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| 2019 | Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales
Sheremet, E.; Meszmer, P.; Blaudeck, T.; Hartmann, S.; Wagner, C.; Ma, B.; Hermann, S.; Wunderle, B.; Schulz, S.E.; Hietschold, M.; Rodriguez, R.D.; Zahn, D.R.T. | Journal Article |
| 2019 | Computationally efficient simulation method for conductivity modeling of 2D-based conductors
Rizzi, L.; Zienert, A.; Schuster, J.; Köhne, M.; Schulz, S.E. | Journal Article |
| 2019 | Electroforming-free resistive switching in yttrium manganite thin films by cationic substitution
Rayapai, V.R.; Bürger, D.; Du, N.; Patra, R.; Skorupa, I.; Blaschke, D.; Stöcker, H.; Matthes, P.; Schulz, S.E.; Schmidt, H. | Journal Article |
| 2019 | Iron(III) β-diketonates: CVD precursors for iron oxide film formation
Pousaneh, E.; Korb, M.; Assim, K.; Rüffer, T.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Schulz, S.E.; Lang, H. | Journal Article |
| 2019 | Magnetic tunnel junctions: Laser annealing versus oven annealing
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Koehler, N.; Busse, S.; Mueller, M.; Exner, H.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2018 | Application of quantum cascade laser absorption spectroscopy for correlation studies in plasma etching processes in the semiconductor industry
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.; Helden, J.H. van | Conference Paper |
| 2018 | β-Ketoiminato-based copper(II) complexes as CVD precursors for copper and copper oxide layer formation
Pousaneh, E.; Korb, M.; Dzhagan, V.; Weber, M.; Noll, J.; Mehring, M.; Zahn, D.R.T.; Schulz, S.E.; Lang, H. | Journal Article |
| 2018 | Electroforming-free resistive switching in polycrystalline YMnO3 thin films
Rayapati, V.R.; Du, N.; Bürger, D.; Patra, R.; Skorupa, I.; Matthes, P.; Stöcker, H.; Schulz, S.E.; Schmidt, H. | Journal Article |
| 2018 | Fabrication and operation of protein-powered biocomputation using nanostructured networks
Meinecke, C.; Reuter, D.; Schulz, S.E.; Korten, T.; Heldt, G.; Diez, S. | Conference Paper |
| 2018 | Integration of covalent and non-covalent functionalized SWCNTs in FETs
Kossmann, A.; Adner, D.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Lang, H. | Abstract |
| 2018 | Magnesium β-ketoiminates as CVD precursors for MgO formation
Pousaneh, E.; Rüffer, T.; Assim, K.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Mertens, L.; Mehring, M.; Schulz, S.E.; Lang, H. | Journal Article |
| 2018 | Magneto-optical spectroscopy and spectroscopic ellipsometry of Co60Fe20B20 thin films
Sharma, A.; Almeida, M.; Matthes, P.; Ecke, R.; Zahn, D.R.T.; Schulz, S.E.; Salvan, G. | Abstract |
| 2018 | Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs
Hartmann, M.; Schubel, R.; Claus, M.; Jordan, R.; Schulz, S.E.; Hermann, S. | Journal Article |
| 2018 | The role of plasma analytics in leading-edge semiconductor technologies
Zimmermann, S.; Haase, M.; Lang, N.; Röpcke, J.; Schulz, S.E.; Otto, T. | Journal Article, Conference Paper |
| 2018 | Scaling up integration of carbon nanotubes into Micro-Electro-Mechanical systems
Böttger, S.; Jöhrmann, N.; Bonitz, J.; Wunderle, B.; Schulz, S.E.; Hermann, S. | Conference Paper |
| 2018 | Tetranuclear yttrium and gadolinium 2-acetylcyclopentanoate clusters: Synthesis and their use as spin-coating precursors for metal oxide film formation for field-effect transistor fabrication
Pousaneh, E.; Preuß, A.; Assim, K.; Rüffer, T.; Korb, M.; Tittmann-Otto, J.; Hermann, S.; Schulz, S.E.; Lang, H. | Journal Article |
| 2018 | Tuning of diameter and electronic type of CCVD grown SWCNTs
Jafarpour, S.M.; Schulz, S.E.; Hermann, S. | Journal Article |
| 2017 | 3D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2017 | Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny | Conference Paper |
| 2017 | Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes
Jafarpour, S.M.; Kini, M.; Schulz, S.E.; Hermann, S. | Journal Article |
| 2017 | Low-temperature chemical vapor deposition of cobalt oxide thin films from a dicobaltatetrahedrane precursor
Melzer, M.; Nichenametla, Charan K.; Georgi, Colin; Lang, Heinrich; Schulz, S.E. | Journal Article |
| 2017 | Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper
Hu, X.; Schuster, J.; Schulz, S.E. | Journal Article |
| 2017 | Scalable fabrication of carbon nanotube field-effect transistors (CNT-FETs) implementing wafer-level electron-beam lithography and dielectrophoretic CNT assembly
Blaudeck, T.; Hermann, S.; Hartmann, M.; Böttger, S.; Tittmann-Otto, J.; Heldt, G.; Reuter, D.; Schulz, S.E. | Abstract |
| 2017 | A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load
Jöhrmann, N.; Hartmann, S.; Jacob, K.; Bonitz, J.; MacArthur, K.E.; Hermann, S.; Schulz, S.E.; Wunderle, B. | Conference Paper |
