Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Finite-Element-Modelling of Intermetallics in Solders
Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
2013Modellierungsansatz zur thermo-mechanischen Analyse von gesinterten Halbleiterbauelementen in der Leistungselektronik
Dudek, R.; Guenther, M.; Sommer, J.-P.; Doering, R.; Kreyssig, K.
Journal Article
2013Reliability Investigations for High Temperature Interconnects
Dudek, R.; Sommer, J.-P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B.
Conference Paper
2011High density packaging for automotive applications
Sommer, J.-P.; Michel, B.; Hofmann, T.; Gottwald, T.; Neumann, A.; Podlasly, A.
Conference Paper
2011Leistungselektronik im Automobil mit hoher Integrationsdichte
Sommer, J.-P.; Hofmann, T.; Gottwald, T.; Podlasky, A.
Conference Paper
2011Project VISA: Fully integrated power electronic systems for automotive electronics
Hofmann, T.; Sommer, J.-P.; Michel, B.
Conference Paper
2010Combination of FE simulation and micro deformation measurements - A promising approach to consider reliability aspects right from the start
Sommer, J.-P.; Michel, B.; Brämer, B.; Kugler, A.; Rank, H.
Conference Paper
2010Design of low loss beam forming networks - supported by numerical simulation and materials characterisation
Sommer, J.-P.; Uhlig, P.; Kulke, R.; Michel, B.
Conference Paper
2010Highly integrated advanced power electronic systems for automotive applications
Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B.
Conference Paper
2010KRAFAS - Projektergebnisse der innovativen Einbetttechnologien CID und CHIP+ für den Einsatz in automobilen Radarsensoren
Kostelnik, Jan; Ebling, F.; Becker, K.-F.; Kahle, R.; Kugler, A.; Sommer, J.-P.; Noack, E.; Richter, M.D.; Schneider, M.
Conference Paper
2010Self-contained microfluidic cartridges for in-vitro diagnostic applications: Recent advances and improvements
Nestler, J.; Otto, T.; Sommer, J.-P.; Michel, B.; Gessner, T.; Bier, F.F.
Conference Paper
2009Light weight - Low loss beam forming networks for space applications
Uhlig, P.; Leis, J.; Marek, R.; Sommer, J.-P.; Wolf, H.
Conference Paper
2009Syntactic foam - A new approach to beam forming networks
Uhlig, P.; Leiß, J.; Marek, R.; Sommer, J.-P.; Wolf, H.
Conference Paper
2008KRAFAS - Einbetttechnologien für aktive Komponenten
Kostelnik, J.; Becker, K.-F.; Ebling, F.; Sommer, J.-P.; Noack, E.; Böttcher, L.
Journal Article
2008Numerical Simulation and Micro Deformation Measurements for Sensor Design in Automotive Technology
Sommer, J.-P.; Noack, E.; Michel, B.; Becker, K.-F.
Conference Paper
2008Reliable Encapsulation of Microsystems for Automotive Use
Becker, K.-F.; Braun, T.; Koch, M.; Bauer, J.; Wunderle, B.; Sommer, J.-P.; Aschenbrenner, R.; Reichl, H.
Conference Paper, Journal Article
2008Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2008Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A.
Conference Paper
2007In die Leiterplatte integrierte ICs - Verformungsanalyse mit numerischen und messtechnischen Methoden
Sommer, J.-P.; Noack, E.; Seiler, B.; Michel, B.
Conference Paper
2007Nano-Reliability within the Framework of Fraunhofer Marked-Oriented Nano-Scale Activities
Sommer, J.-P.; Michel, B.; Petzold, M.; Schönecker, A.; Kusnezoff, M.; Wunderle, B.
Conference Paper
2007Reliability aspects of embedded chips
Ostmann, A.; Manessis, D.; Cauwe, M.; Sommer, J.-P.
Conference Paper
2007Zuverlässigkeit für elektronische Bauelemente mit hoher Packungsdichte
Sommer, J.-P.; Dudek, R.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2006Advanced packages with buried dies
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B.
