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| 2011 | High density packaging for automotive applications
Sommer, J.-P.; Michel, B.; Hofmann, T.; Gottwald, T.; Neumann, A.; Podlasly, A. | Conference Paper |
| 2011 | Leistungselektronik im Automobil mit hoher Integrationsdichte
Sommer, J.-P.; Hofmann, T.; Gottwald, T.; Podlasky, A. | Conference Paper |
| 2011 | Project VISA: Fully integrated power electronic systems for automotive electronics
Hofmann, T.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2010 | Design of low loss beam forming networks - supported by numerical simulation and materials characterisation
Sommer, J.-P.; Uhlig, P.; Kulke, R.; Michel, B. | Conference Paper |
| 2010 | Highly integrated advanced power electronic systems for automotive applications
Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B. | Conference Paper |
| 2010 | KRAFAS - Projektergebnisse der innovativen Einbetttechnologien CID und CHIP+ für den Einsatz in automobilen Radarsensoren
Kostelnik, Jan; Ebling, F.; Becker, K.-F.; Kahle, R.; Kugler, A.; Sommer, J.-P.; Noack, E.; Richter, M.D.; Schneider, M. | Conference Paper |
| 2010 | Self-contained microfluidic cartridges for in-vitro diagnostic applications: Recent advances and improvements
Nestler, J.; Otto, T.; Sommer, J.-P.; Michel, B.; Gessner, T.; Bier, F.F. | Conference Paper |
| 2009 | Light weight - Low loss beam forming networks for space applications
Uhlig, P.; Leis, J.; Marek, R.; Sommer, J.-P.; Wolf, H. | Conference Paper |
| 2008 | KRAFAS - Einbetttechnologien für aktive Komponenten
Kostelnik, J.; Becker, K.-F.; Ebling, F.; Sommer, J.-P.; Noack, E.; Böttcher, L. | Journal Article |
| 2008 | Numerical Simulation and Micro Deformation Measurements for Sensor Design in Automotive Technology
Sommer, J.-P.; Noack, E.; Michel, B.; Becker, K.-F. | Conference Paper |
| 2008 | Reliable Encapsulation of Microsystems for Automotive Use
Becker, K.-F.; Braun, T.; Koch. M.; Bauer, J.; Wunderle, B.; Sommer, J.-P.; Aschenbrenner, R.; Reichl, H. | Conference Paper, Journal Article |
| 2008 | Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B. | Conference Paper |
| 2008 | Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A. | Conference Paper |
| 2007 | In die Leiterplatte integrierte ICs - Verformungsanalyse mit numerischen und messtechnischen Methoden
Sommer, J.-P.; Noack, E.; Seiler, B.; Michel, B. | Conference Paper |
| 2007 | Nano-Reliability within the Framework of Fraunhofer Marked-Oriented Nano-Scale Activities
Sommer, J.-P.; Michel, B.; Petzold, M.; Schönecker, A.; Kusnezoff, M.; Wunderle, B. | Conference Paper |
| 2007 | Zuverlässigkeit für elektronische Bauelemente mit hoher Packungsdichte
Sommer, J.-P.; Dudek, R.; Michel, B.; Noack, E.; Seiler, B. | Conference Paper |
| 2006 | Advanced packages with buried dies
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B. | Conference Paper |
| 2006 | Chip embedding into polymer matrices of printed wiring boards
Loeher, T.; Neumann, A.; Sommer, J.-P.; Ostmann, A.; Reichl, H. | Presentation |
| 2006 | Electronic assemblies with hidden dies - design support by means of FE analysis
Sommer, J.-P.; Michel, B.; Ostmann, A. | Conference Paper |
| 2006 | Embedding of chips in flex and rigid substrates: Impact on thermal and mechanical performance
Vandevelde, B.; Chen, C.; Sommer, J.-P.; Christiaens, W.; Vandecasteele, B.; Vanfleteren, J.; Lehtiniemi, R.; Arslan, A. | Conference Paper |
| 2006 | Solder Fatigue at High-Power IGBT Modules
Sommer, J.-P.; Licht, T.; Berg, H.; Appelhoff, K.; Michel, B. | Conference Paper |
| 2006 | Zuverlässigkeitsprognostik von in der Leiterplatte integrierten Chips
