Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018"3rd Level" Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Seiler, B.; Fries, T.; Zhang, M.; Ortmann, R.W.
Conference Paper
2018Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Fries, T.; Döring, R.; Seiler, B.; Ortmann, R.W.
Journal Article
2018Stress analyses in HPC-soldered assemblies by optical measurement and FEA
Dudek, R.; Döring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S.
Conference Paper
2017Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W.
Conference Paper
2015Charakterisierung der Verbindungseigenschaften
Dudek, R.; Döring, R.; Kreysig, K.; Seiler, B.; Nowottnick, M.; Ehrhard, C.
Book Article
2015Demonstratoren
Herberholz, T.; Fix, A.; Ehrhardt, C.; Kreysig, K.; Seiler, B.; Dudek, R.; Schulze, J.; Wilke, K.; Strogies, J.
Book Article
2015Finite-Elemente-Analysen zur thermomechanischen Beanspruchung von Diffusionslöt- und Sinterverbindungen
Dudek, R.; Döring, R.; Rzepka, S.; Seiler, B.; Kreyßig, K.
Conference Paper
2014Anti-counterfeiting technique in the micro region for micro and nano systems
Luczak, F.; Dost, M.; Seiler, B.; Winkler, T.; Michel, B.
Book Article
2014Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability
Dudek, R.; Döring, R.; Sommer, P.; Seiler, B.; Kreyssig, K.; Walter, H.; Becker, M.; Günther, M.
Conference Paper
2014In-situ analysis of an industrial material compound package by means of X-ray micro tomography and digital volume correlation
Haase, S.; Noack, E.; Scheiter, L.; Seiler, B.; Dost, M.; Rzepka, S.
Conference Paper
2014In-situ characterization of microelectronic systems using 2D digital image correlation and 3D digital volume correlation of X-ray microtomography images
Seiler, B.; Haase, S.; Noack, E.; Erb, R.; Scheiter, L.
Book Article
2014Standard-Reflowlöten für Anwendungen bis 300°C - ein Widerspruch?
Fix, A.; Herberholz, T.; Guyenot, M.; Nowottnick, M.; Novikov, A.; Schulze, J.; Trodler, J.; Hutter, M.; Ehrhardt, C.; Dudek, R.; Wilke, K.; Strogies, J.; Seiler, B.; Kreyßig, K.; Diehm, R.; Liedke, V.; Zerna, T.; Klemm, A.
Conference Paper
2014Thermo-mechanical behavior and reliability issues for high temperature interconnections
Dudek, R.; Sommer, P.; Döring, R.; Herberholz, T.; Fix, A.; Seiler, B.; Rzepka, S.
Conference Paper
2014Untersuchung des Risswachstums in 3D - Verformungsmessung mittels Röntgenmikrotomographie
Zeismann, F.; Bode, B.; Motoyashiki-Besel, Y.; Brueckner-Foit, A.; Tomizato, F.; Kobayashi, M.; Toda, H.; Uesugi, K.; Takeuchi, A.; Suzuki, Y.; Haase, S.; Erb, R.; Seiler, B.; Dost, M.
Conference Paper
2013Characterization of the thermo-mechanical deformation behaviour of composite materials for power electronics using digital image correlation method microDAC
Seiler, B.; Dudek, R.; Scheiter, L.; Kreyssig, K.; Haase, S.
Conference Paper
2013FEM-basierte Zuverlässigkeitsprognostik für die Verbindungstechnik in der Leistungselektronik
Dudek, R.; Doering, R.; Seiler, B.
Book Article
2013Imaging device and method for optical 3d deformation characterization of materials. composites and components.
Dost, M.; Scheiter, L.; Seiler, B.; Lauenstein, T.; Haase, S.
Conference Paper
2012Capturing interface toughness parameters from shear testing using different fracture mechanics approaches
Auersperg, J.; Dudek, R.; Brämer, B.; Pufall, R.; Seiler, B.; Michel, B.
Conference Paper
2012Delamination modeling for power packages by the cohesive zone approach
Dudek, R.; Doering, R.; Pufall, R.; Kanert, W.; Seiler, B.; Rzepka, S.; Michel, B.
