Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Fan-Out Wafer and Panel Level Packaging - A Platform for 3D Integration
Braun, T.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Schneider-Ramelow, M.
Conference Paper
2020Chiplets - Exploring the Green Potential of Advanced Multi-Chip Packages
Nissen, Nils F.; Clemm, Christian; Billaud, Mathilde; Töpper, Michael; Stobbe, Lutz; Schneider-Ramelow, Martin
Conference Paper
2019Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik
Wöhrmann, Markus; Toepper, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2019An Overview about the Excimer Laser Ablation of Different Polymers and their Application for Wafer and Panel Level Packaging
Gernhardt, R.; Wöhrmann, M.; Müller, F.; Hauck, K.; Töpper, M.; Lang, K.-D.; Hichri, H.; Arendt, M.
Conference Paper
2019Panel Level Packaging - From Idea to Industrialization -
Braun, T.; Becker, K.-F.; Hoelck, O.; Voges, S.; Boettcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Voitel, M.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2019Where is the Sweet Spot for Panel Level Packaging?
Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
2018The Evolution of Panel Level Packaging
Aschenbrenner, Rolf; Töpper, M.; Braun, Tanja; Ostmann, A.
Conference Paper
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Conference Paper
2018Recent developments in panel level packaging
Braun, T.; Billaud, M.; Zedel, H.; Stobbe, L.; Becker, K.-F.; Hoelck, O.; Wöhrmann, M.; Boettcher, L.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.; Schneider-Ramelow, M.
Conference Paper
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.
Conference Paper
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.
Conference Paper
2017Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.
Conference Paper
2017Klebeverfahren zum Verbinden zweier Wafer
Zoschke, Kai; Töpper, Michael
Patent
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei
Conference Paper
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, Markus; Juergensen, Nils; Lutz, Mario; Wilke, Martin; Duan, Xiaomin; Ndip, Ivan; Töpper, Michael; Lang, Klaus-Dieter
Conference Paper
2016Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, Kai; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D.
Conference Paper
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Conference Paper
2016Wafer level chip scale packaging
Töpper, Michael
Book Article
2015Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.
Conference Paper
2015Next generation thin film polymers for WLP applications and their mechanical characterization
Woehrmann, Markus; Fischer, Thorsten; Walter, Hans; Toepper, Michael; Lang, Klaus-Dieter
Conference Paper
2015Single-mode board-level interconnects for silicon photonics
Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T.
Conference Paper
2015A sub-4 µm via technology of thinfilm polymers using scanning laser ablation
Töpper, M.; Hauck, K.; Schima, M.; Jaeger, D.; Lang, K.-D.
Conference Paper
2015Thin wafer handling using mechanical- or laser-debondable temporary adhesives
Fleming, D.; Kim, J.-U.; Okada, J.; Wang, K.; Gallagher, M.; Barr, B.; Calvert, J.; Zoschke, K.; Wegner, M.; Töpper, M.; Rapps, T.; Griesbach, T.; Lutter, S.
Conference Paper
2014Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics
Wöhrmann, Markus; Fischer, Thorsten; Walter, Hans; Töpper, Michael; Lang, Klaus-Dieter
Conference Paper
2014A critical review of corrosion phenomena in microelectronic systems
Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf
Conference Paper
2014Development of a high density glass interposer based on wafer level packaging technologies
Töpper, Michael; Wöhrmann, Markus; Brusberg, Lars; Jürgensen, Nils; Ndip, Ivan; Lang, Klaus-Dieter
Conference Paper
2014Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter
Conference Paper
2014Korrosionsphänomene im mikroelektronischen System
Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter
Journal Article
2013Bumping technologies
Töpper, Michael; Lu, D.
Book Article
2013Design, fabrication and testing of silicon-integrated Li-ion secondary micro batteries with side-by-side electrodes
Hoeppner, K.; Ferch, M.; Eisenreich, M.; Marquardt, K.; Hahn, R.; MacKowiak, P.; Mukhopadhyay, B.; Ngo, H.-D.; Gernhardt, R.; Toepper, M.; Lang, K.-D.
