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| 2013 | Bumping technologies
Töpper, Michael; Lu, D. | Book Article |
| 2012 | Coating techniques for 3D-packaging applications
Töpper, M.; Wilke, M.; Röder, J.; Fischer, T.; Lopper, C. | Conference Paper |
| 2012 | Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F. | Journal Article, Conference Paper |
| 2012 | Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael | Journal Article |
| 2012 | Process modeling of dry etching for the 3D-integration with tapered TSVs
Wilke, M.; Töpper, M.; Huynh, H.Q.; Lang, K.D. | Conference Paper |
| 2012 | Silicon integrated micro batteries based on deep reactive ion etching and through silicon via technologies
Hahn, R.; Marquardt, K.; Thunman, M.; Töpper, M.; Wilke, M.; Ferch, M.; Huynh, Q.H.; Lang, K.D. | Conference Paper |
| 2011 | 3D stacking approaches for mold embedded packages
Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2011 | Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D. | Journal Article |
| 2011 | Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F. | Conference Paper |
| 2011 | High channel-count neural interfaces for multiple degree-of-freedom neuroprosthetics
Rieth, L.; Franklin, R.; Tathireddy, P.; Sharma, R.; Williams, L.; Tenore, F.; Merugu, S.; Rothermund, M.; Jaeger, D.; Töpper, M.; Oppermann, H.; Harrison, R.; Solzbacher, F. | Conference Paper |
| 2011 | Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F. | Journal Article |
| 2011 | Low temperature cure of BCB and the influence on the mechanical stress
Wöhrmann, M.; Töpper, M.; Walter, H.; Lang, K.-D. | Conference Paper |
| 2011 | Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M. | Conference Paper |
| 2011 | Prospects and limits in wafer-level-packaging of image sensors
Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D. | Conference Paper |
| 2011 | Ultra low temperature PBO-polymer for wafer level packaging applications
Töpper, Michael; Fischer, Thorsten; Bader, V.; Lang, Klaus-Dieter; Matsuie, N.; Motobe, T.; Minegishi, T.; Knaus, M. | Conference Paper |
| 2011 | Wafer-level glass-caps for advanced optical applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Zoschke, K.; Toepper, M. | Conference Paper |
| 2010 | 3-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H. | Conference Paper |
| 2010 | Anodic bonding at low voltage using microstructured borosilicate glass thin-films
Leib, J.; Hansen, U.; Maus, S.; Feindt, H.; Hauck, K.; Zoschke, K.; Toepper, M. | Conference Paper |
| 2010 | Carrierless design for handling and processing of ultrathin wafers
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Seng, T.C.; Tabuchi, T. | Conference Paper |
| 2010 | A comparison of thin film polymers for wafer level packaging
Töpper, M.; Fischer, T.; Baumgartner, T.; Reichl, H. | Conference Paper |
| 2010 | Development of charged particle detectors by integrating gas amplification stages and CMOS ASICs on wafer level
Kaminski, J.; Baumgartner, T.; Desch, K.; Ehrmann, O.; Fritzsch, T.; Krautscheid, T.; Mayer, S.; Töpper, M. | Conference Paper |
| 2010 | Dry film photo resists and polymers - The low cost option for standard and 3-D wafer level packaging
Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.-D.; Liebsch, W.; Ehlin, M.; Itabashi, T. | Conference Paper |
| 2010 | Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | Hermetic BSG thin film coatings for harsh environment applications
Maus, S.; Hansen, U.; Leib, J.; Toepper, M. | Conference Paper |
| 2010 | Integration of carrierless ultrathin wafers into a TSV process flow
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Fischer, T.; Röder, J.; Dietrich, L.; Tabuchi, T. | Conference Paper |
| 2010 | Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Conference Paper |
| 2010 | Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices
Hansen, U.; Maus, S.; Leib, J.; Toepper, M. | Conference Paper |
