Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts
Klengel, R.; Naumann, F.; Tismer, S.; Klengel, S.
Conference Paper
2016Evaluation of the bond quality of laser-joined sapphire wafers using a fresnoite-glass sealant
Pablos-Martin, A. de; Tismer, S.; Naumann, F.; Krause, M.; Lorenz, M.; Grundmann, M.; Höche, T.
Journal Article
2016Laser soldering of sapphire substrates using a BaTiAl6O12 thin-film glass sealant
Pablos-Martin, A. de; Tismer, S.; Benndorf, G.; Mittag, M.; Lorenz, M.; Grundmann, M.; Höche, T.
Journal Article
2016Laser-welded fused silica substrates using a luminescent fresnoite-based sealant
Pablos-Martin, A. de; Benndorf, G.; Tismer, S.; Mittag, M.; Cismak, A.; Lorenz, M.; Grundmann, M.; Höche, T.
Journal Article
2016Magnetic field and current density imaging using off-line lock-in analysis
Kögel, M.; Altmann, F.; Tismer, S.; Brand, S.
Journal Article
2015Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
Brand, S.; Tismer, S.; Moe, S.T.; Schjølberg-Henriksen, K.
Journal Article
2015Scaling behavior of EEG amplitude and frequency time series across sleep stages
Kantelhardt, J.W.; Tismer, S.; Gans, F.; Schumann, A.Y.; Penzel, T.
Journal Article
2015Structural characterization of laser bonded sapphire wafers using a titanium absorber thin film
Pablos-Martin, A. de; Tismer, S.; Höche, T.
Journal Article
2013Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis
Tismer, S.; Brand, S.; Klengel, S.; Petzold, M.; Czurratis, P.
Conference Paper
2013Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Naumann, F.; Brand, S.; Bernasch, M.; Tismer, S.; Czurratis, P.; Wünsch, D.; Petzold, M.
Journal Article