Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20183D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M.
Conference Paper
2018Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Towards Microsystems Application
Al Farisi, M.S.; Hertel, S.; Wiemer, M.; Otto, T.
Journal Article
2018Electrochemical deposition of reactive material systems for assembly and packaging applications
Hertel, Silvia; Schulte, Wiebke; Weiser, Mathias; Becker, Mike; Wiemer, Maik; Otto, Thomas
Conference Paper
2018Elektrochemische Abscheidung für die Leiterplatte
Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S.
Conference Paper
2018Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S.
Conference Paper
2018An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization
Baum, M.; Saeidi, N.; Vogel, K.; Schroeder, T.; Selvam, K.G.M.; Wiemer, M.; Otto, T.
Conference Paper
2018Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors
Zeiner, C.; Polomoshnov, M.; Müller, M.; Sowade, E.; Günther, A.; Neumann, N.; Seifert, T.; Blaudeck, T.; Hermann, S.; Baumann, R.R.; Wiemer, M.; Otto, T.
Conference Paper
2018Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application
Farisi, M.S.A.; Hertel, S.; Wiemer, M.; Otto, T.
Conference Paper
2018Parylene as a Dielectric Material for Electronic Applications in Space
Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T.
Conference Paper
2018Reactive bonding with oxide based reactive multilayers
Vogel, K.; Roscher, F.; Wiemer, M.; Zimmermann, S.; Otto, T.
Conference Paper
20173D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T.
Journal Article, Conference Paper
20173D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael
Conference Paper
2017Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T.
Journal Article
2017Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel
Hofmann, C.; Kurth, F.; Wiemer, M.; Otto, T.; Hiller, K.
Conference Paper
2017Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas
Conference Paper
2017Integration of self-healing agent into MEMS bonding frames
Kurth, F.; Hofmann, C.; Hertel, S.; Braun, P.; Schroeder, T.J.; Wiemer, M.
Conference Paper
2017Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T.
Conference Paper
2017Overview on an implantable multi sensor system for cardiovascular monitoring
Görtz, Michael; Grabmaier, Anton; Wiemer, Maik; Storsberg, Joachim; Duschl, Claus; Vom Bögel, Gerd
Journal Article, Conference Paper
2017Prüfvorrichtung und Verfahren zur Ermittlung einer Abreißfestigkeit
Roscher, Frank; Vogel, Klaus; Wiemer, Maik; Bräuer, Jörg; Schade, Dirk
Patent
2017Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael
Journal Article, Conference Paper
2017Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T.
Conference Paper
20163D integration technologies for MEMS
Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S.
Conference Paper
2016Array-type miniature interferometer as the core optical microsystem of an optical coherence tomography device for tissue inspection
Passilly, N.; Perrin, S.; Lullin, J.; Albero, J.; Bargiel, S.; Froehly, L.; Gorecki, C.; Krauter, J.; Osten, W.; Wang, W.-S.; Wiemer, M.
Conference Paper
2016Centrifugation of micro particles and self-assembly of nano particles by capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Wang, W.-S.; Wiemer, M.
Conference Paper
2016Concept for a miniaturized cardiovascular multi sensor implant
Dogan, Özgü; Weidenmüller, Jens; Gembaczka, Pierre; Stanitzki, Alexander; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Görtz, Michael
Abstract
2016Deposition of parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2016A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system
Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü
Abstract
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding
Tanaka, K.; Wang, W.-S.; Baum, M.; Froemel, J.; Hirano, H.; Tanaka, S.; Wiemer, M.; Otto, T.
Journal Article
2016Low temperature thermo compression bonding with printed intermediate bonding layers
Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T.
Conference Paper
2016A new approach for 3D Integration based on printed multilayers and through polymer vias
Roscher, F.; Saeidi, N.; Enderlein, T.; Selbmann, F.; Wiemer, M.; Gessner, T.
Conference Paper
2016Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2016Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding
Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C.
Conference Paper
2015Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing
Seifert, T.; Sowade, E.; Roscher, F.; Wiemer, M.; Gessner, T.; Baumann, R.R.
Journal Article
2015Aerosol jet printing of nano particle based electrical chip interconnects
Seifert, T.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2015Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application
Vogel, K.; Wiemer, M.; Gessner, T.; Vogel, J.; Lin, Y.-C.; Tsai, Y.-C.; Esashi, M.; Tanaka, S.