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B. | Conference Paper |
| 2005 | Accelerated failure test for high temperature applications of power MOSFETs by power cycling
Schacht, R.; Auerswald, E.; Sommer, J.-P.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2005 | Design support for a real pressure sensor by means of finite element analysis
Sommer, J.-P.; Döring, R.; Hussack, J.; Glien, K.; Graf, J.; Müller-Fiedler, R. | Abstract, Conference Paper |
| 2005 | High temperature potential of flip chip assemblies for automotive applications
Braun, T.; Becker, K.-F.; Sommer, J.-P.; Löher, T.; Schottenloher, K.; Kohl, R.; Pufall, R.; Bader, V.; Koch, M.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Numerical characterisation of electronic packaging solutions based on hidden dies
Sommer, J.-P.; Michel, B.; Ostmann, A. | Conference Paper |
| 2005 | Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten - Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U. | Journal Article |
| 2005 | Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Journal Article, Conference Paper |
| 2004 | Buried Components in Printed Circuit Boards
Ostmann, A.; Neumann, A.; Sommer, J.-P.; Reichl, H. | Conference Paper |
| 2004 | Design support and development of miniaturised Si-microphone packages
Sommer, J.-P. | Conference Paper |
| 2004 | Einbettung aktiver Chips in die Leiterplatte - Stand und Herausforderungen
Ostmann, A.; Jung, E.; Neumann, A.; Sommer, J.-P.; Reichl, H. | Conference Paper |
| 2004 | Mechanische Charakterisierung membranartiger Sonsorstrukturen
Winkler, T.; Seiler, B.; Dost, M.; Brokmann, G.; Übensee, H.; Rümmler, N.; Faust, W.; Sommer, J.-P. | Conference Paper |
| 2004 | Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten für die Knie-Gelenkendoprothetik
Glien, W.; Rahm, J.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U. | Conference Paper |
| 2004 | Support of the Design Process for Advanced Electronic Components by Means of Finite Element Analysis
Sommer, J.-P. | Journal Article |
| 2004 | Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Conference Paper |
| 2004 | Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2003 | Design process supporting simulations on wafer level packages
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Conference Paper |
| 2003 | Design von Kunststoffbaugruppen mit Unterstützung durch Finite-Elemente-Analysen
Michel, B.; Sommer, J.-P. | Conference Paper |
| 2003 | Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten - Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U. | Journal Article, Conference Paper |
| 2003 | Unterstützung des Designprozesses für Mikrofonsensoren mit Hilfe von Finite-Elemente-Analysen
Sommer, J.-P.; Wang, B. | Conference Paper |
| 2001 | Experimentelle und numerische Methoden zur Charakterisierung von Mikrobauteilen
Sommer, J.-P.; Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B. | Conference Paper |
| 2001 | Messung von Materialkennwerten an Komponenten der Mikrotechnik
Vogel, D.; Sommer, J.-P.; Großer, V.; Michel, B. | Journal Article |
| 2001 | Thermo-mechanical reliability for high frequency applications
Sommer, J.-P. | Journal Article, Conference Paper |
| 2000 | Determination of Materials Properties on Micro Components
Vogel, D.; Sommer, J.-P.; Kühnert, R.; Michel, B. | Conference Paper |
| 2000 | Evaluation and testing of microsystems using optical methods
Großer, V.; Bombach, C.; Gentzsch, S.; Hillmann, V.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2000 | Experimental and numerical investigations of microelectroplated sensors
Vogel, J.; Sommer, J.-P.; Noack, E.; Kieselstein, E.; Auerswald, E.; Gentzsch, S.; Großer, V.; Winkler, T.; Michel, B. | Conference Paper |
