Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A.
Conference Paper
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Conference Paper
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.
Conference Paper
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.
Conference Paper
2017Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.
Conference Paper
2017Klebeverfahren zum Verbinden zweier Wafer
Zoschke, Kai; Töpper, Michael
Patent
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei
Conference Paper
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D.
Conference Paper
2016Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, K.; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D.
Conference Paper
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Conference Paper
2016Wafer level chip scale packaging
Töpper, M.
Book Article
2015Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.
Conference Paper
2015Next generation thin film polymers for WLP applications and their mechanical characterization
Woehrmann, M.; Fischer, T.; Walter, H.; Toepper, M.; Lang, K.-D.
Conference Paper
2015Single-mode board-level interconnects for silicon photonics
Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T.
Conference Paper
2015A sub-4 µm via technology of thinfilm polymers using scanning laser ablation
Töpper, M.; Hauck, K.; Schima, M.; Jaeger, D.; Lang, K.-D.
Conference Paper
2015Thin wafer handling using mechanical- or laser-debondable temporary adhesives
Fleming, D.; Kim, J.-U.; Okada, J.; Wang, K.; Gallagher, M.; Barr, B.; Calvert, J.; Zoschke, K.; Wegner, M.; Töpper, M.; Rapps, T.; Griesbach, T.; Lutter, S.
Conference Paper
2014Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics
Wöhrmann, M.; Fischer, T.; Walter, H.; Töpper, M.; Lang, K.-D.
Conference Paper
2014A critical review of corrosion phenomena in microelectronic systems
Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf
Conference Paper
2014Development of a high density glass interposer based on wafer level packaging technologies
Töpper, Michael; Wöhrmann, Markus; Brusberg, Lars; Jürgensen, Nils; Ndip, Ivan; Lang, Klaus-Dieter
Conference Paper
2014Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter
Conference Paper
2014Korrosionsphänomene im mikroelektronischen System
Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter
Journal Article
2013Bumping technologies
Töpper, Michael; Lu, D.
Book Article
2013Design, fabrication and testing of silicon-integrated Li-ion secondary micro batteries with side-by-side electrodes
Hoeppner, K.; Ferch, M.; Eisenreich, M.; Marquardt, K.; Hahn, R.; MacKowiak, P.; Mukhopadhyay, B.; Ngo, H.-D.; Gernhardt, R.; Toepper, M.; Lang, K.-D.
Conference Paper
2013Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test
Wunderle, B.; Manier, C.-A.; Abo Ras, M.; Springborn, M.; May, D.; Oppermann, H.; Toepper, M.; Mrossko, R.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Conference Paper
2013Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging
Hansen, U.; Maus, S.; Töpper, M.
Conference Paper
2013Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
Lin, D.-S.; Wodnicki, R.; Zhuang, X.; Woychik, C.; Thomenius, K.E.; Fisher, R.A.; Mills, D.M.; Byun, A.J.; Burdick, W.; Khuri-Yakub, P.; Bonitz, B.; Davies, T.; Thomas, G.; Otto, B.; Töpper, M.; Fritzsch, T.; Ehrmann, O.
Journal Article
2013Strain energy driven adhesion test for adherence characterization of thin polymer films for microelectronic applications
Wöhrmann, M.; Töpper, M.; Lang, K.-D.
Conference Paper
2013Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Oliver, M.; Kim, J.-U.; Wang, Z.; Okada, J.; Iagodkine, E.; Choubey, A.; Anzures, E.; Fleming, D.; Dhoble, A.; Truong, C.; Gallagher, M.; Zoschke, K.; Wegner, M.; Töpper, M.
Conference Paper
2013Verfahren zum Herstellen einer Beschichtung eines Substrats
Wilke, Martin; Töpper, Michael
Patent
2013Wafer level packaging for ultra thin (6 µm) high brightness LEDs using embedding technology
Kleff, J.; Töpper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S.
Conference Paper
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Coating techniques for 3D-packaging applications
Töpper, M.; Wilke, M.; Röder, J.; Fischer, T.; Lopper, C.
Conference Paper
2012Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article, Conference Paper
2012High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing
Itabashi, T.; Kotani, M.; Zussman, M.P.; Zoschke, K.; Fischer, T.; Töpper, M.; Ishida, H.