Conference Paper
2015Fügeverfahren, Material- oder Phasentransformationsverfahren, Sicherungsverfahren, Fügemittel und Sicherheitssystem unter Verwendung reaktiver Materialsysteme
Bräuer, Jörg; Besser, Jan; Roscher, Frank; Seifert, Tobias; Wiemer, Maik
Patent
2015Low-temperature wafer bonding using solid-liquid inter-diffusion mechanism
Froemel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Journal Article
2015Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems
Baranski, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Jia, C.P.; Frömel, J.; Wiemer, M.
Journal Article
2015Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer
Wang, W.S.; Lullin, J.; Froemel, J.; Wiemer, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Gessner, T.
Conference Paper
2015Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Bodny, F.; Wiemer, M.; Gessner, T.; Brunschwiler, T.; Zürcher, J.; Burg, B.R.; Zimmermann, S.
Conference Paper
2015Technological platform for vertical multi-wafer integration of miniature imaging instruments
Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S.
Conference Paper
2014Ceramic wafer bonding for vertically integrated MEMS
Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2014Fügen mit iRMS: Eine neue Raumtemperatur - Aufbau- und Verbindungstechnik in der Informationstechnik
Bräuer, J.; Besser, J.; Schneider, W.; Wiemer, M.; Gessner, T.
Conference Paper
2014Functional nano patterns realized by aligned nano imprint lithography
Baum, M.; Besser, J.; Wiemer, M.; Thanner, C.; Kreindl, G.; Wimplinger, M.; Gessner, T.
Conference Paper
2014Implantable MEMS sensors and medical MEMS packaging issues for future implants
Baum, M.; Haubold, M.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2014Improvement of copper bonding by analyzing the mechanical properties of the bond interface
Vogel, K.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Book Article
2014Introducing aerosol-jet printing as semiconductor and MEMS fabrication process
Roscher, F.; Seifert, T.; Wiemer, M.
Book Article
2014Investigation of low temperature wafer bonding using plasma activation
Wünsch, D.; Hofmann, C.; Bräuer, J.; Wiemer, M.; Gessner, T.
Book Article
2014Investigation of reactive and nano scale material systems for room-temperature reactive wafer bonding
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Book Article
2014Mechanical characterization of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Conference Paper
2014Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.
Journal Article
2014Overview of wafer bonding and characterization of the bonded interface
Vogel, K.; Haubold, M.; Wiemer, M.; Gessner, T.
Book Article
2014Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-art and future development trends
Braeuer, J.; Besser, J.; Hertel, S.; Masser, R.; Schneider, W.; Wiemer, M.; Gessner, T.
Conference Paper
2014Solid Liquid Inter-Diffusion Bonding at Low Temperature
Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2014Thermocompression bonding of semiconductor wafers
Frömel, J.; Baum, M.; Wiemer, M.
Book Article
2014Wafer bonding technologies for 3D integration
Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T.
Conference Paper
2014Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate
Baranski, M.; Bargiel, S.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Journal Article
20133D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding
Hofmann, L.; Baum, M.; Schulz, S.E.; Wiemer, M.; Geßner, T.
Conference Paper
20133D micro-optical lens scanner made by multi-wafer bonding technology
Bargiel, S.; Gorecki, C.; Baranski, M.; Passilly, N.; Wiemer, M.; Jia, C.; Frömel, J.
Conference Paper
2013Aluminum-germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes
Goßler, C.; Kunzer, M.; Baum, M.; Wiemer, M.; Moser, R.; Passow, T.; Köhler, K.; Schwarz, U.T.; Wagner, J.
Journal Article
2013Biocompatibility evaluation of MEMS packaging materials for implantable devices
Baum, M.; Haubold, M.; Besser, J.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2013Development and characterisation of 3D integration technologies for MEMS based on copper filled TSVs and copper-to-copper metal thermo compression bonding
Baum, M.; Hofmann, L.; Wiemer, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2013Energy efficiency enhancements for semiconductors, communications, sensors and software achieved in cool silicon cluster project
Ellinger, F.; Mikolajick, T.; Fettweis, G.; Hentschel, D.; Kolodinski, S.; Warnecke, H.; Reppe, T.; Tzschoppe, C.; Dohl, J.; Carta, C.; Fritsche, D.; Tretter, G.; Wiatr, M.; Kronholz, S.D.; Mikalo, R.P.; Heinrich, H.; Paulo, R.; Wolf, R.; Hübner, J.; Waltsgott, J.; Meißner, K.; Richter, R.; Michler, O.; Bausinger, M.; Mehlich, H.; Hahmann, M.; Möller, H.; Wiemer, M.; Holland, H.-J.; Gärtner, R.; Schubert, S.; Richter, A.; Strobel, A.; Fehske, A.; Cech, S.; Aßmann, U.; Pawlak, A.; Schröter, M.; Finger, W.; Schumann, S.; Höppner, S.; Walter, D.; Eisenreich, H.; Schüffny, R.
