Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Smart Services im Maschinen- und Anlagenbau
Freitag, Mike; Korb, Tobias; Sommer, Philipp
Study
2016Experts view on the sustainability of the fairphone 2
Proske, M.; Schischke, K.; Sommer, P.; Trinks, T.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2016Wie nachhaltig ist das Fairphone 2? - Ergebnisse einer Expertenbefragung
Schischke, Karsten; Proske, Marina; Sommer, Philipp; Trinks, Tina
Study
2014BaSE-II: A robust and experimental galileo PRS receiver development platform
Rügamer, Alexander; Neumaier, Philipp; Sommer, Philipp; Garzia, Fabio; Rohmer, Günter; Konovaltsev, Andriy; Sgammini, Matteo; Caizzone, Stefano; Meurer, Michael; Wendel, Jan; Schubert, Frank; Baumann, Stefan
Conference Paper
2014Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability
Dudek, R.; Döring, R.; Sommer, P.; Seiler, B.; Kreyssig, K.; Walter, H.; Becker, M.; Günther, M.
Conference Paper
2014Experimental BOC tracking hardware platform
Neumaier, Philipp; Garzia, Fabio; Sommer, Philipp; Rügamer, Alexander; Rohmer, Günter; Wendel, Jan; Schubert, Frank Max
Conference Paper
2014Reliability investigations for high temperature interconnects
Dudek, R.; Sommer, P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2014Thermo-mechanical behavior and reliability issues for high temperature interconnections
Dudek, R.; Sommer, P.; Döring, R.; Herberholz, T.; Fix, A.; Seiler, B.; Rzepka, S.
Conference Paper
2013Reliability issues for high temperature interconnections based on transient liquid phase soldering
Dudek, R.; Sommer, P.; Fix, A.; Rzepka, S.; Michel, B.
Conference Paper
2006Process family engineering in the automotive domain
Bayer, J.; Forster, T.; Giese, C.; Lehner, T.; Schaude, M.; Schnieders, A.; Sommer, P.; Weiland, J.
Report
2005Buried components in printed circuit boards
Ostmann, A.; Neumann, A.; Sommer, P.; Reichl, H.
Journal Article