Conference Paper
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael
Journal Article
2012Innovation Driver of the Next Decade: Technology Follows Application
Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M.
Book Article
2012Low temperature wafer level bonding using benzocyclobutene adhesive polymers
Gallagher, M.; Kim, J.-U.; Huenger, E.; Zoschke, K.; Lopper, C.; Toepper, M.
Conference Paper
2012Modelling and characterisation of smart power devices
Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.
Conference Paper
2012Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012Process modeling of dry etching for the 3D-integration with tapered TSVs
Wilke, M.; Töpper, M.; Huynh, H.Q.; Lang, K.D.
Conference Paper
2012Silicon integrated micro batteries based on deep reactive ion etching and through silicon via technologies
Hahn, R.; Marquardt, K.; Thunman, M.; Töpper, M.; Wilke, M.; Ferch, M.; Huynh, Q.H.; Lang, K.D.
Conference Paper
20113D stacking approaches for mold embedded packages
Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2011Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D.
Journal Article
2011Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Conference Paper
2011High channel-count neural interfaces for multiple degree-of-freedom neuroprosthetics
Rieth, L.; Franklin, R.; Tathireddy, P.; Sharma, R.; Williams, L.; Tenore, F.; Merugu, S.; Rothermund, M.; Jaeger, D.; Töpper, M.; Oppermann, H.; Harrison, R.; Solzbacher, F.
Conference Paper
2011Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article
2011Low temperature cure of BCB and the influence on the mechanical stress
Wöhrmann, M.; Töpper, M.; Walter, H.; Lang, K.-D.
Conference Paper
2011Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M.
Conference Paper
2011Prospects and limits in wafer-level-packaging of image sensors
Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D.
Conference Paper
2011Ultra low temperature PBO-polymer for wafer level packaging applications
Töpper, Michael; Fischer, Thorsten; Bader, V.; Lang, Klaus-Dieter; Matsuie, N.; Motobe, T.; Minegishi, T.; Knaus, M.
Conference Paper
2011Wafer-level glass-caps for advanced optical applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Zoschke, K.; Toepper, M.
Conference Paper
20103-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.
Conference Paper
2010Anodic bonding at low voltage using microstructured borosilicate glass thin-films
Leib, J.; Hansen, U.; Maus, S.; Feindt, H.; Hauck, K.; Zoschke, K.; Toepper, M.
Conference Paper
2010Carrierless design for handling and processing of ultrathin wafers
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Seng, T.C.; Tabuchi, T.
Conference Paper
2010A comparison of thin film polymers for wafer level packaging
Töpper, M.; Fischer, T.; Baumgartner, T.; Reichl, H.
Conference Paper
2010Development of charged particle detectors by integrating gas amplification stages and CMOS ASICs on wafer level
Kaminski, J.; Baumgartner, T.; Desch, K.; Ehrmann, O.; Fritzsch, T.; Krautscheid, T.; Mayer, S.; Töpper, M.
Conference Paper
2010Dry film photo resists and polymers - The low cost option for standard and 3-D wafer level packaging
Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.-D.; Liebsch, W.; Ehlin, M.; Itabashi, T.
Conference Paper
2010Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010Hermetic BSG thin film coatings for harsh environment applications
Maus, S.; Hansen, U.; Leib, J.; Toepper, M.
Conference Paper
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2010Integration of carrierless ultrathin wafers into a TSV process flow
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Fischer, T.; Röder, J.; Dietrich, L.; Tabuchi, T.
Conference Paper
2010Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2010Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices
Hansen, U.; Maus, S.; Leib, J.; Toepper, M.
Conference Paper
2010Tapered through-silicon-via interconnects for wafer-level packaging of sensor devices
Leib, J.; Bieck, F.; Hansen, U.; Looi, K.-K.; Ngo, H.-D.; Seidemann, V.; Shariff, D.; Studzinski, D.; Suthiwongsunthorn, N.; Tan, K.; Wilke, R.; Yam, K.-L.; Töpper, M.
Journal Article
2010Wafer level processing of integrated passive components using polyimide or polybenzoxazole/copper multilayer technology
Zoschke, K.; Fischer, T.; Töpper, M.; Samulewicz, K.; Wünsch, O.; Röder, J.; Lutz, M.; Ehrmann, O.; Reichl, H.
Journal Article
2010Wafer-level glass capping with optical integration
Hansen, U.; Maus, S.; Leib, J.; Toepper, M.
