Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2008A standard method for measuring wafer bond strength for MEMS applications
Allen, R.A.; Marshall, J.; Baylies, W.; Read, D.; Delrio, F.; Turner, K.T.; Bernasch, M.; Bagdahn, J.
Conference Paper
2003Characterization of silicon-wafer bonding for power MEMS applications
Ayon, A.A.; Zhang, X.; Turner, K.T.; Choi, D.W.; Miller, B.; Nagle, S.F.; Spearing, S.M.
Journal Article