Conference Paper
2012Determination of interface fracture parameters by shear testing using different theoretical approaches
Dudek, R.; Brämer, B.; Auersperg, J.; Pufall, R.; Walter, H.; Seiler, B.; Wunderle, B.
Conference Paper
2012Studies on the reliability of power packages based on strength and fracture criteria
Dudek, R.; Pufall, R.; Seiler, B.; Michel, B.
Journal Article
2011Correlation based local measurement of small CTE for high temperature power electronics packaging
Hammacher, J.; Dost, M.; Seiler, B.; Scheiter, L.; Noack, E.; Rzepka, S.; Michel, B.
Conference Paper
2011Studies on the reliability of power packages based on strength and fracture criteria
Dudek, R.; Pufall, R.; Seiler, B.; Michel, B.
Conference Paper
2010Display Forming Polymer/Liquid Crystal Composite Layers and Their Stability Against External Mechanical Distortions
Bauer, M.; Hartmann, L.; Kuschel, F.; Seiler, B.; Noack, E.
Journal Article
2009Active components embedded into organic boards - Accelerated design by means of finite element simulation and micro deformation measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2009Active components embedded into organic boards-accelerated design by means of finite element simulation and micro deformation measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2009Influence of nano composites on reliability and mechanical properties of moisture sensors
Hammacher, J.; Saettler, P.; Kreyßig, K.; Martin, J.; Seiler, B.; Michel, B.
Conference Paper
2008Determination of mechanical properties of electronic packaging materials dependent on temperature by means of VEDDAC-method
Walter, H.; Seiler, B.; Bombach, C.
Conference Paper, Journal Article
2008Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2008Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2008Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A.
Conference Paper
2007In die Leiterplatte integrierte ICs - Verformungsanalyse mit numerischen und messtechnischen Methoden
Sommer, J.-P.; Noack, E.; Seiler, B.; Michel, B.
Conference Paper
2007Zuverlässigkeit für elektronische Bauelemente mit hoher Packungsdichte
Sommer, J.-P.; Dudek, R.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2006Bestimmung der Querkontraktionszahl von Polymeren in Abhängigkeit von der Temperatur mit Hilfe des UNIDAC-Verfahrens
Walter, H.; Seiler, B.; Bombach, C.; Michel, B.
Conference Paper
2006Simulation of Interface Cracks in Microelectronic Packaging
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2005Digital image correlation - a versatile experimental tool to improve reliability, security and lifetime
Dost, M.; Seiler, B.; Erb, R.; Michel, B.
Abstract
2005Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2005Quantitative Analysis of the Adhesive Strength as Tool for the Reliability-focused Design of Micro-technical Structures
Seiler, B.; Auersperg, J.; Noack, E.; Lampke, T.; Dost, M.
Conference Paper
2004Mechanische Charakterisierung membranartiger Sonsorstrukturen
Winkler, T.; Seiler, B.; Dost, M.; Brokmann, G.; Übensee, H.; Rümmler, N.; Faust, W.; Sommer, J.-P.
Conference Paper
2001Experimentelle und numerische Methoden zur Charakterisierung von Mikrobauteilen
Sommer, J.-P.; Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B.
Conference Paper
2000Characterisation of micromaterials and microcomponents by combination of microbending test and UNIDAC
Seiler, B.; Kieselstein, E.; Dost, M.; Wielage, B.; Michel, B.
Conference Paper
2000Characterization of Micro Materials and Micro Components by Combination of the Micro-Bending Test and UNIDAC
Michel, B.; Seiler, B.; Dost, M.; Wielage, B.; Kieselstein, E.; Winkler, T.; Dudek, R.; Auersperg, J.; Schubert, A.; Schneider, W.
Conference Paper
2000Investigation of interface cracking in electronic packages
Kieselstein, E.; Seiler, B.; Winkler, T.; Auersperg, J.; Dudek, R.; Schubert, A.; Schneider, W.; Michel, B.
Conference Paper
2000UNIDAC: Cross correlation based deformation analysis at digitised micrographs to study material behaviour and parameters in MST
Dost, M.; Kieselstein, E.; Erb, R.; Seiler, B.; Vogel, J.; Bombach, C.; Großer, V.; Vogel, D.; Michel, B.
Conference Paper
1999Determination of material properties by the optical measuring procedure UNIDAC
Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B.
Journal Article

 

<