Conference Paper
2009A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level
Baumgartner, T.; Töpper, M.; Klein, M.; Schmid, B.; Knödler, D.; Kuisma, H.; Nurmi, S.; Kattelus, H.; Dekker, J.; Schachler, R.
Conference Paper
20093-D Thin Chip Integration Technology - from Technology Development to Application
Fritzsch, T.; Mrossko, R.; Baumgartner, T.; Toepper, M.; Klein, M.; Wolf, J.; Wunderle, B.; Reichl, H.
Conference Paper
2009Bauteilanordnung und Verfahren zu dessen Herstellung
Oppermann, H.; Klein, M.; Toepper, M.; Wolf, J.
Patent
2009BCB with nano-filled BaSrTiO3 for thin film capacitors
Töpper, M.; Fischer, T.; Zoschke, K.; Zang, M.; Teipel, U.; Fehrenbacher, U.; Reichl, H.
Conference Paper
2009A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Hahn, R.; Marquardt, K.; Blechert, M.; Lehmann, M.; Töpper, M.; Wilke, M.; Semionyk, P.; Reichl, H.
Conference Paper
2009Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Marquardt, K.; Hahn, R.; Blechert, M.; Lehmann, M.; Töpper, M.; Reichl, H.
Conference Paper, Journal Article
2009Electrical modeling and analysis of the impact of slits on microstrip lines in thin film polymer layers
Ndip, I.; Töpper, M.; Becker, K.-F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Fabrication of 3-D microstructures with permanent dielectric dry film
Baumgartner, T.; Hauck, K.; Zoschke, K.; Töpper, M.; Uno, H.; Liebsch, W.; Yun, H.; Ehlin, M.J.; Dietz, K.H.
Conference Paper
2009A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level
Maus, S.; Hansen, U.; Leib, J.; Töpper, M.
Conference Paper, Journal Article
2009Heterogeneous Integration
Reichl, H.; Aschenbrenner, R.; Töpper, M.; Pötter, H.
Book Article
2009Integrated wireless neural interface based on the Utah electrode array
Kim, S.; Bhandari, R.; Klein, M.; Negi, S.; Rieth, L.; Tathireddy, P.; Töpper, M.; Oppermann, H.; Solzbacher, F.
Journal Article
2009Low cost wafer-level 3-D integration without TSV
Töpper, M.; Baumgartner, T.; Klein, M.; Fritzsch, T.; Roeder, J.; Lutz, M.; Suchodoletz, M. von; Oppermann, H.; Reichl, H.
Conference Paper
2009Novel multi-layer wiring build-up using electrochemical pattern replication (ECPR)
Fredenberg, M.; Möller, P.; Töpper, M.
Conference Paper
2009Photonic system-in-package technologies using thin glass substrates
Brusberg, L.; Schröder, H.; Töpper, M.; Reichl, H.
Conference Paper
2009PICSiP: New system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems
Tekin, T.; Töpper, M.; Reichl, H.
Conference Paper
2009Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation
Hansen, U.; Maus, S.; Leib, J.; Töpper, M.
Conference Paper, Journal Article
2009Thin glass based packaging technologies for optoelectronic modules
Brusberg, L.; Schröder, H.; Töpper, M.; Arndt-Staufenbiel, N.; Röder, J.; Lutz, M.; Reichl, H.
Conference Paper
2009Thin hermetic borosilicate glass layers for highly reliable chip-passivations in wafer-level-packaging
Hansen, U.; Leib, J.; Maus, S.; Gyenge, O.; Töpper, M.
Conference Paper
2009Thin hermetic passivation of semiconductors using low temperature borosilicate glass - Benchmark of a new wafer-level packaging technology
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Fischer, T.; Zoschke, K.; Toepper, M.
Conference Paper
2009Wafer level chip scale packaging
Töpper, Michael
Book Article
2008Funktionseinheit und Verfahren zu deren Herstellung
Wolf, J.; Zoschke, K.; Fischer, T.; Toepper, M.; Reichl, H.
Patent
2008Low Temperature Au-Au Flip Chip Interconnections
Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Neue Verfahren und Werkstoffe für Halbleiterkomponenten
Pötter, H.; Becker, K.-F.; Hampicke, M.; Lang, K.-D.; Schmitz, S.; Töpper, M.
