Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Application of quantum cascade laser absorption spectroscopy for correlation studies in plasma etching processes in the semiconductor industry
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.; Helden, J.H. van
Conference Paper
2018Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects
Uhlig, B.; Dhavamani, A.; Nagy, N.; Lilienthal, K.; Liske, R.; Ramos, R.; Dijon, J.; Okuno, H.; Kalita, D.; Lee, J.; Georgiev, V.; Asenov, A.; Amoroso, S.; Wang, L.; Koenemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Liang, J.; Pandey, R.R.; Chen, R.; Todri-Sanial, A.
Conference Paper
2018Cobalt integration solutions - integration (R&D accelerator)
Gerlich, Lukas; Wislicenus, Markus; Koch, Johannes; Dhavamani, Abitha; Esmaeili, Sajjad; Uhlig, Benjamin
Presentation
2018Copper electroplating with polyethylene Glycol. Pt.II. Experimental analysis and determination of model parameters
Yang, Hongliu; Krause, Robert; Scheunert, Christin; Liske, Romy; Uhlig, Benjamin; Preusse, Axel; Dianat, Arezoo; Bobeth, Manfred; Cuniberti, Gianaurelio
Journal Article
2018A physics-based investigation of Pt-salt doped carbon nanotubes for local interconnects
Liang, J.; Ramos, R.; Dijon, J.; Okuno, H.; Kalita, D.; Renaud, D.; Lee, J.; Georgiev, V.P.; Berrada, S.; Sadi, T.; Asenov, A.; Uhlig, B.; Lilienthal, K.; Dhavamani, A.; Könemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Teo, K.; Pandey, R.R.; Todri-Sanial, A.
Conference Paper
2018Progress on carbon nanotube BEOL interconnects
Uhlig, B.; Liang, J.; Lee, J.; Ramos, R.; Dhavamani, A.; Nagy, N.; Dijon, J.; Okuno, H.; Kalita, D.; Georgiev, V.; Asenov, A.; Amoroso, S.; Wang, L.; Millar, C.; Konemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Pandey, R.R.; Chen, R.; Todri-Sanial, A.
Conference Paper
2018Understanding Electromigration in Cu-CNT Composite Interconnects
Lee, J.; Berrada, S.; Adamu-Lema, F.; Nagy, N.; Georgiev, V.P.; Sadi, T.; Liang, J.; Ramos, R.; Carrillo-Nunez, H.; Kalita, D.; Lilienthal, K.; Wislicenus, M.; Pandey, R.; Chen, B.; Teo, K.B.K.; Goncalves, G.; Okuno, H.; Uhlig, B.; Todri-Sanial, A.; Dijon, J.; Asenov, A.
Journal Article
2017BEoL post CMP cleaning challenges for 22 nm FD-SOI and beyond
Koch, Johannes; Rehschuh, Stephan; Gerlich, Lukas; Dhavamani, Abitha; Steinke, Philipp; Krause, Robert; Naue, Johannes; Bott, Sascha; Vasilev, Boris; Breuer, Dirk; Seidel, Robert; Preusse, Axel; Bartha, Johann Wolfgang; Uhlig, Benjamin
Conference Paper
2017Development of CMOS-compatible materials for thermoelectric and sensor applications in semiconductor industry
Wagner-Reetz, M.; Calvo, J.; Nichenametla, C.K.; Kühnel, K.; Göhler, T.; Schulz, S.; Burkov, A.; Uhlig, B.
Presentation
2017Evaluation of an electrochemical corrosion technique for the determination of static etch rates of post CMP cleaning chemicals
Krause, Robert; Koch, Johannes; Rehschuh, Stephan; Naue, Johannes; Bott, Sascha; Uhlig, Benjamin; Vasilev, Boris
Presentation
2017The fabrication of copper-carbon nanotube composites for global interconnects
Nagy, Nicole; Lilienthal, Katharina; Uhlig, Benjamin
Poster
2017Seed-layer resistance and its impact on the electrochemical copper deposition
Wislicenus, Marcus; Gerlich, Lukas; Koch, Johannes; Uhlig, Benjamin
Presentation
2017A survey of carbon nanotube interconnects for energy efficient integrated circuits
Todri-Sanial, A.; Ramos, R.; Okuno, H.; Dijon, J.; Dhavamani, A.; Wislicenus, M.; Lilienthal, K.; Uhlig, B.; Sadi, T.; Georgiev, V.; Asenov, A.; Amoroso, S.; Pender, A.; Brown, A.; Millar, C.; Motzfeld, F.; Gotsmann, B.; Liang, J.; Goncalves, G.; Rupesinghe, N.; Teo, K.