Journal Article
2013Integrated smart systems for theranostic applications
Haubold, M.; Baum, M.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2013Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Wiemer, M.; Wuensch, D.; Froemel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passily, N.; Gorecki, C.
Conference Paper
2013A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers
Roschner, F.; Otto, A.; Döring, R.; Ihle, M.; Ziesche, S.; Rzepka, S.; Wiemer, M.
Conference Paper
2013Reaktives Bonden
Braeuer, J.; Freitag, A.; Dietrich, T.R.; Wiemer, M.; Gessner, T.
Conference Paper
2013Solid Liquid Interdiffusion Bonding for Micro Devices near Room Temperature
Froemel, J.; Wiemer, M.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2013TSVs mit hohem Aspektverhältnis und Kupfer-Bonden für MEMS
Hofmann, L.; Baum, M.; Gottfried, K.; Schulz, S.E.; Wiemer, M.; Gessner, T.
Conference Paper
2013Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate
Bargiel, S.; Baranski, M.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Conference Paper
2012Cool silicon ICT energy efficiency enhancements
Ellinger, F.; Mikolajik, T.; Fettweis, G.; Hentschel, D.; Kolodinski, S.; Warnecke, H.; Reppe, T.; Tzschoppe, C.; Dohl, J.; Carta, C.; Fritsche, D.; Wiatr, M.; Kronholz, S.D.; Mikalo, R.P.; Heinrich, H.; Paulo, R.; Wolf, R.; Hubner, J.; Waltsgott, J.; Meissner, K.; Richter, R.; Bausinger, M.; Mehlich, H.; Hahmann, M.; Moller, H.; Wiemer, M.; Holland, H.-J.; Gartner, R.; Schubert, S.; Richter, A.; Strobel, A.; Fehske, A.; Cech, S.; Assmann, U.; Hoppner, S.; Walter, D.; Eisenreich, H.; Schuffny, R.
Conference Paper
2012Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology
Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.; Grafe, J.
Conference Paper
2012Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung
Vogel, K.; Baum, M.; Roscher, F.; Kinner, R.; Rank, H.; Mayer, T.; Wiemer, M.; Gessner, T.
Conference Paper
2012A hierarchic bonding procedure for the assembly of micro confocal microscope
Jia, C.; Frömel, J.; Wiemer, M.; Gessner, T.; Bargiel, S.; Passilly, N.; Baraski, M.; Gorecki, C.
Conference Paper
2012Influence of test speed on the bonding strength of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Abstract
2012Integrated nano scale multilayer systems for reactive bonding in microsystems technology
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012Investigation of different nano scale energetic material systems for reactive wafer bonding
Braeuer, J.; Besser, J.; Tomoscheit, E.; Klimm, D.; Anbumani, S.; Wiemer, M.; Gessner, T.
Conference Paper
2012Laser micromachining and micro hot embossing for highly integrated lab-on-chip systems
Enderlein, T.; Baum, M.; Nestler, J.; Otto, T.; Besser, J.; Wiemer, M.; John, B.; Hänel, J.; Gessner, T.
Conference Paper
2012Low temperature metal interdiffusion bonding for micro devices
Frömel, J.; Lin, Y.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2012Micro hot embossing and micro laser welding technologies for fluidic applications
Baum, M.; Besser, J.; John, B.; Keiper, B.; Hänel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface
Haubold, M.; Lin, Y.; Frömel, J.; Wiemer, M.; Esashi, M.; Geßner, T.
Journal Article
2012Novel nano-scale energetic systems for low-temperature and stress-free joining of dissimilar materials
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012A novel technique for MEMS packaging: Reactive bonding with integrated material systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2012Plasma activated bonding of the heterogeneous material combinations LiTaO3/Si and poly-Si/SiO2
Wuensch, D.; Braeuer, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012Plasma-activated bonding
Wiemer, M.; Wuensch, D.; Braeuer, J.; Gessner, T.
Book Article
2012Sensormodul und Verfahren zum Herstellen eines Sensormoduls
Roscher, F.; Baum, M.; Wiemer, M.; Geßner, T.; Gebhardt, C.
