Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2008Modulation of insulin release by adenosine A1 R receptor agonists and antagonists in INS-1 cells: The possible contribution of 86 Rb+ efflux and 45Ca2+ uptake
Töpfer, M.; Burbiel, J.; Müller, C.E.; Knittel, J.; Verspohl, E.J.
Journal Article
2000Kuehleinrichtung fuer elektronische Schaltungen
Toepfer, M.; Brunner, D.
Patent
1999Computer aided optimization of advanced materials for liquid cooled printed circuit boards and their use in telecommunications
Kaulfersch, E.; Mehlhorn, T.; Töpfer, M.; Reichl, H.
Book Article
1999Diamond as a heat spreader material for laser applications
Töpfer, M.; Kaulfersch, E.; Fotheringham, G.; Schmidt, M.; Dai, W.; Reichl, H.
Book Article
1999High performance liquid cooled aluminium nitride heat sinks
Hahn, R.; Glaw, V.; Ginolas, A.; Töpfer, M.; Wittke, K.; Reichl, H.
Journal Article
1998Chipanordnung und Verfahren zum Herstellen derselben
Töpfer, M.; Kaulfersch, E.; Weiss, S.; Reichl, H.
Patent
1998Thermal crosstalk of integrated multiwavelength transmitters
Fidorra, F.; Franke, D.; Möhrle, M.; Rehbein, W.; Sigmund, A.; Stenzel, R.; Venghaus, H.; Weickhmann, M.; Töpfer, M.; Schmidt, M.; Reich, H.
Conference Paper
1997CTE matched and mismatched heat-spreader materials for high power laser diode attachment. Thermal and mechanical optimization
Kaulfersch, E.; Töpfer, M.; Michel, B.; Reichl, H.
Conference Paper
1997Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder
Weiß, S.; Kaulfersch, E.; Töpfer, M.; Zakel, E.; Michel, B.; Reichl, H.
Conference Paper
1997High performance liquid cooled aluminium nitride heat sinks
Hahn, R.; Glaw, V.; Ginolas, A.; Töpfer, M.; Wittke, K.; Reichl, H.
Conference Paper
1997Micro channel cooler for application for micro- and power-electronics
Hahn, R.; Wittke, K.; Glaw, V.; Töpfer, M.; Ginolas, A.; Brunner, D.
Conference Paper
1997A simple method to reduce thermomechanical stress in GaAs Assemblies including diamond heat spreaders and AuSn solders
Töpfer, M.; Kaulfersch, E.; Michel, B.; Reichl, H.
Conference Paper
1997Thermal simulation of aluminium nitride heat spreaders for varíous advanced electronic packaging applications
Hahn, R.; Kamp, A.; Hoehne, J.; Töpfer, M.; Reichl, H.
Conference Paper