Journal Article
2016CVD-CoXN for advanced semiconductor metallization
Dhavamani, Abitha; Wislicenus, Marcus; Gerlich, Lukas; Uhlig, Benjamin
Presentation
2016The influence of adsorption kinetics on copper superfilling for dual damascene
Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel
Journal Article
2015Advanced Wet-Etch-Only Process for Complete Tri-Layer Rework
Steinke, Philipp; Calvo, Jesús; Uhlig, Benjamin
Journal Article, Conference Paper
2015Alternative ULK integration approach using a sacrificial layer in a standard dual damascene flow
Uhlig, B.; Calvo, J.; Koch, J.; Thrun, X.; Liske, R.
Conference Paper
2015Development and characterization of a novel CoXN barrier film for future semiconductor technology nodes
Dhavamani, Abitha
: Uhlig, Benjamin (Betr.); Bartha, Johann Wolfgang (Gutachter)
Master Thesis
2015On treatment of ultra-low-k SiCOH in CF4 plasmas: Correlation between the concentration of etching products and etching rate
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.
Journal Article
2015Organosilane Downstream Plasma On Ultra Low-k Dielectrics: Comparing Repair With Post Etch Treatment
Calvo, J.; Steinke, P.; Wislicenus, M.; Gerlich, L.; Seidel, R.; Clauss, E.; Uhlig, B.
Conference Paper
2015Porous Ultra Low-k Material Integration Through An Extended Dual Damascene Approach: Pre-/ Post-CMP Curing Comparison
Calvo, J.; Koch, J.; Thrun, X.; Seidel, R.; Clauss, E.; Uhlig, B.
Conference Paper
2015Theory of co-adsorption and its application to copper superfilling
Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel
Presentation
2015Untersuchung des Korrosionsverhaltens von kobalthaltigen Dünnschichten für den Einsatz in der Halbleitertechnologie
Nagy, Nicole
: Kalies, Grit (Betr.); Uhlig, Benjamin (Betr.)
Master Thesis
2014CMP process development for Cobalt liner integration at the 28-nm-node
Koch, J.; Bott, S.; Wislicenus, M.; Krause, R.; Gerlich, L.; Uhlig, B.; Liske, R.; Vasilev, B.; Preusse, A.
Conference Paper
2014Post etch wet clean processes for advanced technology nodes
Uhlig, Benjamin; Steinke, Philipp; Liske, Romy; Ott, Andreas; Mieth, Oliver
Conference Paper
2013Local temperature determination in power loaded surface acoustic wave structures using Raman spectroscopy
Spindler, M.; Uhlig, B.; Menzel, S.B.; Huck, C.; Gemming, T.; Eckert, J.
Journal Article
2012A Low Damage Patterning Scheme for Ultra Low-k Dielectrics
Zimmermann, S.; Ahner, N.; Fischer,T.; Oszinda,T.; Uhlig, B.; Schulz, S.E.; Gessner,T.
Journal Article
2010High precision stress measurements in semiconductor structures by raman microscopy
Uhlig, Benjamin
: Eng, Lukas M. (Gutachter); Michaelis, Alexander (Gutachter)
Dissertation
2008Reduction of layout variations with stress-compensated hybrid STI fills: A comprehensive analysis
Städele, M.; Ilicali, G.; Landgraf, E.; Goldbach, M.; Finsterbusch, S.; Lindolf, J.; Radecker, J.; Uhlig, B.
Conference Paper
2007Nano-Raman: Monitoring nanoscale stress
Uhlig, B.; Zollondz, J.-H.; Haberjahn, M.; Bloess, H.; Kücher, P.
Conference Paper