Patent
2012Si interposer technologies for three dimensional AMR sensor systems
Raukopf, S.; Gebhardt, C.; Roscher, F.; Baum, M.; Kinner, R.; Wiemer, M.; Gessner, T.
Conference Paper
2012Smart Systems for Different Applications from Fraunhofer ENAS
Vogel, M.; Braeuer, J.; Wiemer, M.; Nestler, J.; Kurth, S.; Otto, T.; Gessner, T.
Book Article
2012Thermal and UV nanoimprint lithography for applications from the micro to the nano scale
Besser, J.; Baum, M.; Wiemer, M.; Gessner, T.; Sanchez-Ordonez,S.; Thanner, C.; Vetter, C.
Conference Paper
2012Using of Different Nano Scale Energetic Material Systems for Reactive Bonding
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Abstract
2012Vertical integration technologies for optical transmissive 3-D microscanner based on glass microlenses
Bargiel, S.; Jia, C.; Baranski, M.; Frömel, J.; Passilly, N.; Gorecki, C.; Wiemer, M.
Journal Article, Conference Paper
20113D Integration for MEMS devices using photosenitive glass
Wuensch, D.; Hofmann,Ch.; Besser, J.; Schubert, I.; Gottfried, K.; Wiemer, M.; Gessner, T.
Conference Paper
2011Aerosol jet as a deposition method for conductive layers in micro- system-technology using nanoparticle inks
Müller, M.; Roscher, F.; Sowade, E.; Seifert, T.; Wiemer, M.; Gessner, T.; Baumann, R.R.
Conference Paper
2011Aluminum-germanium wafer bonding of (AlGaIn)N thin film light-emitting diodes
Gossler, C.; Kunzer, M.; Baum, M.; Wiemer, M.; Moser, R.; Passow, T.; Koehler, K.; Schwarz, U.T.; Wagner, J.
Abstract
2011Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers
Vogel, K.; Wuensch, D.; Shaporin, A.; Mehner, J.; Billep, D.; Wiemer, M.
Journal Article
2011Developement trends in the field of wafer bonding technologies
Wiemer, M.; Braeuer, J.; Besser, J.; Wuensch, D.
Conference Paper
2011Elektrochemische Abscheidung von Pd/Zn-Multilagen für das Fügen mit reaktiven Materialsystemen
Besser, J.; Bräuer, J.; Wiemer, M.; Geßner, T.
Conference Paper
2011Entwicklung einer Verkappungstechnologie für optisch transparente MEMS/NEMS-Gehäuse mit niedrigem Temperatureintrag
Haubold, M.; Leidich, S.; Wiemer, M.; Geßner, T.; Schubert, I.
Conference Paper
2011FEM simulation and its application in MEMS design
Jia, C.; Reuter, D.; Wen, Z.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2011Investigations of thermocompression bonding with thin metal layers
Froemel, J.; Baum, M.; Wiemer, M.; Roscher, F.; Haubold, M.; Jia, C.; Gessner, T.
Conference Paper
2011Low temperature wafer bonding technologies
Haubold, M.; Baum, M.; Schubert, I.; Leidich, S.; Wiemer, M.; Gessner, T.
Conference Paper
2011Mechanical and electrical packaging technologies by the application of functional layers at micro and nano scale
Haubold, M.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2011Metal thermo compression bonding at wafer level and its capabilities for 3D integration
Baum, M.; Roscher, F.; Froemel, J.; Jia, C.; Rank, H.; Hausner, R.; Reichenbach, R.; Wiemer, M.; Gessner, T.
Conference Paper
2011Nano patterned surfaces and their influence on living cells
Baum, M.; Besser, J.; Vetter, C.; Sanchez Ordonez, S.; Wang, X.; Harazim, S.; Schmidt, O.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2011Nano scale AL/PD multilayer systems for reactive bonding in microsystems technology
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Abstract
2011New generation of electrostatic carrier technology (T-ESC) for reversible thin wafer clamping with seal glass bonding
Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.
Abstract
2011Room-temperature reactive bonding by using nano scale multilayer systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2011Room-temperature reactive bonding: An overview of integrated nano scale multilayer systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2011Si interposer technologies for three dimensional sensor systems
Roscher, F.; Baum, M.; Gebhardt, C.; Raukopf, S.; Wiemer, M.; Gessner, T.