Journal Article
2008Through silicon vias as enablers for 3D systems
Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M.
Conference Paper
2008Verfahren und Vorrichtung zum stoffschluessigen Fuegen metallischer Anschlussstrukturen
Zwanzig, M.; Fiedler, S.; Schmidt, R.; Scheel, W.; Toepper, M.
Patent
2008Verfahren zur Herstellung einer Lotmetallisierung
Hutter, M.; Engelmann, G.; Töpper, M.; Oppermann, H.
Patent
2007Alternative UBM for Lead Free Solder Bumping using C4NP
Ruhmer, K.; Laine, E.; O'Donnell, K.; Kostetsky, J.; Hauck, K.; Manessis, D.; Ostmann, A.; Töpper, M.; Jürgensen, N.
Conference Paper
2007Aqueous-base-developable benzocyclobutene (BCB)-based material - An emerging dielectric material for microelectronics
So, Y.-H.; Stark, E.; Kisting, S.; Scheck, D.; Baranek, K.; Toepper, M.; Baumgartner, T.
Conference Paper
2007Conformal coating and patterning of 3D structures on wafer level with electrophoretic photoresists
Fischer, T.; Töpper, M.; Jürgensen, N.; Ehrmann, O.; Wiemer, M.; Reichl, H.
Conference Paper
2007Copper / Benzocyclobutene multi layer wiring - A Flexible base technology for wafer level integration of passive components
Zoschke, K.; Wolf, J.; Ehrmann, O.; Toepper, M.; Reichl, H.
Conference Paper
2007Electromagnetic compatibility of two novel packaging concepts of an inductively powered neural interface
Kim, S.; Wilke, M.; Klein, M.; Toepper, M.; Solzbacher, F.
Conference Paper
2007Evaluation of micro structured glass layers as dielectric-and passivation material for wafer level integrated thin film capacitors and resistors
Zoschke, K.; Feige, C.; Wolf, J.; Mund, D.; Töpper, M.; Ehrmann, O.; Schmückle, F.J.; Reichl, H.
Conference Paper
2007Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H.
Journal Article
2007Low cost UBM for lead free solder bumping with C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Conference Paper
2007Packaging concepts for neuroprosthetic implants
Töpper, M.; Klein, M.; Wilke, M.; Oppermann, H.; Kim, S.; Tathireddy, P.; Solzbacher, F.; Reichl, H.
Conference Paper
2007Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H.
Conference Paper
2007Prospects and yield of electrochemical wafer plating for bumping and signal routing
Dietrich, L.; Töpper, M.; Fritzsch, Th.; Ehrmann, O.; Reichl, H.
Conference Paper
2007Switchable polymer-based thin film coils as a power module for wireless neural interfaces
Kim, S.; Zoschke, K.; Klein, M.; Black, D.; Buschick, K.; Toepper, M.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Solzbacher, F.
Journal Article
2007System integration of the utah electrode array using a biocompatible flip chip under bump metallization scheme
Bhandari, R.; Negi, S.; Rieth, L.; Toepper, M.; Kim, S.; Klein, M.; Oppermann, H.; Normann, R.A.; Solzbacher, F.
Conference Paper
2007UBM structures for lead free solder bumping using C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Conference Paper
2007Wafer bonding with BCB and SU-8 for MEMS packaging
Wiemer, M.; Jia, C.; Toepper, M.; Hauck, K.
Conference Paper
2007Wafer level processing of silicon arrays for implantable medical devices
Bhandari, R.; Negi, S.; Rieth, L.; Töpper, M.; Normann, R.A.; Solzbacher, F.
Conference Paper
2006Aqueous-base-developable benzocyclobutene (BCB)-based material curable in air
So, Y.-H.; Stark, E.J.; Li, Y.; Kisting, S.; Achen, A.; Baranek, K.; Scheck, D.; Hetzner, J.; Folkenroth, J.J.; Töpper, M.; Baumgartner, T.
Journal Article
2006Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F.
Conference Paper
2006Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Dietrich, L.; Toepper, M.; Ehrmann, O.; Reichl, H.
Conference Paper
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper, Journal Article
2006FEA simulation of thin film coils to power wireless neural interfaces
Kim, S.; Scholz, O.; Zoschke, K.; Harrison, R.; Solzbacher, F.; Klein, M.; Toepper, M.
