Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
Thomas, T.; Dijk, M. van; Dreissigacker, M.; Hoffmann, S.; Walter, H.; Becker, K.-F.; Schneider-Ramelow, M.
Journal Article
2018High temperature encapsulation for smart power devices
Becker, K.-F.; Thomas, T.; Obst, M.; Bauer, J.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2016Development of a sensor concept to in situ measure process data in a transfer mold process
Kahle, R.; Becker, K.-F.; Bauer, J.; Braun, T.; Thomas, T.; Lang, K.-D.
Conference Paper
2016Encapsulation of smart power electronic devices - Thermal degradation and dielectric behavior
Thomas, T.; Gineiger, S.; Becker, K.-F.; Georgi, L.; Lang, K.-D.
Conference Paper
2016High viscosity paste dosing for microelectronic applications
Thomas, Tina; Voges, S.; Braun, T.; Raatz, S.; Kahle, R.; Becker, K.-F.; Koch, M.; Fliess, M.; Bauer, J.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2016Improving the radiation hardness of space solar cells via nanophotonic light trapping
Mellor, A.; Hylton, N.P.; Wellens, C.; Thomas, T.; Al-Saleh, Y.; Giannini, V.; Braun, A.; Hauser, H.; Maier, S.A.; Ekins-Daukes, N.J.
Conference Paper
2016Method for identification of low soluble, biopersistent dusts (GBS)
Creutzenberg, O.; Hansen, T.; Sven, S.; Thomas, T.; Jan, K.
Journal Article
2016Nanoparticle scattering for multijunction solar cells
Mellor, A.; Hylton, N.P.; Höhn, O.; Wellens, C.; Hauser, H.; Thomas, T.; Al-Saleh, Y.; Tucher, N.; Oliva, E.; Bläsi, B.; Ekins-Daukes, N.J.; Maier, S.A.
Conference Paper
2016Nanoparticle Scattering for Multijunction Solar Cells: The Tradeoff between Absorption Enhancement and Transmission Loss
Mellor, A.; Hylton, N.P.; Hauser, H.; Thomas, T.; Lee, K.-H.; Al-Saleh, Y.; Giannini, V.; Braun, A.; Loo, J.; Vercruysse, D.; Dorpe, P. van; Blasi, B.; Maier, S.A.; Ekins-Daukes, N.J.
Journal Article
2015Development of solder paste jetting processes for advanced packaging
Thomas, Tina; Voges, Steve; Fliess, M.; Becker, Karl-Friedrich; Reiners, Philipp; Koch, Mathias; Bauer, Jörg; Braun, Tanja; Lang, Klaus-Dieter
Conference Paper
2015From fan-out wafer to fan-out panel level packaging
Braun, Tanja; Becker, Karl-Friedrich; Raatz, Stefan; Bader, Volker; Bauer, Jochen; Aschenbrenner, Rolf; Voges, Steve; Thomas, Tina; Kahle, Ruben; Lang, Klaus-Dieter
Conference Paper
2015Large area compression molding for Fan-out Panel Level Packing
Braun, Tanja; Raatz, Stefan; Voges, Steve; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Becker, Karl-Friedrich; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
201424"×18" fan-out panel level packing
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Bauer, Jörg; Kahle, Ruben; Bader, V.; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014Assessment of high temperature reliability of molded smart power modules
Thomas, Tina; Becker, Karl-Friedrich; Braun, Tanja; Dijk, Marius van; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Challenges and opportunities for Fan-out Panel Level Packaging (FOPLP)
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014Fan-out wafer level packaging for MEMS and sensor applications
Braun, Tanja; Becker, Karl-Friedrich; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014Improving the FE simulation of molded packages using warpage measurements
Huber, Saskia; Dijk, Marius van; Walter, Hans; Wittler, Olaf; Thomas, Tina; Lang, Klaus-Dieter
Journal Article
2014InGaAs/GaAsP strain balanced multi-quantum wires grown on misoriented GaAs substrates for high efficiency solar cells
Alonso-Álvarez, D.; Thomas, T.; Führer, M.; Hylton, N.P.; Ekins-Daukes, N.; Lackner, D.; Philipps, S.P.; Bett, A.W.; Sodabanlu, H.; Fujii, H.; Watanabe, K.; Sugiyama, M.; Nasi, L.; Campanini, M.
Journal Article
2014Precision jetting of solder paste - a versatile tool for small volume production
Becker, K.-F.; Koch, M.; Voges, S.; Thomas, T.; Fliess, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2014Reliability assessment of molded smart power modules
Thomas, Tina; Lang, Klaus-Dieter; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Jörg
Conference Paper
2013From wafer level to panel level mold embedding
Braun, Tanja; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2013Smart power module molding advances: Evaluating high temperature suitability of molding compounds
Becker, K.-F.; Thomas, T.; Bauer, J.; Kahle, R.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2013Transfer molding compounds for power electronic applications - a qualification methodology for HT capable materials
Braun, Tanja; Becker, K.-F.; Koch, M.; Thomas, T.; Amende, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2012Large area mold embedding technology with PCB based redistribution
Braun, T.; Becker, K.-F.; Böttcher, L.; Ostmann, A.; Jung, E.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider Ramelow, M.; Lang, K.-D.
Conference Paper
2012Through mold via technology for multi-sensor stacking
Braun, Tanja; Brundel, Mathias; Becker, Karl-Friedrich; Kahle, Ruben; Piefke, Kathrin; Scholz, U.; Haag, F.; Bader, Volker; Voges, Steve; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2012Transfer molding technology for smart power electronics modules - materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D.
Conference Paper
2012Transfer molding technology for smart power electronics modules: Materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Thomas, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Bochow-Ness, O.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
20113D stacking approaches for mold embedded packages
Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2011Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2011Through mold vias for stacking of mold embedded packages
Braun, T.; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Piefke, K.; Krüger, R.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2010Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U.
Conference Paper
2010Nano- und micro sized filler particles for improved humidity resistance of encapsulants
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.-F.; Koch, M.; Thomas, T.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Assessment of thermal and process properties of lead-free solder pastes for high reliable electronic devices
Bertels, L.; Poech, M.; Hutter, M.; Thomas, T.
Conference Paper
2009Untersuchung zu den themischen und prozesstechnischen Eigenschaften von Flussmitteln für bleifreie Lotlegierungen auf hochzuverlässigen Baugruppen
Bertels, L.; Poech, M.-H.; Hutter, M.; Thomas, T.
Conference Paper
2009Zusammenhänge zwischen den thermischen und prozesstechnischen Eigenschaften von Flussmitteln und der Porenbildung in Lötstellen
Hutter, M.; Thomas, T.; Bertels, L.; Poech, M.
Journal Article
2007Lotmetallisierung
Hutter, M.; Oppermann, H.; Rafael, J.; Thomas, T.
Patent
2005Investigation of Different Flip Chip Assembly Processes Using Au/Sn Microbumps
Hutter, M.; Thomas, T.; Jordan, R.; Engelmann, G.; Oppermann, H.; Reichl, H.; Wang, Y.; Howlader, M.; Higurashi, E.; Suga, T.
Conference Paper
2005STABILISIERTES INTERFERON-?
Brunner, H.; Zakaria, H.; Otto, B.; Thomas, T.; Battermann, F.; Kresin, M.; Busche, A.; Schmalz, C.
Patent