Conference Paper
2010Aktivierung mittels Niederdruckplasma zur Herstellung von Si-Verbunden im Niedertemperatur-Bereich und deren Charakterisierung mittels Mikro-Chevron-Test
Wünsch, D.; Müller, B.; Wiemer, M.; Mischke, H.
Conference Paper
2010Eutectic wafer bonding for 3D integration
Baum, M.; Jia, C.; Haubold, M.; Wiemer, M.; Schneider, A.; Rank, H.; Trautmann, A.; Gessner, T.
Conference Paper
2010Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.; Bagdahn, J.; Gessner, T.
Journal Article
2010Low temperature wafer bonding for microsystems using dielectric barrier discharge
Wünsch, D.; Wiemer, M.; Gabriel, M.; Gessner, T.
Journal Article
2010A method for the fabrication of extra-thin silicon substrates
Jia, C.; Hiller, K.; Wiemer, M.; Reuter, D.; Gessner, T.
Conference Paper
2010Mikro- und Nanotechnologien für Smart Integrated Systems
Gessner, T.; Vogel, M.; Schulz, S.E.; Wiemer, M.; Hiller, K.; Kurth, S.
Journal Article
2010Mikrostrukturierung von dünnen Kunststofffolien durch Heißprägen
Baum, M.; Vetter, C.; Haehnel, M.; Hänel, J.; Wiemer, M.; Geßner, T.
Conference Paper
2010Nanofabrication of reactive structure for low temperature bonding
Lin, Y.; Bräuer, J.; Hofmann, L.; Baum, M.; Frömel, J.; Wiemer, M.; Esashi, M.; Gessner, T.
Conference Paper
2010Reactive bonding and low temperature bonding of heterogeneous materials
Wiemer, M.; Braeuer, J.; Wünsch, D.; Gessner, T.
Conference Paper
2010Reaktives Bonden für spannungsarmes Fügen in der Mikrosystemtechnik
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.
Journal Article
2010Reaktives Fügen löst Temperaturprobleme
Braeuer, J.; Wiemer, M.; Gessner, T.
Journal Article
2010Selbstausbreitende exotherme Reaktionen als interne Wärmequelle für die Aufbau- und Verbindungstechnik von Mikrosystemen
Bräuer, J.; Böttge, B.; Wiemer, M.; Petzold, M.; Gessner, T.
Conference Paper
2010Smart Integrated Systems - Developments of Fraunhofer ENAS
Vogel, M.; Hiller, K.; Bertz, A.; Wiemer, M.; Gessner, T.
Book Article
2009Characterization of eutectic wafer bonding using gold and silicon
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Development and evaluation of AuSi eutectic wafer bonding
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Hermetic thin film encapsulation of mechanical transducers for smart label applications
Reuter, D.; Nowack, M.; Rennau, M.; Bertz, A.; Wiemer, M.; Kriebel, F.; Gessner, T.
Conference Paper
2009Herstellung und Evaluierung nanoskaliger reaktiver Strukturen für den Einsatz von Niedertemperatur-Bondverfahren in der Mikrosystemtechnik
Bräuer, J.; Hofmann, L.; Wiemer, M.; Gessner, T.
Conference Paper
2009Integration of inertial MEMS sensors in active smart RFID labels for transport monitoring
Reuter, D.; Nowack, M.; Bertz, A.; Wiemer, M.; Semar, R.; Kriebel, F.; Hopp, K.-F.; Dittrich, S.; Thieme, T.
Conference Paper
2009Low temperature bonding of hetero-materials using ambient pressure plasma activation
Wiemer, M.; Wünsch, D.; Bräuer, J.; Eichler, M.; Hennecke, P.; Gessner, T.
Conference Paper
2009Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem
Baum, M.; Bräuer, J.; Gessner, T.; Hofmann, L.; Froemel, J.; Letsch, H.; Wiemer, M.
Patent
2009New bonding technologies for MEMS
Wiemer, M.; Frömel, J.; Jia, C.; Gessner, T.
Book Article
2009A novel method for the fabrication of deep-submicron structure
Jia, C.; Wiemer, M.; Grunert, J.; Otto, T.; Gessner, T.
Conference Paper
2009Process development for smart systems integration in MEMS
Ecke, R.; Frömel, J.; Schulz, S.E.; Wiemer, M.; Gessner, T.
Journal Article
2009Reaktives Mikrofügen unter Ausnutzung nanoskaliger Effekte
Bräuer, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2009Smart systems integration by using micro and nano technologies
Gessner, T.; Wiemer, M.; Bertz, A.; Vogel, M.
