Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Micromachined phase-shifted array-type Mirau interferometer for swept-source OCT imaging
Gorecki, C.; Lullin, J.; Perrin, S.; Bargiel, S.; Albero, J.; Gaiffe, O.; Rutkovvski, J.; Cote, J.M.; Krauter, J.; Osten, W.; Wang, W.-S.; Weimer, M.; Froemel, J.
Journal Article
2019Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components
Bargiel, S.; Baranski, M.; Wiemer, M.; Frömel, J.; Wang, W.-S.; Gorecki, C.
Journal Article
2018Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S.
Conference Paper
20163D integration technologies for MEMS
Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S.
Conference Paper
2016Array-type miniature interferometer as the core optical microsystem of an optical coherence tomography device for tissue inspection
Passilly, N.; Perrin, S.; Lullin, J.; Albero, J.; Bargiel, S.; Froehly, L.; Gorecki, C.; Krauter, J.; Osten, W.; Wang, W.-S.; Wiemer, M.
Conference Paper
2016Centrifugation of micro particles and self-assembly of nano particles by capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Wang, W.-S.; Wiemer, M.
Conference Paper
2016Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding
Tanaka, K.; Wang, W.-S.; Baum, M.; Froemel, J.; Hirano, H.; Tanaka, S.; Wiemer, M.; Otto, T.
Journal Article
2016Re-building the underfill: Performance of percolating fillers at package scale
Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow, F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B.
Conference Paper
2016Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding
Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C.
Conference Paper
2015Fabrication of nanoporous gold and the application for substrate bonding at low temperature
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Journal Article
2014Nanoporous gold as a versatile bonding intermediate
Lin, Y.-C.; Wang, W.-S.; Gessner, T.; Esashi, M.
Conference Paper
2013Nanoporous gold for MEMS packing applications
Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.
Journal Article
2012Substrate bonding at low temperature by using plasma activated porous gold
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Conference Paper
2011Anodically-bondable LTCC substrates with novel nano-structured electrical interconnection for MEMS packaging
Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.
Conference Paper