Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Characterization of partial discharge performance of die attach adhesives
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Journal Article, Conference Paper
2017Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Conference Paper
2008Assessment of a lasersingulation process for Si-wafers with metallized back side and small die size
Theuss, H.; Koller, A.; Kröninger, W.; Schoenfelder, S.; Petzold, M.
Conference Paper
2006A SEM and TEM study of the interconnect microstructure and reliability for a new XFLGA package
Bennemann, S.; Graff, A.; Schischka, J.; Petzold, M.; Theuss, H.; Dangelmaier, J.; Pressel, K.
Conference Paper
2005A highly reliable flip chip solution based on electroplated AuSn bumps in a leadless package
Theuss, H.; Pressel, K.; Paulus, S.; Kilger, T.; Dangelmaier, J.; Lehner, R.; Eisener, B.; Kiendl, H.; Schischka, J.; Graff, A.; Petzold, M.
Conference Paper