Conference Paper
2006Chip embedding into polymer matrices of printed wiring boards
Loeher, T.; Neumann, A.; Sommer, J.-P.; Ostmann, A.; Reichl, H.
Presentation
2006Electronic assemblies with hidden dies - design support by means of FE analysis
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2006Embedding of chips in flex and rigid substrates: Impact on thermal and mechanical performance
Vandevelde, B.; Chen, C.; Sommer, J.-P.; Christiaens, W.; Vandecasteele, B.; Vanfleteren, J.; Lehtiniemi, R.; Arslan, A.
Conference Paper
2006Solder Fatigue at High-Power IGBT Modules
Sommer, J.-P.; Licht, T.; Berg, H.; Appelhoff, K.; Michel, B.
Conference Paper
2006Zuverlässigkeitsprognostik von in der Leiterplatte integrierten Chips
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B.
Conference Paper
2005Accelerated failure test for high temperature applications of power MOSFETs by power cycling
Schacht, R.; Auerswald, E.; Sommer, J.-P.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2005Design support for a real pressure sensor by means of finite element analysis
Sommer, J.-P.; Döring, R.; Hussack, J.; Glien, K.; Graf, J.; Müller-Fiedler, R.
Abstract
2005High temperature potential of flip chip assemblies for automotive applications
Braun, T.; Becker, K.-F.; Sommer, J.-P.; Löher, T.; Schottenloher, K.; Kohl, R.; Pufall, R.; Bader, V.; Koch, M.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Numerical characterisation of electronic packaging solutions based on hidden dies
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2005Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten - Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Journal Article
2005Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Journal Article
2005Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Journal Article, Conference Paper
2004Buried Components in Printed Circuit Boards
Ostmann, A.; Neumann, A.; Sommer, J.-P.; Reichl, H.
Conference Paper
2004Design support and development of miniaturised Si-microphone packages
Sommer, J.-P.
Conference Paper
2004Einbettung aktiver Chips in die Leiterplatte - Stand und Herausforderungen
Ostmann, A.; Jung, E.; Neumann, A.; Sommer, J.-P.; Reichl, H.
Conference Paper
2004Mechanische Charakterisierung membranartiger Sonsorstrukturen
Winkler, T.; Seiler, B.; Dost, M.; Brokmann, G.; Übensee, H.; Rümmler, N.; Faust, W.; Sommer, J.-P.
Conference Paper
2004Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten für die Knie-Gelenkendoprothetik
Glien, W.; Rahm, J.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Conference Paper
2004Support of the Design Process for Advanced Electronic Components by Means of Finite Element Analysis
Sommer, J.-P.
Journal Article
2004Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Conference Paper
2004Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B.
Conference Paper
2003Design process supporting simulations on wafer level packages
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Conference Paper
2003Design von Kunststoffbaugruppen mit Unterstützung durch Finite-Elemente-Analysen
Michel, B.; Sommer, J.-P.
Conference Paper
2003Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten - Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Journal Article, Conference Paper
2003Unterstützung des Designprozesses für Mikrofonsensoren mit Hilfe von Finite-Elemente-Analysen
Sommer, J.-P.; Wang, B.
Conference Paper
2001Experimentelle und numerische Methoden zur Charakterisierung von Mikrobauteilen
Sommer, J.-P.; Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B.
Conference Paper
2001Messung von Materialkennwerten an Komponenten der Mikrotechnik
Vogel, D.; Sommer, J.-P.; Großer, V.; Michel, B.
Journal Article
2001Thermo-mechanical reliability for high frequency applications
Sommer, J.-P.
Journal Article, Conference Paper
2000Determination of Materials Properties on Micro Components
Vogel, D.; Sommer, J.-P.; Kühnert, R.; Michel, B.
Conference Paper
2000Evaluation and testing of microsystems using optical methods
Großer, V.; Bombach, C.; Gentzsch, S.; Hillmann, V.; Sommer, J.-P.; Michel, B.
Conference Paper
2000Experimental and numerical investigations of microelectroplated sensors
Vogel, J.; Sommer, J.-P.; Noack, E.; Kieselstein, E.; Auerswald, E.; Gentzsch, S.; Großer, V.; Winkler, T.; Michel, B.