Conference Paper
2006Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N.
Conference Paper
2006Polymer based thin film coils as a power module of wireless neural interfaces
Kim, S.; Buschick, K.; Zoschke, K.; Klein, M.; Toepper, M.; Black, D.; Harrison, R.; Tathireddy, P.; Solzbacher, F.
Conference Paper
2006Thin film substrate technology and FC interconnection for very high frequency applications
Töpper, M.; Rosin, T.; Fritzsch, T.; Jordan, R.; Mekonnen, G.; Sakkas, C.; Kunkel, R.; Scherpinski, K.; Schmidt, D.; Oppermann, H.; Dietrich, L.; Beling, A.; Eckhardt, T.; Bach, H.-G.; Reichl, H.
Conference Paper
2006WLCSP technology direction
Töpper, M.; Claw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Journal Article
2005Capacitive humidity sensors based on oxidized photoBCB polymer films: Enhanced sensitivity and response time
Tetelin, A.; Pellet, C.; Achen, A.; Toepper, M.
Conference Paper
2005Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper
2005Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2005Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Oppermann, H.; Hutter, M.; Klein, M.; Engelmann, G.; Töpper, M.; Wolf, J.
Conference Paper
2005Herstellung dünner Chip-Kontaktierungsmetallisierungen auf der Basis von Lift-off und PVD
Hauck, K.; Samulewicz, K.; Jürgensen, N.; Töpper, M.; Ehrmann, O.; Reichl, H.
Journal Article
2005The importance of polymers in wafer-level packaging
Töpper, M.
Conference Paper
2005Novel Hermetic WLP Technology using Low-Temperature Passivation
Töpper, M.; Leib, J.; Mund, D.
Conference Paper
2005Photo-Resist Technology for Wafer Level Packaging and MEMS Applications
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Baumgartner, T.; Reichl, H.; Tönnies, D.
Conference Paper
2005A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps
Töpper, M.; Voigt, A.; Heinrich, M.; Hauck, K.; Mientus, R.; Gruetzner, G.; Ehrmann, O.
Conference Paper
2005Technologien, Anwendungen und Zukunft des WLP
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Technology requirements for chip-on-chip packaging solutions
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005W-band flip-chip VCO in thin-film environment
Töpper, M.; Schmückle, F.J.; Lenk, F.; Hutter, M.; Klein, M.; Oppermann, H.; Engelmann, G.; Riepe, K.; Heinrich, W.
Conference Paper
2005Wafer Level Fabrication of Integrated Passive Components
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Water solubility and diffusivity in BCB resins used in microelectronic packaging and sensor applications
Tetelin, A.; Achen, A.; Pouget, V.; Pellet, C.; Töpper, M.; Lachaud, J.-L.
Conference Paper
2005WLCSP technology direction
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Conference Paper
2005WLP Photoresists for the 21st Century
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Fischer, T.; Baumgartner, T.; Reichl, H.
Conference Paper
2004Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications
Leib, R.; Töpper, M.
Conference Paper
2004Novel Microstructuring Technology for Glass on Silicon and Glass - Substrates
Töpper, M.; Mund, D.; Leib, J.
Conference Paper
2004Thin film integration of passives - single components, filters, integrated passive devices
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper
2004The wafer-level packaging evolution
Töpper, M.; Garrou, P.
Journal Article
2003Interfacial adhesion analysis of BCB / TiW / Cu / PbSn technology in wafer level packaging
Töpper, M.; Achen, A.; Reichl, H.
Conference Paper
2002300mm Wafer Bumping: Printing Systems and Technologies
Töpper, M.; Kloesner, J.; Kasulke, P.; Denise, O.; Myers, J.; Heyen, R.
Conference Paper
2001"SECAP" International Advanced Packaging Consortium: Formed to Standardize Process Equipment for Wafer Level Packaging Technologies for 300mm
Töpper, M.; Reichl, H.
Journal Article
2001Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
Toepper, M.; Stolle, T.; Krabe, D.; Chmiel, G.; Schammler, G.; Reichl, H.
Patent
2000The european CSP perspective
Töpper, M.; Schubert, A.; Reichl, H.
