Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Zürcher, J.; Yu, K.; Schlottig, G.; Baum, M.; Taklo, M.M.V.; Wunderle, B.; Warszyński, P.; Brunschwiler, T.
Conference Paper
2015Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres
Wright, D.N.; Taklo, M.M.V.; Baum, M.; Hofmann, C.; Kristiansen, H.
Conference Paper
2014Low-temperature bonding technologies for MEMS and 3D-IC
Taklo, M.M.V.; Schjolberg-Henriksen, K.; Malik, N.; Tofteberg, H.R.; Poppe, E.; Vella, D.O.; Borg, J.; Attard, A.; Hajdarevic, Z.; Klumpp, A.; Ramm, P.
Conference Paper
2012Handbook of wafer bonding
: Ramm, P.; Lu, J.J.-Q.; Taklo, M.M.V.
Book
2011Characterization and failure analysis of 3D integrated systems using a novel plasma-FIB system
Kwakman, L.; Franz, G.; Taklo, M.M.V.; Klumpp, A.; Ramm, P.
Conference Paper
20103D integration of MEMS and IC: Design, technology and simulations: Advanced processes and materials
Taklo, M.M.V.; Schjolberg-Henriksen, K.; Lietaer, N.; Prainsack, J.; Elfving, A.; Weber, J.; Klein, M.; Schneider, P.; Reitz, S.
Conference Paper
20103D interconnect technologies for advanced MEMS/NEMS applications
Lietaer, N.; Taklo, M.M.V.; Schjolberg-Henriksen, K.; Ramm, P.
Conference Paper
20103D System-on-Chip technologies for More than Moore systems
Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.
Journal Article
20093D integration technologies
Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.
Conference Paper
20093D integration technologies for miniaturized Tire Pressure Monitor System (TPMS)
Lietaer, N.; Taklo, M.M.V.; Klumpp, A.; Weber, J.; Ramm, P.
Conference Paper
20093D MEMS and IC integration
Taklo, M.M.V.; Lietaer, N.; Tofteberg, H.R.; Seppanen, T.; Prainsack, J.; Weber, J.; Ramm, P.
Conference Paper
20093D stacked MEMS and ICs in a miniaturized sensor node
Taklo, M.M.V.; Lietaer, N.; Tofteberg, H.; Seppänen, T.; Ramm, P.; Weber, W.
Conference Paper
2009Miniaturised sensor node for tire pressure monitoring (e-CUBES)
Schjølberg-Henriksen, K.; Taklo, M.M.V.; Lietaer, N.; Prainsack, J.; Dielacher, M.; Klein, M.; Wolf, M.J.; Weber, J.; Ramm, P.; Seppänen, T.
Conference Paper
20083D integration technologies for miniaturized tire pressure monitor system (TPMS)
Lietaer, N.; Taklo, M.M.V.; Klumpp, A.; Ramm, P.
Conference Paper
2008Fabrication Challenges of 3D Integration Technologies for More Than Moore Applications
Ramm, P.; Taklo, M.M.V.
Conference Paper
2008Reliability Investigations on Highly Integrated TPMS
Kaulfersch, E.; Maaike, M.; Taklo, M.M.V.; Weber, J.; Wunderle, B.; Wittler, O.; Mroßko, R.
Journal Article, Conference Paper