Conference Paper
2013Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test
Wunderle, B.; Manier, C.-A.; Abo Ras, M.; Springborn, M.; May, D.; Oppermann, H.; Toepper, M.; Mrossko, R.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Conference Paper
2013Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging
Hansen, U.; Maus, S.; Töpper, M.
Conference Paper
2013Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
Lin, D.-S.; Wodnicki, R.; Zhuang, X.; Woychik, C.; Thomenius, K.E.; Fisher, R.A.; Mills, D.M.; Byun, A.J.; Burdick, W.; Khuri-Yakub, P.; Bonitz, B.; Davies, T.; Thomas, G.; Otto, B.; Töpper, M.; Fritzsch, T.; Ehrmann, O.
Journal Article
2013Strain energy driven adhesion test for adherence characterization of thin polymer films for microelectronic applications
Wöhrmann, M.; Töpper, M.; Lang, K.-D.
Conference Paper
2013Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Oliver, M.; Kim, J.-U.; Wang, Z.; Okada, J.; Iagodkine, E.; Choubey, A.; Anzures, E.; Fleming, D.; Dhoble, A.; Truong, C.; Gallagher, M.; Zoschke, K.; Wegner, M.; Töpper, M.
Conference Paper
2013Verfahren zum Herstellen einer Beschichtung eines Substrats
Wilke, Martin; Töpper, Michael
Patent
2013Wafer level packaging for ultra thin (6 µm) high brightness LEDs using embedding technology
Kleff, J.; Töpper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S.
Conference Paper
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Coating techniques for 3D-packaging applications
Töpper, M.; Wilke, M.; Röder, J.; Fischer, T.; Lopper, C.
Conference Paper
2012Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article
2012High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing
Itabashi, T.; Kotani, M.; Zussman, M.P.; Zoschke, K.; Fischer, T.; Töpper, M.; Ishida, H.
Conference Paper
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael
Journal Article
2012Innovation Driver of the Next Decade: Technology Follows Application
Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M.
Book Article
2012Low temperature wafer level bonding using benzocyclobutene adhesive polymers
Gallagher, M.; Kim, J.-U.; Huenger, E.; Zoschke, K.; Lopper, C.; Toepper, M.
Journal Article
2012Modelling and characterisation of smart power devices
Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.
Conference Paper
2012Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012Process modeling of dry etching for the 3D-integration with tapered TSVs
Wilke, M.; Töpper, M.; Huynh, H.Q.; Lang, K.D.
Conference Paper
2012Silicon integrated micro batteries based on deep reactive ion etching and through silicon via technologies
Hahn, R.; Marquardt, K.; Thunman, M.; Töpper, M.; Wilke, M.; Ferch, M.; Huynh, Q.H.; Lang, K.D.
Conference Paper
20113D stacking approaches for mold embedded packages
Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2011Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D.
Journal Article
2011Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Conference Paper
2011High channel-count neural interfaces for multiple degree-of-freedom neuroprosthetics
Rieth, L.; Franklin, R.; Tathireddy, P.; Sharma, R.; Williams, L.; Tenore, F.; Merugu, S.; Rothermund, M.; Jaeger, D.; Töpper, M.; Oppermann, H.; Harrison, R.; Solzbacher, F.
Conference Paper
2011Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article
2011Low temperature cure of BCB and the influence on the mechanical stress
Wöhrmann, M.; Töpper, M.; Walter, H.; Lang, K.-D.
Conference Paper
2011Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M.
Conference Paper
2011Prospects and limits in wafer-level-packaging of image sensors
Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D.
Conference Paper
2011Ultra low temperature PBO-polymer for wafer level packaging applications
Töpper, Michael; Fischer, Thorsten; Bader, V.; Lang, Klaus-Dieter; Matsuie, N.; Motobe, T.; Minegishi, T.; Knaus, M.
Conference Paper