| 2010 | Tapered through-silicon-via interconnects for wafer-level packaging of sensor devices
Leib, J.; Bieck, F.; Hansen, U.; Looi, K.-K.; Ngo, H.-D.; Seidemann, V.; Shariff, D.; Studzinski, D.; Suthiwongsunthorn, N.; Tan, K.; Wilke, R.; Yam, K.-L.; Töpper, M. | Journal Article |
| 2010 | Wafer level processing of integrated passive components using polyimide or polybenzoxazole/copper multilayer technology
Zoschke, K.; Fischer, T.; Töpper, M.; Samulewicz, K.; Wünsch, O.; Röder, J.; Lutz, M.; Ehrmann, O.; Reichl, H. | Journal Article |
| 2010 | Wafer-level glass capping with optical integration
Hansen, U.; Maus, S.; Leib, J.; Toepper, M. | Conference Paper |
| 2009 | 3-D Thin Chip Integration Technology - from Technology Development to Application
Fritzsch, T.; Mrossko, R.; Baumgartner, T.; Toepper, M.; Klein, M.; Wolf, J.; Wunderle, B.; Reichl, H. | Conference Paper |
| 2009 | Bauteilanordnung und Verfahren zu dessen Herstellung
Oppermann, H.; Klein, M.; Toepper, M.; Wolf, J. | Patent |
| 2009 | BCB with nano-filled BaSrTiO3 for thin film capacitors
Töpper, M.; Fischer, T.; Zoschke, K.; Zang, M.; Teipel, U.; Fehrenbacher, U.; Reichl, H. | Conference Paper |
| 2009 | Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Hahn, R.; Marquardt, K.; Blechert, M.; Lehmann, M.; Töpper, M.; Wilke, M.; Semionyk, P.; Reichl, H. | Conference Paper |
| 2009 | Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Marquardt, K.; Hahn, R.; Blechert, M.; Lehmann, M.; Töpper, M.; Reichl, H. | Conference Paper, Journal Article |
| 2009 | A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level
Maus, S.; Hansen, U.; Leib, J.; Töpper, M. | Conference Paper, Journal Article |
| 2009 | Heterogeneous Integration
Reichl, H.; Aschenbrenner, R.; Töpper, M.; Pötter, H. | Book Article |
| 2009 | Integrated wireless neural interface based on the Utah electrode array
Kim, S.; Bhandari, R.; Klein, M.; Negi, S.; Rieth, L.; Tathireddy, P.; Töpper, M.; Oppermann, H.; Solzbacher, F. | Journal Article |
| 2009 | Low cost wafer-level 3-D integration without TSV
Töpper, M.; Baumgartner, T.; Klein, M.; Fritzsch, T.; Roeder, J.; Lutz, M.; Suchodoletz, M. von; Oppermann, H.; Reichl, H. | Conference Paper |
| 2009 | Novel multi-layer wiring build-up using electrochemical pattern replication (ECPR)
Fredenberg, M.; Möller, P.; Töpper, M. | Conference Paper |
| 2009 | PICSiP: New system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems
Tekin, T.; Töpper, M.; Reichl, H. | Conference Paper |
| 2009 | Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation
Hansen, U.; Maus, S.; Leib, J.; Töpper, M. | Conference Paper, Journal Article |
| 2009 | Thin glass based packaging technologies for optoelectronic modules
Brusberg, L.; Schröder, H.; Töpper, M.; Arndt-Staufenbiel, N.; Röder, J.; Lutz, M.; Reichl, H. | Conference Paper |
| 2009 | Thin hermetic borosilicate glass layers for highly reliable chip-passivations in wafer-level-packaging
Hansen, U.; Leib, J.; Maus, S.; Gyenge, O.; Töpper, M. | Conference Paper |
| 2009 | Thin hermetic passivation of semiconductors using low temperature borosilicate glass - Benchmark of a new wafer-level packaging technology
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Fischer, T.; Zoschke, K.; Toepper, M. | Conference Paper |
| 2009 | Wafer level chip scale packaging
Töpper, Michael | Book Article |
| 2008 | Funktionseinheit und Verfahren zu deren Herstellung
Wolf, J.; Zoschke, K.; Fischer, T.; Toepper, M.; Reichl, H. | Patent |
| 2008 | Low Temperature Au-Au Flip Chip Interconnections
Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Neue Verfahren und Werkstoffe für Halbleiterkomponenten
Pötter, H.; Becker, K.-F.; Hampicke, M.; Lang, K.-D.; Schmitz, S.; Töpper, M. | Journal Article |
| 2008 | Through silicon vias as enablers for 3D systems
Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M. | Conference Paper |
| 2008 | Verfahren und Vorrichtung zum stoffschluessigen Fuegen metallischer Anschlussstrukturen