| 2016 | Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy
Dhakal, D.; Assim, K.; Lang, H.; Bruener, P.; Grehl, T.; Georgi, C.; Waechtler, T.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Bis(β-diketonato)-and allyl-(β-diketonato)-palladium(II) complexes: Synthesis, characterization and MOCVD application
Assim, K.; Melzer, M.; Korb, M.; Rüffer, T.; Jakob, A.; Noll, J.; Georgi, C.; Schulz, S.E.; Lang, H. | Journal Article |
| 2016 | CF3Br plasma cryo etching of low-k porous dielectric
Clemente, I.; Koehler, N.; Miakonkikh, A.; Zimmermann, S.; Schulz, S.E.; Rudenko, K. | Journal Article, Conference Paper |
| 2016 | Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E. | Journal Article, Conference Paper |
| 2016 | Chemical vapor deposition of ruthenium-based layers by a single-source approach
Jeschke, J.; Möckel, S.; Korb, M.; Rüffer, T.; Assim, K.; Melzer, M.; Herwig, G.; Georgi, C.; Schulz, S.E.; Lang, H. | Journal Article |
| 2016 | Competitive impact of nanotube assembly and contact electrodes on the performance of CNT-based FETs
Toader, M.; Hermann, S.; Scharfenberg, L.; Hartmann, M.; Mertig, M.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Effect of cleaning procedures on the electrical properties of carbon nanotube transistors - a statistical study
Tittmann-Otto, J.; Hermann, S.; Kalbacova, J.; Hartmann, M.; Toader, M.; Rodriguez, R.D.; Schulz, S.E.; Zahn, D.R.T.; Gessner, T. | Journal Article |
| 2016 | Enhancement of carbon nanotube FET performance via direct synthesis of poly (sodium 4-styrenesulfonate) in the transistor channel
Toader, M.; Schubel, R.; Hartmann, M.; Scharfenberg, L.; Jordan, R.; Mertig, M.; Schulz, S.E.; Gessner, T.; Hermann, S. | Journal Article |
| 2016 | Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2016 | Exploitation of giant piezoresistivity - CNT sensors fabricated with a wafer-level technology
Böttger, S.; Schulz, S.E.; Hermann, S. | Journal Article, Conference Paper |
| 2016 | High-resolution inkjet printing of conductive carbon nanotube twin lines utilizing evaporation-driven self-assembly
Dinh, Nghia Trong; Sowade, Enrico; Blaudeck, T.; Hermann, S.; Rodriguez, Raul D.; Zahn, Dietrich R.T.; Schulz, S.E.; Baumann, R.R.; Kanoun, Olfa | Journal Article |
| 2016 | An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2016 | Length separation of single-walled carbon nanotubes and its impact on structural and electrical properties of wafer-level fabricated carbon nanotube-field-effect transistors
Böttger, S.; Hermann, S.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Manganese half-sandwich complexes as metal-organic chemical vapor deposition precursors for manganese-based thin films
Assim, K.; Jeschke, J.; Jakob, A.; Dhakal, D.; Melzer, M.; Georgi, C.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2016 | A MEMS test stage for in situ testing of interfaces between carbon nanotubes and metals
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2016 | Metal nanoparticles reveal the organization of single-walled carbon nanotubes in bundles
Rodriguez, R.D.; Blaudeck, T.; Kalbacova, J.; Sheremet, E.; Schulze, S.; Adner, D.; Hermann, S.; Hietschold, M.; Lang, H.; Schulz, S.E.; Zahn, D.R.T. | Journal Article |
| 2016 | A plasma assisted in situ restoration process for sidewall damaged ULK dielectrics
Koehler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E. | Journal Article |
| 2016 | Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
Hofmann, L.; Fischer, T.; Werner, T.; Selbmann, F.; Rennau, M.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2016 | Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems
Bonitz, J.; Böttger, S.; Herrmann, S.; Schulz, S.E.; Gessner, T.; Hartmann, S.; Wunderle, B. | Conference Paper |
| 2015 | [Ag{S2CNR(C2H4OH)}] as single-source precursor for Ag2S – synthesis, decomposition mechanism, and deposition studies
Mothes, R.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2015 | 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T. | Conference Paper |
| 2015 | 3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2015 | Back-end-of-line compatible contact materials for carbon nanotube based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rennau, M.; Rodriguez, R.D.; Sheremet, E.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
| 2015 | Carbon Nanotube based sensors in MEMS/NEMS
Hermann, S.; Bonitz, J.; Boettger, S.; Hartmann,S; Shaporin, A.; Mehner, J.; Wunderle, B.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2015 | Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials
Foerster, A.; Koehler, N.; Zimmermann, S.; Fischer, T.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E.; Gessner, T. | Abstract |