Conference Paper
2000Finite-element investigation on testing devices for solder joint reliability evaluation
Kaulfersch, E.; Vogel, J.; Sommer, J.-P.; Michel, B.
Conference Paper
2000Material Characterization and FE Analysis of Electroplated Microrelays
Vogel, J.; Sommer, J.-P.; Faust, W.; Kieselstein, E.; Michel, B.
Conference Paper
2000Mechanical design support by means of FEA for advanced millimeter wave communication devices
Sommer, J.-P.; Michel, B.; Döring, R.; Hager, W.; Rehme, F.
Conference Paper
2000Modular loading and measuring system for material characterization of microcomponents
Vogel, J.; Dost, M.; Seebacher, S.; Osten, W.; Fassler, R.; Köpp, N.; Döring, R.; Sommer, J.-P.; Michel, B.
Conference Paper
2000Thermally optimised millimeter wave package on an LTCC ceramic board
Sommer, J.-P.; Michel, B.; Goebel, U.; Jelonnek, J.
Journal Article, Conference Paper
1999Charakterisierung galvanisch abgeschiedener Sensorstrukturen
Auerswald, E.; Sommer, J.-P.; Michel, B.; Kieselstein, E.; Brämer, B.
Conference Paper
1999Investigations on popcorn cracking of T-QFP packages
Dudek, R.; Sommer, J.-P.; Michel, B.; Alpern, P.; Birzer, C.; Tilgner, R.
Book Article
1999Thermo-mechanical FE analysis and micro deformation measurement
Sommer, J.-P.; Kaulfersch, E.; Hussack, J.; Schubert, A.; Michel, B.
Book Article
1998Reliability and testability of stacked 3D modules
Großer, V.; Sommer, J.-P.; Leutenbauer, R.; Michel, B.; Reichl, H.
Conference Paper
1997Problem-adapted 3D finite element modelling for VLSI components
Döring, R.; Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
1997Testing devices for well defined mechanical and thermal loading of microcomponents
Dost, M.; Dietrich, D.; Vogel, J.; Sommer, J.-P.; Großer, V.; Michel, B.
Conference Paper
1996Die Finite-Elemente Methode als Analysewerkzeug in der Mikrotechnik
Sommer, J.-P.; Dudek, R.; Michel, B.
Book Article
1995Bruchmechanische Untersuchungen zur Zuverlässigkeitsbewertung mikrotechnischer Aufbauten
Michel, B.; Sommer, J.-P.; Krause, F.; Winkler, T.; Faust, W.
Conference Paper
1995Lötstellenbewertung an SMD-Aufbauten
Dudek, R.; Sommer, J.-P.; Faust, W.; Döring, R.
Conference Paper
1995Mechanisch-thermische Simulation und Lebensdauerbewertung von mikrotechnischen Komponenten
Sommer, J.-P.; Dudek, R.; Faust, W.; Michel, B.
Book Article
1995Mechanisch-thermische Versagensdetektion an Leiterplatten mittel numerischer und laseroptischer Verfahren
Großer, V.; Sommer, J.-P.; Faust, W.; Bombach, C.; Michel, B.
Conference Paper
1995Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse
Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
1995Thermal and mechanical characterization of electronic packages in extremely high frequency applications by means of finite element analysis
Sommer, J.-P.; Dudek, R.; Michel, B.; Boheim, M.; Hager, W.
Conference Paper
1994Application of fracture machanics to micromechanics and microsystem technology
Michel, B.; Sommer, J.-P.; Großer, V.
Conference Paper
1994Application of solid mechanics in the fields of microelectronics and micro system technology
Michel, B.; Sommer, J.-P.
Conference Paper
1994Influence of a Ti-interlayer on the adhesion of TiN-coatings
Lunow, T.; Bücken, B.; Cernohorsky, H.; Leonhardt, G.; Sommer, J.-P.
Conference Paper
1994Speckle photographic strain field measurement. A helpful aid in fracture modelling and analysis of microstructures
Vogel, D.; Sommer, J.-P.; Michel, B.
Conference Paper