Journal Article
2009Solid-Liquid-Interdiffusion Bonding für 3D-Integration und Wafer-Level-Packaging
Baum, M.; Hofmann, L.; Wiemer, M.; Gessner, T.
Conference Paper
2009Thermo compression bonding with gold interfaces
Frömel, J.; Haubold, M.; Wiemer, M.; Gessner, T.
Conference Paper
2009Trends in 3D Integration of MEMS and Electronics
Wiemer, M.; Braeuer, J.; Besser, J.; Gessner, T.
Conference Paper
2009Two lithography-based technologies for the fabrication of submicron to deep-submicron structures
Jia, C.; Wiemer, M.; Werner, T.; Otto, T.
Conference Paper
2009Using of reactive multilayer systems for room temperature bonding of micro components
Bräuer, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2008"glassPack": A novel photonic packaging and integration technology using thin glass foils
Brusberg, L.; Schröder, H.; Arndt-Staufenbiel, N.; Wiemer, M.
Conference Paper
2008Developments trends in the field of wafer bonding technologies
Wiemer, M.; Haubold, M.; Jia, C.; Wünsch, D.; Frömel, J.; Gessner, T.
Conference Paper
2008Fabrication of a low-frequency ultrasonic transducer
Jia, C.; Wiemer, M.; Hiller, K.; Otto, T.; Gessner, T.
Conference Paper
2008Herstellung von Nanostrukturen und ihre Anwendung für Fügeverbindungen
Jia, C.; Frömel, J.; Wiemer, M
Journal Article
2008Laser transmission bonding of silicon-to-silicon and silicon-to-glass for wafer level packaging and microsystems
Sari, F.; Wiemer, M.; Bernasch, M.; Bagdahn, J.
Conference Paper
2008Reproducible reliable ausi eutectic wafer bond process with high yield
Schwerdtner, R.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2008Through silicon vias as enablers for 3D systems
Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M.
Conference Paper
2008Waferbond technologies and quality assesment
Wiemer, M.; Frömel, J.; Chenping J.; Haubold, M.; Gessner, T.
Conference Paper
2007AVT als Basis erfolgreicher MEMS-Kommerzialisierung
Frömel, J.; Wiemer, M.; Gessner, T.
Journal Article
2007Bonding and reliability for 3D mechanical, optical and fluidic systems
Wiemer, M.; Bagdahn, J.; Beckert, E.; Eichler, M.; Hollaender, A.; Vogel, D.
Conference Paper
2007Bulksiliziummikromechanik, Entwicklungstendenzen und Beispiele
Wiemer, M; Frömel, J.; Hiller, K.; Reuter, D.; Jia, C.
Conference Paper
2007Conformal coating and patterning of 3D structures on wafer level with electrophoretic photoresists
Fischer, T.; Töpper, M.; Jürgensen, N.; Ehrmann, O.; Wiemer, M.; Reichl, H.
Conference Paper
2007Design and fabrication of a micromechanical vertical resonator
Jia, C.; Wiemer, M.; Kurth, S.; Otto, T.; Gessner, T.
Conference Paper
2007Improvement of solid Au-Si eutectic bond process
Schwerdtner, R.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2007Low-Temperature Ti-Si bonding and its application in micro-device fabrication
Jia, C.; Hiller, K.; Wiemer, M.; Otto, T.; Gessner, T.
Conference Paper
2007Roughness improvement of the COSi2/Si-interface for an application as buried silicide
Zimmermann, S.; Zhao, Q.T.; Höhnemann, H.; Wiemer, M.; Kaufmann, C.; Mantl, S.; Dudek, V.; Gessner, T.
Conference Paper, Journal Article
2007Wafer bonding with BCB and SU-8 for MEMS packaging
Wiemer, M.; Jia, C.; Toepper, M.; Hauck, K.
Conference Paper
2007Waferbond technologies and quality assesment
Wiemer, M.; Froemel, J.; Bagdahn, J.; Knechtel, R.
Conference Paper
2006Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems
Frömel, J.; Billep, D.; Gessner, T.; Wiemer, M.
Conference Paper, Journal Article
2006Coherent acoustic phonons in nanostructures investigated by asynchronous optical sampling
Dekorsy, T.; Hudert, F.; Cerna, R.; Schäfer, H.; Janke, C.; Bartels, A.; Köhler, K.; Braun, S.; Wiemer, M.; Mantl, S.