| 2000 | Finite-element investigation on testing devices for solder joint reliability evaluation
Kaulfersch, E.; Vogel, J.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2000 | Material Characterization and FE Analysis of Electroplated Microrelays
Vogel, J.; Sommer, J.-P.; Faust, W.; Kieselstein, E.; Michel, B. | Conference Paper |
| 2000 | Mechanical design support by means of FEA for advanced millimeter wave communication devices
Sommer, J.-P.; Michel, B.; Döring, R.; Hager, W.; Rehme, F. | Conference Paper |
| 2000 | Modular loading and measuring system for material characterization of microcomponents
Vogel, J.; Dost, M.; Seebacher, S.; Osten, W.; Fassler, R.; Köpp, N.; Döring, R.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2000 | Thermally optimised millimeter wave package on an LTCC ceramic board
Sommer, J.-P.; Michel, B.; Goebel, U.; Jelonnek, J. | Journal Article |
| 1999 | Charakterisierung galvanisch abgeschiedener Sensorstrukturen
Auerswald, E.; Sommer, J.-P.; Michel, B.; Kieselstein, E.; Brämer, B. | Conference Paper |
| 1999 | Investigations on popcorn cracking of T-QFP packages
Dudek, R.; Sommer, J.-P.; Michel, B.; Alpern, P.; Birzer, C.; Tilgner, R. | Book Article |
| 1999 | Thermo-mechanical FE analysis and micro deformation measurement
Sommer, J.-P.; Kaulfersch, E.; Hussack, J.; Schubert, A.; Michel, B. | Book Article |
| 1998 | Reliability and testability of stacked 3D modules
Großer, V.; Sommer, J.-P.; Leutenbauer, R.; Michel, B.; Reichl, H. | Conference Paper |
| 1997 | Problem-adapted 3D finite element modelling for VLSI components
Döring, R.; Sommer, J.-P.; Dudek, R.; Michel, B. | Conference Paper |
| 1997 | Testing devices for well defined mechanical and thermal loading of microcomponents
Dost, M.; Dietrich, D.; Vogel, J.; Sommer, J.-P.; Großer, V.; Michel, B. | Conference Paper |
| 1996 | Die Finite-Elemente Methode als Analysewerkzeug in der Mikrotechnik
Sommer, J.-P.; Dudek, R.; Michel, B. | Book Article |
| 1995 | Bruchmechanische Untersuchungen zur Zuverlässigkeitsbewertung mikrotechnischer Aufbauten
Michel, B.; Sommer, J.-P.; Krause, F.; Winkler, T.; Faust, W. | Conference Paper |
| 1995 | Lötstellenbewertung an SMD-Aufbauten
Dudek, R.; Sommer, J.-P.; Faust, W.; Döring, R. | Conference Paper |
| 1995 | Mechanisch-thermische Simulation und Lebensdauerbewertung von mikrotechnischen Komponenten
Sommer, J.-P.; Dudek, R.; Faust, W.; Michel, B. | Book Article |
| 1995 | Mechanisch-thermische Versagensdetektion an Leiterplatten mittel numerischer und laseroptischer Verfahren
Großer, V.; Sommer, J.-P.; Faust, W.; Bombach, C.; Michel, B. | Conference Paper |
| 1995 | Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse
Sommer, J.-P.; Dudek, R.; Michel, B. | Conference Paper |
| 1995 | Thermal and mechanical characterization of electronic packages in extremely high frequency applications by means of finite element analysis
Sommer, J.-P.; Dudek, R.; Michel, B.; Boheim, M.; Hager, W. | Conference Paper |
| 1994 | Application of fracture machanics to micromechanics and microsystem technology
Michel, B.; Sommer, J.-P.; Großer, V. | Conference Paper |
| 1994 | Application of solid mechanics in the fields of microelectronics and micro system technology
Michel, B.; Sommer, J.-P. | Conference Paper |
| 1994 | Influence of a Ti-interlayer on the adhesion of TiN-coatings
Lunow, T.; Bücken, B.; Cernohorsky, H.; Leonhardt, G.; Sommer, J.-P. | Conference Paper |
| 1994 | Speckle photographic strain field measurement. A helpful aid in fracture modelling and analysis of microstructures
Vogel, D.; Sommer, J.-P.; Michel, B. | Conference Paper |