Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20183D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M.
Conference Paper
2018Elektrochemische Abscheidung für die Leiterplatte
Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S.
Conference Paper
2018Implantable multi-sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Journal Article
2018Warpage measurement on bonded wafers under thermal load
Tröger, B.; Wünsch, D.; Hildebrandt, M.; Taubert, P.; Gottfried, K.; Fries, T.
Conference Paper
20173D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T.
Journal Article, Conference Paper
20173D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael
Conference Paper
20173D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T.
Journal Article
2017Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T.
Journal Article
2017Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas
Conference Paper
2017Implantable multi sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Conference Paper
2017Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael
Journal Article, Conference Paper
2017Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T.
Conference Paper
2016Concept for a miniaturized cardiovascular multi sensor implant
Dogan, Özgü; Weidenmüller, Jens; Gembaczka, Pierre; Stanitzki, Alexander; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Görtz, Michael
Abstract
2016A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system
Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü
Abstract
20153d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2015Technological platform for vertical multi-wafer integration of miniature imaging instruments
Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S.
Conference Paper
2014Ceramic wafer bonding for vertically integrated MEMS
Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2014Investigation of low temperature wafer bonding using plasma activation
Wünsch, D.; Hofmann, C.; Bräuer, J.; Wiemer, M.; Gessner, T.
Book Article
2014Mechanical characterization of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Conference Paper
2014Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.
Journal Article
2013Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Naumann, F.; Brand, S.; Bernasch, M.; Tismer, S.; Czurratis, P.; Wünsch, D.; Petzold, M.
Journal Article
2013Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Wiemer, M.; Wuensch, D.; Froemel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passily, N.; Gorecki, C.
Conference Paper
2012Influence of test speed on the bonding strength of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Abstract
2012Plasma activated bonding of the heterogeneous material combinations LiTaO3/Si and poly-Si/SiO2
Wuensch, D.; Braeuer, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012Plasma-activated bonding
Wiemer, M.; Wuensch, D.; Braeuer, J.; Gessner, T.
Book Article
2012A study of factors influencing micro-chevron-testing of glass frit bonded interfaces
Naumann, F.; Bernasch, M.; Brand, S.; Wünsch, D.; Vogel, K.; Czurratis, P.; Petzold, M.
Conference Paper, Journal Article
20113D Integration for MEMS devices using photosenitive glass
Wuensch, D.; Hofmann,Ch.; Besser, J.; Schubert, I.; Gottfried, K.; Wiemer, M.; Gessner, T.
Conference Paper
2011CMP process development and adaption for wafer bonding
Schubert, I.; Gottfried, K.; Wuensch, D.; Baum, M.; Martinka, R.
Conference Paper
2011Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers
Vogel, K.; Wuensch, D.; Shaporin, A.; Mehner, J.; Billep, D.; Wiemer, M.
Journal Article
2011Developement trends in the field of wafer bonding technologies
Wiemer, M.; Braeuer, J.; Besser, J.; Wuensch, D.
Conference Paper
2010Aktivierung mittels Niederdruckplasma zur Herstellung von Si-Verbunden im Niedertemperatur-Bereich und deren Charakterisierung mittels Mikro-Chevron-Test
Wünsch, D.; Müller, B.; Wiemer, M.; Mischke, H.
Conference Paper
2010Low temperature wafer bonding for microsystems using dielectric barrier discharge
Wünsch, D.; Wiemer, M.; Gabriel, M.; Gessner, T.
Journal Article
2010Reactive bonding and low temperature bonding of heterogeneous materials
Wiemer, M.; Braeuer, J.; Wünsch, D.; Gessner, T.
Conference Paper
2009Low temperature bonding of hetero-materials using ambient pressure plasma activation
Wiemer, M.; Wünsch, D.; Bräuer, J.; Eichler, M.; Hennecke, P.; Gessner, T.
Conference Paper
2008Developments trends in the field of wafer bonding technologies
Wiemer, M.; Haubold, M.; Jia, C.; Wünsch, D.; Frömel, J.; Gessner, T.
Conference Paper
2007Elektrochemische Mikrostrukturierung mit hoher Abtragsrate und hoher Abbildgenauigkeit
Wünsch, D.
Thesis