Conference Paper
2006Comparison of the mechanical properties of low temperature bonded test samples
Bagdahn, J.; Bernasch, M.; Fischer, C.; Wiemer, M.
Conference Paper
2006Different approaches to integrate patterned buried CoSi2 layers in SOI substrates
Zimmermann, S.; Zhao, Q.T.; Höhnemann, H.; Wiemer, M.; Kaufmann, C.; Mantl, S.; Dudek, V.; Gessner, T.
Conference Paper, Journal Article
2006Direct bonding with on-wafer metal interconnections
Jia, C.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2006Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors
Petzold, M.; Dresbach, C.; Ebert, M.; Bagdahn, J.; Wiemer, M.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H.
Conference Paper
2006Smart Systems Integration - Eine Herausforderung für zukünftige Mikro- und Nanotechnologien
Gessner, T.; Baum, M.; Hiller, K.; Mehner, J.; Wiemer, M.; Otto, T.; Saupe, R.; Nestler, J.
Conference Paper
2006Strength characterization of directly bonded silicon
Wiemer, M.; Fischer, C.; Bernasch, M.; Bagdahn, J.
Conference Paper
2006Thermal stability of CoSi2 layers implemented in a silicon-on-insulator substrate
Zhao, Q.T.; Bay, H.L.; Zimmermann, S.; Wiemer, M.; Kaufmann, C.; Trui, B.; Höhnemann, H.; Dudek, V.; Mantl, S.
Journal Article
2006Wafer level encapsulation of microsystems using glass frit bonding
Knechtel, R.; Wiemer, M.; Frömel, J.
Conference Paper, Journal Article
2005Fabrication and characterization of a micro-machined ultrasonic transducer
Jia, C.; Wiemer, M.; Zichner, N.; Otto, T.; Gessner, T.
Conference Paper
2005Fabrication and characterization of buried silicide layers on SOI substrates for BICMOS-applications
Zimmermann, S.; Zhao, Q.T.; Trui, B.; Wiemer, M.; Kaufmann, C.; Mantl, S.; Dudek, V.; Gessner, T.
Conference Paper, Journal Article
2005Fabrication of embedded micro-channels by intended under-etching and trench filling
Jia, Chenping; Wiemer, M.; Müller, R.; Otto, T.; Geßner, T.
Conference Paper
2005Fabrication of SOI substrates with buried silicide layers for BiCMOS applications
Wiemer, M.; Zimmermann, S.; Zhao, Q.T.; Trui, B.; Kaufmann, C.; Mantl, S.; Dudek, V.; Gessner, T.
Conference Paper
2005Mechanical reliability of directly bonded silicon MEMS components
Bagdahn, J.; Wiemer, M.; Petzold, M.
Conference Paper
2005NON-destructive strength testing of anodic bonded glass-silicon wafer compounds
Knechtel, R.; Knaup, M.; Bagdahn, J.; Wiemer, M.
Conference Paper
2005Packaging of MEMS structures in SCREAM technology using anodic bonding
Frömel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2005Sicherung der Ausbeute und Zuverlässigkeit industriell gefertigter direkt wafergebondeter mikromechanischer Sensoren
Bagdahn, J.; Wiemer, M
Report
2004Novel MEMS CSP to bridge the gap between development and manufacturing
Jung, E.; Wiemer, M.; Aschenbrenner, R.; Färber, A.
Conference Paper
2004Wafer Bonding in Micro Mechanics and Microelectronics
Wiemer, M.; Froemel, J.; Gessner, T.; Otto, T.
Book Article
2003Bonding and contacting of MEMS-structures on wafer level
Wiemer, M.; Frömel, J.; Jia, C.; Gessner, T.
Conference Paper
2003Debonding of directly wafer-bonded silicon after high temperature process steps
Bagdahn, J.; Knoll, H.; Petzold, M.; Wiemer, M.; Frömel,J.
Abstract
2003A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Knoll, H.; Wiemer, M.; Petzold, M.
Journal Article
2003Silicon wafer bonding for encapsulating surface-micromechanical-systems using intermediate glass layers
Knechtel, R.; Heller, J.; Wiemer, M.; Frömel, J.
Conference Paper
2003Trends der Technologieentwicklung im Bereich Waferbonden
Wiemer, M.; Frömel, J.; Geßner, T.
Conference Paper
2002Packaging for MEMS devices - Stumbling block or enabling solution?
