of copper bonding by analyzing the mechanical properties of the bond interface
Vogel, K.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Book Article
2014Introducing aerosol-jet printing as semiconductor and MEMS fabrication process
Roscher, F.; Seifert, T.; Wiemer, M.
Book Article
2014Investigation of low temperature wafer bonding using plasma activation
Wünsch, D.; Hofmann, C.; Bräuer, J.; Wiemer, M.; Gessner, T.
Book Article
2014Investigation of reactive and nano scale material systems for room-temperature reactive wafer bonding
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Book Article
2014Mechanical characterization of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Conference Paper
2014Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.
Journal Article
2014Overview of wafer bonding and characterization of the bonded interface
Vogel, K.; Haubold, M.; Wiemer, M.; Gessner, T.
Book Article
2014Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-art and future development trends
Braeuer, J.; Besser, J.; Hertel, S.; Masser, R.; Schneider, W.; Wiemer, M.; Gessner, T.
Conference Paper
2014Solid Liquid Inter-Diffusion Bonding at Low Temperature
Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2014Thermocompression bonding of semiconductor wafers
Frömel, J.; Baum, M.; Wiemer, M.
Book Article
2014Wafer bonding technologies for 3D integration
Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T.
Conference Paper
2014Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate
Baranski, M.; Bargiel, S.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Journal Article