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| 2020 | Back-End-of-Line Compatible Low-Temperature Furnace Anneal for Ferroelectric Hafnium Zirconium Oxide Formation
Lehninger, D.; Olivo, R.; Ali, T.; Lederer, M.; Kämpfe, T.; Mart, C.; Biedermann, K.; Kühnel, K.; Roy, L.; Kalkani, M.; Seidel, K. | Journal Article |
| 2020 | Spannungskontrollierbarer Kondensator mit ferroelektrischer Schicht und Verfahren zum Herstellen des spannungskontrollierbaren Kondensators mit ferroelektrischer Schicht
Kämpfe, Thomas; Polakowski, Patrick; Seidel, Konrad | Patent |
| 2020 | Spannungskontrollierbarer Kondensator und Verfahren zum Herstellen eines spannungskontrollierbaren Kondensators
Kämpfe, Thomas; Polakowski, Patrick; Seidel, Konrad | Patent |
| 2020 | Structural and Electrical Comparison of Si and Zr Doped Hafnium Oxide Thin Films and Integrated FeFETs Utilizing Transmission Kikuchi Diffraction
Lederer, M.; Kämpfe, T.; Vogel, N.; Utess, D.; Volkmann, B.; Ali, T.; Olivo, R.; Müller, J.; Beyer, S.; Trentzsch, M.; Seidel, K.; Eng, L.M. | Journal Article |
| 2020 | Ultra-Low PoweR TechnologIes and MEmory architectures for IoT
Seidel, Konrad; Eichler, Uwe | Report |
| 2019 | Principles and Challenges for Binary Oxide Based Ferroelectric Memory FeFET
Ali, T.; Polakowski, P.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Steinke, P.; Eng, L.M.; Seidel, K. | Conference Paper |
| 2019 | Principles and Challenges for Binary Oxide Based Ferroelectric Memory FeFET
Ali, T.; Polakowski, P.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Steinke, P.; Eng, L.M.; Seidel, K. | Poster |
| 2019 | Theory and Experiment of Antiferroelectric (AFE) Si-Doped Hafnium Oxide (HSO) Enhanced Floating-Gate Memory
Ali, T.; Polakowski, P.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Steinke, P.; Zimmermann, K.; Biedermann, K.; Eng, L.M.; Seidel, K.; Müller, J. | Journal Article |
| 2018 | High Endurance Ferroelectric Hafnium Oxide-Based FeFET Memory Without Retention Penalty
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Steinke, P.; Calvo, J.; Zimmermann, K.; Müller, J. | Journal Article |
| 2018 | Lightweight Automobiles ALLIANCE Project: First Results of Environmental and Economic Assessment from a Life-Cycle Perspective
Delogu, Massimo; Pero, Francesco del; Zanchi, Laura; Ierides, Marcos; Fernandez, Violeta; Seidel, Kristian; Thirunavukkarasu, Dinesh; Bein, Thilo | Report |
| 2018 | Silicon doped hafnium oxide (HSO) and hafnium zirconium oxide (HZO) based FeFET
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Thrun, X.; Hanisch, N.; Steinke, P.; Calvo, J.; Müller, J. | Journal Article |
| 2018 | Tuning parameters and their impact on ferroelectric hafnium oxide
Polakowski, Patrick; Büttner, Teresa; Ali, Tarek Nadi Ismail; Riedel, Stefan; Kämpfe, Thomas; Seidel, Konrad; Müller, Johannes; Pätzold, Björn | Presentation |
| 2017 | Charakterisierung der Zuverlässigkeit in der High-k Metal Gate Technologie
Drescher, Maximilian; Erben, Elke; Grass, Carsten; Trentzsch, Martin; Lazarevic, Florian; Leitsmann, Roman; Plaenitz, Philipp; Mchedlidze, Teimuraz; Seidel, Konrad; Liske, Romy; Bartha, Johann Wolfgang | Conference Paper |
| 2017 | Enhanced reliability and capacitance stability of ZrO2-based decoupling capacitors by interface doping with Al2O3
Mart, C.; Zybell, S.; Riedel, S.; Czernohorsky, M.; Seidel, K.; Weinreich, W. | Journal Article |
| 2017 | Gewitter im Chip - Resistive Speicher für low-power Anwendungen
Seidel, Konrad; Riedel, Stefan; Kalishettyhalli Ma, Mamathamba; Polakowski, Patrick; Müller, Johannes | Conference Paper |
