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| 2019 | Miniaturized multi sensor implant for monitoring of hemodynamic parameters
Dogan, Özgü; Schierbaum, Nicolas; Weidenmüller, Jens; Baum, Mario; Schröder, Thomas; Wünsch, Dirk; Görtz, Michael; Seidl, Karsten | Conference Paper |
| 2018 | 3D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M. | Conference Paper |
| 2018 | Elektrochemische Abscheidung für die Leiterplatte
Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S. | Conference Paper |
| 2018 | Implantable multi-sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton | Journal Article |
| 2018 | Warpage measurement on bonded wafers under thermal load
Tröger, B.; Wünsch, D.; Hildebrandt, M.; Taubert, P.; Gottfried, K.; Fries, T. | Conference Paper |
| 2017 | 3D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T. | Journal Article, Conference Paper |
| 2017 | 3D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael | Conference Paper |
| 2017 | 3D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2017 | Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T. | Journal Article |
| 2017 | Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas | Conference Paper |
| 2017 | Implantable multi sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton | Conference Paper |
| 2017 | Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael | Journal Article, Conference Paper |
| 2017 | Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T. | Conference Paper |
| 2016 | Concept for a miniaturized cardiovascular multi sensor implant
Dogan, Özgü; Weidenmüller, Jens; Gembaczka, Pierre; Stanitzki, Alexander; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Görtz, Michael | Abstract |
| 2016 | A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system
Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü | Abstract |
| 2015 | 3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2015 | Technological platform for vertical multi-wafer integration of miniature imaging instruments
Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S. | Conference Paper |
| 2014 | Ceramic wafer bonding for vertically integrated MEMS
Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Investigation of low temperature wafer bonding using plasma activation
Wünsch, D.; Hofmann, C.; Bräuer, J.; Wiemer, M.; Gessner, T. | Book Article |
| 2014 | Mechanical characterization of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C. | Journal Article |
| 2013 | Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Naumann, F.; Brand, S.; Bernasch, M.; Tismer, S.; Czurratis, P.; Wünsch, D.; Petzold, M. | Journal Article |
| 2013 | Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Wiemer, M.; Wuensch, D.; Froemel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passily, N.; Gorecki, C. | Conference Paper |
| 2012 | Influence of test speed on the bonding strength of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T. | Abstract |
| 2012 | Plasma activated bonding of the heterogeneous material combinations LiTaO3/Si and poly-Si/SiO2
Wuensch, D.; Braeuer, J.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2012 | Plasma-activated bonding
Wiemer, M.; Wuensch, D.; Braeuer, J.; Gessner, T. | Book Article |
| 2012 | A study of factors influencing micro-chevron-testing of glass frit bonded interfaces
Naumann, F.; Bernasch, M.; Brand, S.; Wünsch, D.; Vogel, K.; Czurratis, P.; Petzold, M. | Conference Paper, Journal Article |
| 2011 | 3D Integration for MEMS devices using photosenitive glass
Wuensch, D.; Hofmann,Ch.; Besser, J.; Schubert, I.; Gottfried, K.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2011 | CMP process development and adaption for wafer bonding
Schubert, I.; Gottfried, K.; Wuensch, D.; Baum, M.; Martinka, R. | Conference Paper |
| 2011 | Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers
Vogel, K.; Wuensch, D.; Shaporin, A.; Mehner, J.; Billep, D.; Wiemer, M. | Journal Article |
| 2011 | Developement trends in the field of wafer bonding technologies
Wiemer, M.; Braeuer, J.; Besser, J.; Wuensch, D. | Conference Paper |
| 2010 | Aktivierung mittels Niederdruckplasma zur Herstellung von Si-Verbunden im Niedertemperatur-Bereich und deren Charakterisierung mittels Mikro-Chevron-Test
Wünsch, D.; Müller, B.; Wiemer, M.; Mischke, H. | Conference Paper |
| 2010 | Low temperature wafer bonding for microsystems using dielectric barrier discharge
Wünsch, D.; Wiemer, M.; Gabriel, M.; Gessner, T. | Journal Article |
| 2010 | Reactive bonding and low temperature bonding of heterogeneous materials
Wiemer, M.; Braeuer, J.; Wünsch, D.; Gessner, T. | Conference Paper |
| 2009 | Low temperature bonding of hetero-materials using ambient pressure plasma activation
Wiemer, M.; Wünsch, D.; Bräuer, J.; Eichler, M.; Hennecke, P.; Gessner, T. | Conference Paper |
| 2008 | Developments trends in the field of wafer bonding technologies
Wiemer, M.; Haubold, M.; Jia, C.; Wünsch, D.; Frömel, J.; Gessner, T. | Conference Paper |
| 2007 | Elektrochemische Mikrostrukturierung mit hoher Abtragsrate und hoher Abbildgenauigkeit
Wünsch, D. | Thesis |