Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2009Multiscale mechanics modeling of direct silicon wafer bonding
Kubair, D.V.; Cole, D.J.; Ciacchi, L.C.; Spearing, S.M.
Journal Article
2007Development of a classical force field for the oxidized Si surface
Cole, D.J.; Payne, M.C.; Csanyi, G.; Spearing, S.M.; Ciacchi, L.C.
Journal Article
2003Characterization of silicon-wafer bonding for power MEMS applications
Ayon, A.A.; Zhang, X.; Turner, K.T.; Choi, D.W.; Miller, B.; Nagle, S.F.; Spearing, S.M.
Journal Article
2003Multistack silicon-direct wafer bonding for 3D MEMS manufacturing
Miki, N.; Zhang, X.; Khanna, R.; Ayon, A.A.; Ward, D.; Spearing, S.M.
Journal Article
2003Thermomechanical behavior of thick PECVD oxide-films for power MEMS applications
Zhang, X.; Chen, K.S.; Spearing, S.M.
Journal Article