Zwanzig, M.; Fiedler, S.; Schmidt, R.; Scheel, W.; Toepper, M. | Patent |
| 2008 | Verfahren zur Herstellung einer Lotmetallisierung
Hutter, M.; Engelmann, G.; Töpper, M.; Oppermann, H. | Patent |
| 2007 | Alternative UBM for Lead Free Solder Bumping using C4NP
Ruhmer, K.; Laine, E.; O'Donnell, K.; Kostetsky, J.; Hauck, K.; Manessis, D.; Ostmann, A.; Töpper, M.; Jürgensen, N. | Conference Paper |
| 2007 | Aqueous-base-developable benzocyclobutene (BCB)-based material - An emerging dielectric material for microelectronics
So, Y.-H.; Stark, E.; Kisting, S.; Scheck, D.; Baranek, K.; Toepper, M.; Baumgartner, T. | Conference Paper |
| 2007 | Conformal coating and patterning of 3D structures on wafer level with electrophoretic photoresists
Fischer, T.; Töpper, M.; Jürgensen, N.; Ehrmann, O.; Wiemer, M.; Reichl, H. | Conference Paper |
| 2007 | Copper / Benzocyclobutene multi layer wiring - A Flexible base technology for wafer level integration of passive components
Zoschke, K.; Wolf, J.; Ehrmann, O.; Toepper, M.; Reichl, H. | Conference Paper |
| 2007 | Electromagnetic compatibility of two novel packaging concepts of an inductively powered neural interface
Kim, S.; Wilke, M.; Klein, M.; Toepper, M.; Solzbacher, F. | Conference Paper |
| 2007 | Evaluation of micro structured glass layers as dielectric-and passivation material for wafer level integrated thin film capacitors and resistors
Zoschke, K.; Feige, C.; Wolf, J.; Mund, D.; Töpper, M.; Ehrmann, O.; Schmückle, F.J.; Reichl, H. | Conference Paper |
| 2007 | Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H. | Journal Article |
| 2007 | Low cost UBM for lead free solder bumping with C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M. | Conference Paper |
| 2007 | Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H. | Conference Paper |
| 2007 | Switchable polymer-based thin film coils as a power module for wireless neural interfaces
Kim, S.; Zoschke, K.; Klein, M.; Black, D.; Buschick, K.; Toepper, M.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Solzbacher, F. | Journal Article |
| 2007 | System integration of the utah electrode array using a biocompatible flip chip under bump metallization scheme
Bhandari, R.; Negi, S.; Rieth, L.; Toepper, M.; Kim, S.; Klein, M.; Oppermann, H.; Normann, R.A.; Solzbacher, F. | Conference Paper |
| 2007 | Wafer bonding with BCB and SU-8 for MEMS packaging
Wiemer, M.; Jia, C.; Toepper, M.; Hauck, K. | Conference Paper |
| 2007 | Wafer level processing of silicon arrays for implantable medical devices
Bhandari, R.; Negi, S.; Rieth, L.; Töpper, M.; Normann, R.A.; Solzbacher, F. | Conference Paper |
| 2006 | Aqueous-base-developable benzocyclobutene (BCB)-based material curable in air
So, Y.-H.; Stark, E.J.; Li, Y.; Kisting, S.; Achen, A.; Baranek, K.; Scheck, D.; Hetzner, J.; Folkenroth, J.J.; Töpper, M.; Baumgartner, T. | Journal Article |
| 2006 | Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F. | Conference Paper |
| 2006 | Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Dietrich, L.; Toepper, M.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2006 | Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H. | Conference Paper, Journal Article |
| 2006 | FEA simulation of thin film coils to power wireless neural interfaces
Kim, S.; Scholz, O.; Zoschke, K.; Harrison, R.; Solzbacher, F.; Klein, M.; Toepper, M. | Conference Paper |
| 2006 | Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N. | Conference Paper |
| 2006 | Polymer based thin film coils as a power module of wireless neural interfaces
Kim, S.; Buschick, K.; Zoschke, K.; Klein, M.; Toepper, M.; Black, D.; Harrison, R.; Tathireddy, P.; Solzbacher, F. | Conference Paper |
| 2006 | Thin film substrate technology and FC interconnection for very high frequency applications
Töpper, M.; Rosin, T.; Fritzsch, T.; Jordan, R.; Mekonnen, G.; Sakkas, C.; Kunkel, R.; Scherpinski, K.; Schmidt, D.; Oppermann, H.; Dietrich, L.; Beling, A.; Eckhardt, T.; Bach, H.-G.; Reichl, H. | Conference Paper |