| 2017 | High-K metal gate stacks with ultra-thin interfacial layers formed by low temperature microwave-based plasma oxidation
Czernohorsky, M.; Seidel, K.; Kühnel, K.; Niess, J.; Sacher, N.; Kegel, W.; Lerch, W. | Journal Article |
| 2016 | Identifikation von Zukunftsforschungsfeldern für eine Forschungseinrichtung
Schirrmeister, Elna; Teufel, Benjamin; Schulte, Anna Julia; Notthoff, Claudia; Ardilio, Antonino; Le, Nguyen-Truong; Seidel, Katja; Behlau, Lothar | Conference Paper |
| 2016 | La-doped ZrO2 based Back End of Line (BEoL) decoupling capacitors
Weinreich, Wenke; Seidel, Konrad; Polakowski, Patrick; Drescher, Maximilian; Gummenscheimer, A.; Nolan, M.G.; Cheng, L.; Triyoso, D.H. | Poster |
| 2016 | La-doped ZrO2 based BEoL decoupling capacitors
Weinreich, W.; Seidel, K.; Polakowski, P.; Drescher, M.; Gummenscheimer, A.; Nolan, M.G.; Cheng, L.; Triyoso, D.H. | Conference Paper |
| 2015 | Nano patterning at Fraunhofer IPMS-CNT: Fabrication of silicon master for NIL via e-beam direct write
Thrun, Xaver; Choi, Kang-Hoon; Gutsch, Manuela; Hohle, Christoph; Rudolph, Matthias; Seidel, Konrad | Poster |
| 2015 | Ultra-Thin high density capacitors for advanced packaging solutions
Seidel, K.; Böttcher, M.; Dobritz, S.; Czernohorsky, M.; Riedel, S.; Weinreich, W. | Conference Paper |
| 2015 | Untersuchungen an Zylinderlaufbahnen mit neuer galvanisch aufgebrachter Eisenbeschichtung
Beriet, P.; Knapp, A.; Brink, A.; Scherge, M.; Blaszczyk, M.; Möndel, A.; Seidel, K.; Ziegler, G.; Gramm, A.; Gramm, G. | Journal Article |
| 2014 | ALD Ta2O5 and Hf-doped Ta2O5 for BEOL compatible MIM
Triyoso, D.H.; Weinreich, W.; Seidel, K.; Nolan, M.G.; Polakowski, P.; Utess, D.; Ohsiek, S.; Dittmar, K.; Weisheit, M.; Liebau, M.; Fox, R. | Conference Paper |
| 2014 | ALD ZrO2 processes for BEoL device applications
Weinreich, Wenke; Seidel, Konrad; Polakowski, Patrick; Riedel, Stefan; Wilde, Lutz; Sundqvist, Jonas; Triyoso, Dina H.; Nolan, Mark G. | Conference Paper |
| 2014 | Ferroelectric deep trench capacitors based on Al:HfO2 for 3D nonvolatile memory applications
Polakowski, Patrick; Riedel, Stefan; Weinreich, Wenke; Rudolf, M.; Sundqvist, Jonas; Seidel, Konrad; Müller, Johannes | Conference Paper |
| 2014 | Understanding the materials, electrical and reliability impact of Al-addition to ZrO2 for BEOL compatible MIM capacitors
Triyoso, D.H.; Chu, S.; Seidel, K.; Weinreich, W.; Yiang, K.-Y.; Nolan, M.G.; Brunco, D.P.; Rinderknecht, J.; Utess, D.; Kyono, C.; Miller, R.; Park, J.; Cheng, L.; Liebau, M.; Lomtscher, P.; Fox, R. | Conference Paper |
| 2013 | Detailed leakage current analysis of metal-insulator-metal capacitors with ZrO2, ZrO2/SiO2/ZrO2, and ZrO2/Al2O3/ZrO2 as dielectric and TiN electrodes
Weinreich, W.; Shariq, A.; Seidel, K.; Sundqvist, J.; Paskaleva, A.; Lemberger, M.; Bauer, A.J. | Journal Article, Conference Paper |
| 2013 | Ferroelectric hafnium oxide: A CMOS-compatible and highly scalable approach to future ferroelectric memories
Müller, J.; Böscke, T.S.; Müller, S.; Yurchuk, E.; Polakowski, P.; Paul, J.; Martin, D.; Schenk, T.; Khullar, K.; Kersch, A.; Weinreich, W.; Riedel, S.; Seidel, K.; Kumar, A.; Arruda, T.M.; Kalinin, S.V.; Schlösser, T.; Boschke, R.; Bentum, R. van; Schröder, U.; Mikolajick, T. | Conference Paper |
| 2013 | High-density capacitors for SiP and SoC applications based on three-dimensional integrated metal-isolator-metal structures