Journal Article
2000Fab integrated packaging (FIP): A new concept for high reliability wafer-level chip size packaging
Töpper, M.; Auersperg, J.; Glaw, V.; Kaskoun, K.; Prack, E.; Keser, B.; Coskina, P.; Jäger, D.; Petter, D.; Ehrmann, O.; Samulewicz, K.; Meinherz, C.; Fehlberg, S.; Karduck, C.; Reichl, H.
Conference Paper
2000First MCM-D modules for the b-physics layer of the ATLAS pixel detector
Töpper, M.; Bäsken, O.; Becks, K.-H.; Ehrmann, O.; Gerlach, P.; Grah, C.; Gregor, I.M.; Linder, C.; Meuser, S.; Richardson, J.; Wolf, J.
Journal Article
2000High density pixel detector module using flip chip and thin film technology
Wolf, J.; Gerlach, P.; Beyne, E.; Töpper, M.; Dietrich, L.; Becks, K.H.; Wermes, N.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Manufacturing a CSP at wafer level
Simon, J.; Wolf, J.; Kallmayer, C.; Töpper, M.; Reichl, H.
Conference Paper
2000Reliability of flip chip and chip size packages
Reichl, H.; Schubert, A.; Töpper, M.
Conference Paper, Journal Article
2000Surface modification due to technological treatment evaluated by SPM and XPS techniques
Krause, F.; Halser, K.; Töpper, M.; Scherpinski, K.
Conference Paper
2000Thin chip integration (TCI-modules) - a novel technique for manufacturing three dimensional IC-packages
Töpper, M.; Scherpinski, K.; Spörle, H.-P.; Landesberger, C.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Wafer level chip size package challenges
Töpper, M.; Reichl, H.
Journal Article
2000Wafer level package using double balls
Töpper, M.; Glaw, V.; Coskina, P.; Auersperg, J.; Samulewicz, K.; Lange, M.; Karduck, C.; Fehlberg, S.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Wafer-level chip size package (WL-CSP)
Töpper, M.; Fehlberg, S.; Scherpinski, K.; Karduck, C.; Glaw, V.; Heinricht, K.; Coskina, P.; Ehrmann, O.; Reichl, H.
Journal Article
1999Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H.
Book Article
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
Töpper, M.; Dietrich, L.; Engelmann, G.; Fehlberg, S.; Gerlach, P.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.
Conference Paper
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu/PbSn technology
Töpper, M.; Gerlach, P.; Dietrich, L.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.
Journal Article
1999Integration of NiCr resistors in a multilayer Cu/BCB wiring system
Scherpinski, K.; Töpper, M.; Hahn, R.; Ehrmann, O.; Reichl, H.
Conference Paper
1999Low cost electroless copper metallization of BCB for high-density wiring systems
Töpper, M.; Stolle, T.; Reichl, H.
Conference Paper
1999A MCM-D-type module for the atlas pixel detector
Becks, K.H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Töpper, M.; Truzzi, C.; Wolf, J.
Journal Article
1999Oberflächen- und Schichtcharakterisierung bei der Herstellung von Dünnfilm-NiCr-Widerständen
Töpper, M.; Scherpinski, K.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Journal Article
1999Schablonendruck für Flip Chip and Waferlevel CSP
Töpper, M.; Coskina, P.; Kloeser, J.; Jung, E.; Achenbrenner, R.; Reichl, H.
Conference Paper
1999Wafer Bumping for Wafer-Level CSPs and Flip Chips using Stencil Printing Technology
Töpper, M.; Coskina, P.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Conference Paper
1998Chip size package - the option of choice for miniaturized medical devices
Töpper, M.; Schaldach, M.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Heinricht, K.; Bader, V.; Hoster, L.; Coskina, P.; Kloeser, J.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Combination of MCM-C technology with MCM-D technology using photosensitive polymers
Töpper, M.; Scherpinski, K.; Hahn, R.; Ehrmann, O.; Reichl, H.; Schmaus, C.; Bechtold, F.
Conference Paper
1998Deployment of State-of -the-Art Technology for Implantable Medical Systems
Töpper, M.; Schaldach, M.; Müller, J.; Starke, M.; Tessier, T.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M.
Conference Paper
1998Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H.
Journal Article
1998A multichip module integration technology for high-speed analog and digital applications
Töpper, M.; Mangold, T.; Wolf, J.; Reichl, H.; Russer, P.