| 2006 | WLCSP technology direction
Töpper, M.; Claw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H. | Journal Article |
| 2005 | Capacitive humidity sensors based on oxidized photoBCB polymer films: Enhanced sensitivity and response time
Tetelin, A.; Pellet, C.; Achen, A.; Toepper, M. | Conference Paper |
| 2005 | Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J. | Conference Paper |
| 2005 | Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H. | Conference Paper |
| 2005 | Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Oppermann, H.; Hutter, M.; Klein, M.; Engelmann, G.; Töpper, M.; Wolf, J. | Conference Paper |
| 2005 | Herstellung dünner Chip-Kontaktierungsmetallisierungen auf der Basis von Lift-off und PVD
Hauck, K.; Samulewicz, K.; Jürgensen, N.; Töpper, M.; Ehrmann, O.; Reichl, H. | Journal Article |
| 2005 | Novel Hermetic WLP Technology using Low-Temperature Passivation
Töpper, M.; Leib, J.; Mund, D. | Conference Paper |
| 2005 | Photo-Resist Technology for Wafer Level Packaging and MEMS Applications
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Baumgartner, T.; Reichl, H.; Tönnies, D. | Conference Paper |
| 2005 | A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps
Töpper, M.; Voigt, A.; Heinrich, M.; Hauck, K.; Mientus, R.; Gruetzner, G.; Ehrmann, O. | Conference Paper |
| 2005 | Technologien, Anwendungen und Zukunft des WLP
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2005 | Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2005 | W-band flip-chip VCO in thin-film environment
Töpper, M.; Schmückle, F.J.; Lenk, F.; Hutter, M.; Klein, M.; Oppermann, H.; Engelmann, G.; Riepe, K.; Heinrich, W. | Conference Paper |
| 2005 | Wafer Level Fabrication of Integrated Passive Components
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2005 | Water solubility and diffusivity in BCB resins used in microelectronic packaging and sensor applications
Tetelin, A.; Achen, A.; Pouget, V.; Pellet, C.; Töpper, M.; Lachaud, J.-L. | Conference Paper |
| 2005 | WLP Photoresists for the 21st Century
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Fischer, T.; Baumgartner, T.; Reichl, H. | Conference Paper |
| 2004 | Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2004 | New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications
Leib, R.; Töpper, M. | Conference Paper |
| 2004 | Novel Microstructuring Technology for Glass on Silicon and Glass - Substrates
Töpper, M.; Mund, D.; Leib, J. | Conference Paper |
| 2004 | Thin film integration of passives - single components, filters, integrated passive devices
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J. | Conference Paper |
| 2004 | The wafer-level packaging evolution
Töpper, M.; Garrou, P. | Journal Article |
| 2003 | Interfacial adhesion analysis of BCB / TiW / Cu / PbSn technology in wafer level packaging
Töpper, M.; Achen, A.; Reichl, H. | Conference Paper |
| 2002 | 300mm Wafer Bumping: Printing Systems and Technologies
Töpper, M.; Kloesner, J.; Kasulke, P.; Denise, O.; Myers, J.; Heyen, R. | Conference Paper |
| 2001 | "SECAP" International Advanced Packaging Consortium: Formed to Standardize Process Equipment for Wafer Level Packaging Technologies for 300mm
Töpper, M.; Reichl, H. | Journal Article |
| 2001 | Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
Toepper, M.; Stolle, T.; Krabe, D.; Chmiel, G.; Schammler, G.; Reichl, H. | Patent |
| 2000 | The european CSP perspective
Töpper, M.; Schubert, A.; Reichl, H. | Journal Article |
| 2000 | Fab integrated packaging (FIP): A new concept for high reliability wafer-level chip size packaging
Töpper, M.; Auersperg, J.; Glaw, V.; Kaskoun, K.; Prack, E.; Keser, B.; Coskina, P.; Jäger, D.; Petter, D.; Ehrmann, O.; Samulewicz, K.; Meinherz, C.; Fehlberg, S.; Karduck, C.; Reichl, H. | Conference Paper |
| 2000 | First MCM-D modules for the b-physics layer of the ATLAS pixel detector
