Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L.
Conference Paper
2014Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution
Maus, I.; Preu, H.; Niessner, M.; Nabi, H.; Jansen, K.M.B.; Pantou, R.; Weiss, L.; Michel, B.; Wunderle, B.
Conference Paper
2014PECVD Al2O3 for Surface Passivation: A Review of Solar Cell and Thin Layer Characteristics Silicon Solar Cell
Kühnhold, S.; Saint-Cast, P.; Hofmann, M.; Paramanathan, R.; El-Safoury, M.; Kafle, B.; Kania, D.; Weiss, L.; Heo, Y.-H.; Billot, E.; Olwal, P.; Rentsch, J.; Preu, R.
Conference Paper
2012A review of PECVD aluminum oxide for surface passivation
Saint-Cast, P.; Hofmann, M.; Kühnhold, S.; Kania, D.; Weiss, L.; Heo, Y.-H.; Billot, E.; Olwal, P.; Trogus, D.; Rentsch, J.; Preu, R.
Conference Paper
2010High-efficiency c-Si solar cells passivated with ALD and PECVD aluminum oxide
Saint-Cast, P.; Benick, J.; Kania, D.; Weiss, L.; Hofmann, M.; Rentsch, J.; Preu, R.; Glunz, S.W.
Journal Article
2010P-type Cz-Si PERC-type solar cells applying PECVD aluminium oxide rear surface passivation
Saint-Cast, P.; Kania, D.; Billot, E.; Weiss, L.; Hofmann, M.; Gautero, L.; Kohn, N.; Biro, D.; Rentsch, J.; Preu, R.
Conference Paper
2008Industrial approach for the deposition, through-vias wet opening and firing activation of a backside passivation layer applied on solar cells
Gautero, L.; Rentsch, J.; Weiss, L.; Kohn, N.; Eigner, S.; Zimmer, M.; Specht, J.; Nekarda, J.; Stüwe, D.; Retzlaff, M.; Biro, D.; Sallese, J.-M.; Preu, R.
Conference Paper
2008Plasma cluster processing for advanced solar cell manufacturing
Rentsch, J.; Seiffe, J.; Walter, F.; Hofmann, M.; Weiss, L.; Gautero, L.; Decker, D.; Schlemm, H.; Preu, R.
Conference Paper