Conference Paper
1998Novel packaging concept for high power multichip modules
Hahn, R.; Töpper, M.; Reichl, H.
Journal Article
1997BCB - a polymer for thinfilm applications
Töpper, M.; Ehrmann, O.; Reichl, H.; Glaw, V.; Wolf, J.; Fischbeck, G.; Petermann, K.
Conference Paper
1997Dünnfilmmehrlagenverdrahtung mit photosensitivem BCB auf Keramik-, Dickschicht- und LTCC-Substraten für MCM
Töpper, M.; Glaw, V.; Hahn, R.; Schaldach, M.; Schmaus, C.; Bechtold, F.; Reichl, H.
Conference Paper
1997Embedding technology - a chip-first approach using BCB
Töpper, M.; Buschick, K.; Wolf, J.; Glaw, V.; Hahn, R.; Dabek, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H.
Conference Paper
1997High power multi chip modules employing the planar embedding technique and microchannel water heat sinks
Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Töpper, M.; Ehrmann, O.; Reichl, H.
Journal Article
1997High power multichip modules employing the planar embedding technique and microchannel water heat sinks
Töpper, M.; Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Laser machining of ceramics for MCM-D applications
Glaw, V.; Hahn, R.; Wolf, J.; Töpper, M.; Buschick, K.; Hein, U.; Ginolas, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Multichip-modules for high frequency applications
Wolf, J.; Schmückle, S.J.; Owzar, A.; Töpper, M.; Buschick, K.; Reichl, H.
Conference Paper
1997System Integration for High Frequency Applications
Töpper, M.; Wolf, J.; Schmückle, F.J.; Heinrich, W.; Buschick, K.; Owzar, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Der Weg zum Chip-Size-Package
Töpper, M.; Reichl, H.
Journal Article
1996Alternative solder deposition using transfer technique
Töpper, M.; Wolf, J.; Reichl, H.
Conference Paper
1996Design concept for singlemode polymer waveguides
Töpper, M.; Fischbeck, G.; Moosburger, R.; Petermann, K.
Journal Article
1996Fabrication of high power MCMs by planar embedding technique and active cooling
Töpper, M.; Hahn, R.; Wolf, J.; Glaw, V.; Buschick, K.; Hoehne, J.; Schmidt, M.; Ehrmann, O.; Reichl, H.
Conference Paper
1996Integrated thermo-optical switch based on polymer rib waveguides
Töpper, M.; Moosburger, R.; Fischbeck, G.; Kostrzewa, C.; Petermann, K.
Conference Paper
1996MCM-D with embedded active and passive components
Töpper, M.; Wolf, J.; Glaw, V.; Buschick, K.; Dabek, A.; Dietrich, L.; Ehrmann, O.; Reichl, H.
Conference Paper
1996Mehrlagenverdrahtung für MCM-D und Chip Size Package
Töpper, M.; Buschick, K.; Wolf, J.; Dietrich, L.; Ehrmann, O.
Book Article
1996Metallisierung von Polymeren für Dünnfilmverdrahtungen
Töpper, M.; Schmidt, R.; Hannemann, M.; Schammler, G.; Hempel, G.
Journal Article
1996Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
Toepper, M.; Stolle, T.; Krabe, D.; Chmiel, G.; Schammler, G.; Reichl, H.
Patent
1996The photolysis of pure and mixed palladium acetate thin films
Töpper, M.; Stolle, T.; Wäsche, M.
Journal Article
1996Redistribution technology for chip scale package using photosensitive BCB
Töpper, M.; Simon, J.; Reichl, H.
Journal Article
1996Thin film technologies for single-mode polymer waveguides
Töpper, M.; Fischbeck, G.; Moosburger, R.; Petermann, K.; Krabe, D.; Reichl, H.
Conference Paper
1995A comparison of flip chip technology with chip size packages
Simon, J.; Töpper, M.; Reichl, H.; Chmiel, G.
Conference Paper
1995On-Chip Umverdrahtung - eine Möglichkeit zur Anpassung von Chip- und Leiterplattenraster
Chmiel, G.; Töpper, M.; Simon, J.; Reichl, H.
Conference Paper
1994Thinfilm multichip modules - Process development using photosensitive benzocyclobutane
Chmiel, G.; Töpper, M.; Jöhren, C.; Achen, A.
Conference Paper