Töpper, M.; Bäsken, O.; Becks, K.-H.; Ehrmann, O.; Gerlach, P.; Grah, C.; Gregor, I.M.; Linder, C.; Meuser, S.; Richardson, J.; Wolf, J. | Journal Article |
| 2000 | High density pixel detector module using flip chip and thin film technology
Wolf, J.; Gerlach, P.; Beyne, E.; Töpper, M.; Dietrich, L.; Becks, K.H.; Wermes, N.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2000 | Manufacturing a CSP at wafer level
Simon, J.; Wolf, J.; Kallmayer, C.; Töpper, M.; Reichl, H. | Conference Paper |
| 2000 | Reliability of flip chip and chip size packages
Reichl, H.; Schubert, A.; Töpper, M. | Conference Paper, Journal Article |
| 2000 | Surface modification due to technological treatment evaluated by SPM and XPS techniques
Krause, F.; Halser, K.; Töpper, M.; Scherpinski, K. | Conference Paper |
| 2000 | Thin chip integration (TCI-modules) - a novel technique for manufacturing three dimensional IC-packages
Töpper, M.; Scherpinski, K.; Spörle, H.-P.; Landesberger, C.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2000 | Wafer level chip size package challenges
Töpper, M.; Reichl, H. | Journal Article |
| 2000 | Wafer level package using double balls
Töpper, M.; Glaw, V.; Coskina, P.; Auersperg, J.; Samulewicz, K.; Lange, M.; Karduck, C.; Fehlberg, S.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2000 | Wafer-level chip size package (WL-CSP)
Töpper, M.; Fehlberg, S.; Scherpinski, K.; Karduck, C.; Glaw, V.; Heinricht, K.; Coskina, P.; Ehrmann, O.; Reichl, H. | Journal Article |
| 1999 | Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H. | Book Article |
| 1999 | Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
Töpper, M.; Dietrich, L.; Engelmann, G.; Fehlberg, S.; Gerlach, P.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H. | Conference Paper |
| 1999 | Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu/PbSn technology
Töpper, M.; Gerlach, P.; Dietrich, L.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H. | Journal Article |
| 1999 | Integration of NiCr resistors in a multilayer Cu/BCB wiring system
Scherpinski, K.; Töpper, M.; Hahn, R.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1999 | Low cost electroless copper metallization of BCB for high-density wiring systems
Töpper, M.; Stolle, T.; Reichl, H. | Conference Paper |
| 1999 | A MCM-D-type module for the atlas pixel detector
Becks, K.H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Töpper, M.; Truzzi, C.; Wolf, J. | Journal Article |
| 1999 | Oberflächen- und Schichtcharakterisierung bei der Herstellung von Dünnfilm-NiCr-Widerständen
Töpper, M.; Scherpinski, K.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H. | Journal Article |
| 1999 | Schablonendruck für Flip Chip and Waferlevel CSP
Töpper, M.; Coskina, P.; Kloeser, J.; Jung, E.; Achenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Wafer Bumping for Wafer-Level CSPs and Flip Chips using Stencil Printing Technology
Töpper, M.; Coskina, P.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H. | Conference Paper |
| 1998 | Chip size package - the option of choice for miniaturized medical devices
Töpper, M.; Schaldach, M.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Heinricht, K.; Bader, V.; Hoster, L.; Coskina, P.; Kloeser, J.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1998 | Combination of MCM-C technology with MCM-D technology using photosensitive polymers
Töpper, M.; Scherpinski, K.; Hahn, R.; Ehrmann, O.; Reichl, H.; Schmaus, C.; Bechtold, F. | Conference Paper |
| 1998 | Deployment of State-of -the-Art Technology for Implantable Medical Systems
Töpper, M.; Schaldach, M.; Müller, J.; Starke, M.; Tessier, T.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1998 | Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M. | Conference Paper |
| 1998 | Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H. | Journal Article |
| 1998 | A multichip module integration technology for high-speed analog and digital applications