Weinreich, Wenke; Rudolph, Matthias; Koch, Johannes; Paul, Jan; Seidel, Konrad; Riedel, Stefan; Sundqvist, Jonas | Conference Paper |
| 2013 | Optimized electrode and interface for enhanced reliability of high-k based metal-insulator-metal capacitors
Koch, Johannes; Seidel, Konrad; Weinreich, Wenke; Riedel, Stefan; Chiang, Jung-Chin; Beyer, Volkhard | Journal Article |
| 2013 | Reliability comparison of pure ZrO2 and Al- doped ZrO2 MIM capacitors
Seidel, K.; Weinreich, Wenke; Polakowski, P.; Triyoso, D.H.; Nolan, M.G.; Yiang, K.Y.; Chu, S. | Conference Paper |
| 2013 | Scaling and optimization of high-density integrated Si-capacitors
Weinreich, W.; Seidel, K.; Rudolph, M.; Koch, J.; Paul, J.; Riedel, S.; Sundqvist, J.; Steidel, K.; Gutsch, M.; Beyer, V.; Hohle, C. | Conference Paper |
| 2013 | TEMAZ/O-3 atomic layer deposition process with doubled growth rate and optimized interface properties in metal-insulator-metal capacitors
Weinreich, W.; Tauchnitz, T.; Polakowski, P.; Drescher, M.; Riedel, S.; Sundqvist, J.; Seidel, K.; Shirazi, M.; Elliott, S.D.; Ohsiek, S.; Erben, E.; Trui, B. | Journal Article |
| 2012 | Effect of different PDAs and a PMA on the electrical performance of TiN/ZAZ/TiN MIM capacitors
Weinreich, W.; Seidel, K.; Sundqvist, J.; Czernohorsky, M.; Kucher, P. | Conference Paper |
| 2012 | Ferroelectricity in HfO 2 enables nonvolatile data storage in 28 nm HKMG
Müller, J.; Yurchuk, E.; Schlösser, T.; Paul, J.; Hoffmann, R.; Müller, S.; Martin, D.; Slesazeck, S.; Polakowski, P.; Sundqvist, J.; Czernohorsky, M.; Seidel, K.; Kücher, P.; Boschke, R.; Trentzsch, M.; Gebauer, K.; Schröder, U.; Mikolajick, T. | Conference Paper |
| 2010 | Characterization of anomalous erase effects in 48 nm TANOS memory cells
Loehr, D.-A.; Hoffmann, R.; Naumann, A.; Paul, J.; Seidel, K.; Czernohorsky, M.; Beyer, V. | Conference Paper |
| 2010 | Impact of the storage layer charging on random telegraph noise behavior of sub-50nm charge-trap-based TANOS and floating-gate memory cells
Seidel, K.; Hoffman, R.; Naumann, A.; Paul, J.; Löhr, D.-A.; Czernohorsky, M.; Beyer, V. | Conference Paper |
| 2009 | Analysis of trap mechanisms responsible for Random Telegraph Noise and erratic programming on sub-50nm floating gate flash memories
Seidel, Konrad; Hoffmann, Raik; Löhr, Daniel-Andre; Melde, Thomas; Czernohorsky, Malte; Paul, Jan; Beug, M. Florian; Beyer, Volkhard | Conference Paper |
| 2009 | Electrical analysis of unbalanced Flash memory array construction effects and their impact on performance and reliability
Seidel, K.; Müller, T.; Brandt, T.; Hoffmann, R.; Löhr, D.-A.; Melde, T.; Czernohorsky, M.; Paul, J.; Beyer, V. | Conference Paper |
| 2009 | Improvement of 48 nm TANOS NAND cell performance by introduction of a removable encapsulation liner
Beug, M. Florian; Melde, Thomas; Paul, Jan; Bewersdorff-Sarlette, Ulrike; Czernohorsky, Malte; Beyer, Volkhard; Hoffmann, Raik; Seidel, Konrad; Löhr, Daniel-Andre; Bach, Lars; Knöfler, R.; Tilke, Armin T. | Conference Paper |
| 2001 | Engineering-Cooperations. Der Nutzen von Engineering Workflow
Kallmeyer, O.; Hauss, I.; Seidel, K.-A.
: Bullinger, H.-J.; Schraft, R.D.; Westkämper, E. | Study |
| 2001 | A process module based methodology for business process engineering and synchronization
Seidel, K.-A.; Richter, M.; Bullinger, H.-J. | Conference Paper |
| 2000 | Virtual assembly planning
Bullinger, H.-J.; Richter, M.; Seidel, K.-A. | Journal Article |
| 1998 | Advanced assembly and disassembly planning using virtual reality techniques
Bullinger, H.-J.; Menrad, W.; Seidel, K.-A. | Conference Paper |