Jung, E.; Wiemer, M.; Grosser, V.; Bock, K.; Wolf, J.
Journal Article, Conference Paper
2002Strength and long-term reliability testing of wafer-bonded MEMS
Petzold, M.; Katzer, D.; Wiemer, M.; Bagdahn, J.
Conference Paper
2001Application of high and low wafer bonding processes for bulk micromachined components
Wiemer, M.; Hiller, K.; Hahn, R.; Kaufmann, C.; Gessner, T.
Conference Paper
2001Einsatz von Niedertemperaturbondverfahren für die Fertigung von Sensoren
Wiemer, M; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M.
Conference Paper
2001Implementation of a low temperature wafer bonding process for acceleration sensors
Wiemer, M.; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M.
Conference Paper
2001Measurement of the local strength distribution of directly bonded silicon wafers using the micro-chevron-test
Bagdahn, J.; Petzold, M.; Plößl, A.; Wiemer, M.
Conference Paper
2001A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
2001Silicon oxide in Si-Si bonded wafers
Himcinschi, C.; Milekhin, A.; Friedrich, M.; Hiller, K.; Wiemer, M; Gessner, T.; Schule, S.; Zahn, D.R.T.
Journal Article
2001Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
2001Übersicht zur Mikrosystemtechnik: Definition, Technologien, Markt und Probleme in 2001
Wiemer, M.; Otto, T.; Gessner, T.
Journal Article
2000Investigation of bonding behaviour of different borosilicate glasses
Wiemer, M; Hiller, K.; Gessner, T.; Kloss, T.; Schneider, K.; Leipold-Haas, U.; Bagdahn, J.; Petzold, M.
Conference Paper
2000Patterning of SOI-materials for fabrication of resonator systems using waferbonding approaches
Wiemer, M.; Hiller, K.; Gessner, T.
Conference Paper
1999Advanced silicon bulk micromachining for angular rate sensor
Wiemer, M.; Hiller, K.; Gessner, T.; Billep, D.; Ryrko, B.; Breng, U.; Zimmermann, S.; Gutmann, W.
Conference Paper
1999Anwendung von Niedertemperatur-Bondverfahren für die Herstellung von Microscanner-Arrays hoher Frequenz
Wiemer, M.; Hiller, K.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.
Conference Paper
1999µCORS - a bulk micromachined gyroscope based on coupled resonators
Breng, U.; Gutmann, W.; Leinfelder, P.; Ryrko, B.; Zimmermann, S.; Billep, D.; Gessner, T.; Hiller, K.; Wiemer, M.
Conference Paper
1999Extending speckle pattern interferometry for use on a microscopic scale
Aswendt, P.; Höfling, R.; Hiller, K.; Wiemer, M.
Conference Paper
1999Fabrication of high frequency microscanners by using low temperature silicon wafer bonding
Hiller, K.; Wiemer, M.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.; Milekhin, A.; Friedrich, M.; Zahn, D.
Conference Paper
1999Infrared study of the Si surfaces and bonded Si wafers
Milekhin, A.; Friedrich, M.; Wiemer, M; Hiller, K.; Gessner, T.; Zahn, D.R.T.
Journal Article
1999Infrared study of the Si surfaces and buried interfaces
Milekhin, A.; Friedrich, M.; Wiemer, M; Hiller, K.; Gessner, T.; Zahn, D.R.T.
Conference Paper
1999Kapazitiver Drehratensensor auf der Basis einer Stimmgabel mit gekoppeltem Resonator
Wiemer, M; Hiller, K.; Gessner, T.; Billep, D.; Ryrko, B.; Breng, U.; Zimmermann, S.; Gutmann, W.
Conference Paper
1999Low-temperature approaches for fabrication of high-frequency microscanners
Hiller, K.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.; Wiemer, M; Schubert, I.
Conference Paper
1999Technologieentwicklung für Beschleunigungssensoren und Drehratensensoren unter Nutzung von Waferbondverfahren
Wiemer, M.
Dissertation
1997The influence of sharp notches on the strength of directly bonded components
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.
Conference Paper
1997Mechanical reliability tests for bonded wafers
Bagdahn, J.; Petzold, M.; Reiche, M.; Wiemer, M.
Conference Paper
1995Charakterisierung mehrfach gebondeter Wafer für die Sensorik
Wiemer, M.; Hiller, K.; Hopfe, S.; Petzold, M.; Reiche, M.; Geßner, T.; Gösele, U.
Conference Paper