Töpper, M.; Mangold, T.; Wolf, J.; Reichl, H.; Russer, P. | Conference Paper |
| 1998 | Novel packaging concept for high power multichip modules
Hahn, R.; Töpper, M.; Reichl, H. | Journal Article |
| 1997 | BCB - a polymer for thinfilm applications
Töpper, M.; Ehrmann, O.; Reichl, H.; Glaw, V.; Wolf, J.; Fischbeck, G.; Petermann, K. | Conference Paper |
| 1997 | Dünnfilmmehrlagenverdrahtung mit photosensitivem BCB auf Keramik-, Dickschicht- und LTCC-Substraten für MCM
Töpper, M.; Glaw, V.; Hahn, R.; Schaldach, M.; Schmaus, C.; Bechtold, F.; Reichl, H. | Conference Paper |
| 1997 | Embedding technology - a chip-first approach using BCB
Töpper, M.; Buschick, K.; Wolf, J.; Glaw, V.; Hahn, R.; Dabek, A.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1997 | High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1997 | High power multi chip modules employing the planar embedding technique and microchannel water heat sinks
Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Töpper, M.; Ehrmann, O.; Reichl, H. | Journal Article |
| 1997 | High power multichip modules employing the planar embedding technique and microchannel water heat sinks
Töpper, M.; Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1997 | Laser machining of ceramics for MCM-D applications
Glaw, V.; Hahn, R.; Wolf, J.; Töpper, M.; Buschick, K.; Hein, U.; Ginolas, A.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1997 | Multichip-modules for high frequency applications
Wolf, J.; Schmückle, S.J.; Owzar, A.; Töpper, M.; Buschick, K.; Reichl, H. | Conference Paper |
| 1997 | System Integration for High Frequency Applications
Töpper, M.; Wolf, J.; Schmückle, F.J.; Heinrich, W.; Buschick, K.; Owzar, A.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1997 | Der Weg zum Chip-Size-Package
Töpper, M.; Reichl, H. | Journal Article |
| 1996 | Alternative solder deposition using transfer technique
Töpper, M.; Wolf, J.; Reichl, H. | Conference Paper |
| 1996 | Design concept for singlemode polymer waveguides
Töpper, M.; Fischbeck, G.; Moosburger, R.; Petermann, K. | Journal Article |
| 1996 | Fabrication of high power MCMs by planar embedding technique and active cooling
Töpper, M.; Hahn, R.; Wolf, J.; Glaw, V.; Buschick, K.; Hoehne, J.; Schmidt, M.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1996 | Integrated thermo-optical switch based on polymer rib waveguides
Töpper, M.; Moosburger, R.; Fischbeck, G.; Kostrzewa, C.; Petermann, K. | Conference Paper |
| 1996 | MCM-D with embedded active and passive components
Töpper, M.; Wolf, J.; Glaw, V.; Buschick, K.; Dabek, A.; Dietrich, L.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1996 | Mehrlagenverdrahtung für MCM-D und Chip Size Package
Töpper, M.; Buschick, K.; Wolf, J.; Dietrich, L.; Ehrmann, O. | Book Article |
| 1996 | Metallisierung von Polymeren für Dünnfilmverdrahtungen
Töpper, M.; Schmidt, R.; Hannemann, M.; Schammler, G.; Hempel, G. | Journal Article |
| 1996 | Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
Toepper, M.; Stolle, T.; Krabe, D.; Chmiel, G.; Schammler, G.; Reichl, H. | Patent |
| 1996 | The photolysis of pure and mixed palladium acetate thin films
Töpper, M.; Stolle, T.; Wäsche, M. | Journal Article |
| 1996 | Redistribution technology for chip scale package using photosensitive BCB
Töpper, M.; Simon, J.; Reichl, H. | Journal Article |
| 1996 | Thin film technologies for single-mode polymer waveguides
Töpper, M.; Fischbeck, G.; Moosburger, R.; Petermann, K.; Krabe, D.; Reichl, H. | Conference Paper |
| 1995 | A comparison of flip chip technology with chip size packages
Simon, J.; Töpper, M.; Reichl, H.; Chmiel, G. | Conference Paper |
| 1995 | On-Chip Umverdrahtung - eine Möglichkeit zur Anpassung von Chip- und Leiterplattenraster
Chmiel, G.; Töpper, M.; Simon, J.; Reichl, H. | Conference Paper |
| 1994 | Thinfilm multichip modules - Process development using photosensitive benzocyclobutane
Chmiel, G.; Töpper, M.; Jöhren, C.; Achen, A. | Conference Paper |