Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Combination of soft X-ray microscopy with in-situ mechanical testing to image crack propagation in microchips
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article, Conference Paper
2018In-situ X-ray microscopy of crack-propagation to study fracture mechanics of on-chip interconnect structures
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article
2018Laboratory computed x-ray tomography - a nondestructive technique for 3D microstructure analyis of materials
Zschech, Ehrenfried; Löffler, Markus; Krüger, Peter; Gluch, Jürgen; Kutukova, Kristina; Zglobicka, Izabela; Silomon, Jendrik; Rosenkranz, Rüdiger; Standke, Yvonne; Topal, E.
Journal Article
2018A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits
Kutukova, Kristina; Niese, Sven; Sander, Christoph; Standke, Yvonne; Gluch, Jürgen; Gall, Martin; Zschech, Ehrenfried
Journal Article
2018Quantitative analysis of backscattered electron (BSE) contrast using low voltage scanning electron microscopy (LVSEM) and its application to Al0.22Ga0.78N/GaN layers
Garitagoitia, Maria Aranzazu; Rosenkranz, Rüdiger; Löffler, M.; Clausner, André; Standke, Yvonne; Zschech, Ehrenfried
Journal Article
2017Preparation and TEM characterization of interfaces in co-sintered metal-ceramic composites
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Gluch, Jürgen; Zschech, Ehrenfried
Poster
2017Target preparation and characterization of interfaces in co-sintered metal ceramic composites using imaging and analytical Transmission Electron Microscopy
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Herrmann, Mathias; Gluch, Jürgen; Zschech, Ehrenfried
Book Article
2016FIB sample preparation for X-ray microscopy and ROI target cross-sectioning
Zschech, Ehrenfried; Gluch, Jürgen; Rosenkranz, Rüdiger; Standke, Yvonne; Niese, Sven
Abstract
2016Structural characterisation of carbon fibres along the fabrication process using SEM/FIB and TEM
Mühle, Uwe; Standke, Yvonne; Zschech, Ehrenfried; Meinl, Juliane; Michaelis, Alexander; Kirsten, Martin; Cherif, Chokri
Conference Paper
2016TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried
Journal Article, Conference Paper
2014Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration
Sander, Christoph; Standke, Yvonne; Niese, Sven; Rosenkranz, Rüdiger; Clausner, André; Gall, Martin; Zschech, Ehrenfried
Journal Article, Conference Paper
2014A new in situ microscopy approach to study the degradation and failure mechanisms of time-dependent dielectric breakdown: Set-up and opportunities
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Aubel, Oliver; Mühle, Uwe; Gluch, Jürgen; Niese, Sven; Standke, Yvonne; Rosenkranz, Rüdiger; Löffler, Markus; Vogel, Norman; Beyer, Armand; Engelmann, Hans Jürgen; Guttmann, Peter; Schneider, Gerhard; Zschech, Ehrenfried
Journal Article