| 2015 | Experimental investigations on a plasma assisted in situ restoration process for sidewall damaged ultra low-k dielectrics
Köhler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E. | Conference Paper |
| 2015 | Half-sandwich cobalt complexes in the metal-organic chemical vapor deposition process
Georgi, C.; Hapke, M.; Thiel, I.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Lang, H. | Journal Article |
| 2015 | High-performance giant magnetoresistive sensorics on flexible Si membranes
Pérez, N.; Melzer, M.; Makarov, D.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Schmidt, O.G. | Journal Article |
| 2015 | Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | Investigation of barrier formation and stability of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E. | Conference Paper |
| 2015 | k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials — A DFT and MD Study
Foerster, A.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E. | Abstract |
| 2015 | Materials for Advanced Metallization 2014 (MAM 2014). Preface
Schulz, S.E.; Hecker, M.; Korner, H.; Wolf, H. | Conference Paper, Journal Article |
| 2015 | Monolithic integration of 2D spin valve magnetic field sensors for angular sensing
Almeida, M.J.; Götze, T.; Ueberschär, O.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E. | Conference Paper |
| 2015 | On treatment of ultra-low-k SiCOH in CF4 plasmas: Correlation between the concentration of etching products and etching rate
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J. | Journal Article |
| 2015 | Optimized monolithic 2-D spin-valve sensor for high-sensitivity compass applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Rückriem, R.; Schuster, J.; Exner, H.; Schulz, S.E. | Journal Article |
| 2015 | Optimum laser exposure for setting exchange bias in spin valve sensors
Almeida, M.J.; Matthes, P.; Ueberschär, O.; Müller, M.; Ecke, R.; Exner, H.; Albrecht, M.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | Quantum cascade laser based monitoring of CF2 radical concentration as a diagnostic tool of dielectric etching plasma processes
Hübner, M.; Lang, N.; Zimmermann, S.; Schulz, S.E.; Buchholtz, W.; Röpcke, J.; Helden, J.H. van | Journal Article |
| 2015 | Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
| 2015 | Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2015 | Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics
Hartmann, S.; Shaporin, A.; Hermann, S.; Bonitz, J.; Heggen, M.; Meszmer, P.; Sturm, H.; Hölck, O.; Blaudeck, T.; Schulz, S.E.; Mehner, J.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2015 | Wafer-level decoration of carbon nanotubes in field-effect transistor geometry with preformed gold nanoparticles using a microfluidic approach
Blaudeck, T.; Adner, D.; Hermann, S.; Lang, H.; Gessner, T.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | A wafer-level test platform for statistical TEM analysis of the structural properties of integrated carbon nanotubes
Hartmann, M.; Hermann, S.; Pohl, D.; Rellinghaus, B.; Schulz, S.E. | Abstract |
| 2015 | Wetting behavior of plasma etch residue removal solutions on plasma damaged and repaired porous ULK dielectrics
Ahner, N.; Zimmermann, S.; Köhler, N.; Krüger, S.; Schulz, S.E. | Conference Paper |
| 2014 | ALD of Nickel Oxide and its Reduction to Nickel for Potential Applications in Interconnects and Spintronics
Wächtler, T.; Sharma, A.; Ahner, N.; Melzer, M.; Mueller, S.; Lehmann, D.; Schäfer, P.; Schulze, S.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Gessner, T. | Conference Paper |
| 2014 | Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
| 2014 | Challenges of current and future advanced interconnect systems for integrated circuits
Schulz, S.E.; Ahner, N.; Fischer, T.; Koerner, H.; Oszinda, T.; Schulze, K.; Zimmermann, S. | Book Article |
| 2014 | A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems
Georgi, C.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2014 | Corrigendum to "Controlling SWCNT assembling density by electrokinetics" [Sensors and Actuators, A: Physical (2013) 201 (36-42)]
Yu, H.; Hermann, S.; Dong, Z.; Mai, J.; Li, W.J.; Schulz, S.E. | Journal Article |
| 2014 | Deposition of copper thin films for ULSI interconnects by ALD of copper oxide and subsequent reduction
Waechtler, T.; Mothes, R.; Hofmann, L.; Schulze, S.; Oswald, S.; Schulz, S.E.; Lang, H.; Hietschold, M.; Gessner, T. | Book Article |
| 2014 | The dielectric response of low-k interlayer dielectric material characterized by electron energy loss spectroscopy
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Journal Article |
| 2014 | Dispersion Preparation for Wafer-Level Liquid Processing of Carbon Nanotube Microsensors
Hille, Toni; Blaudeck, T.; Hermann, S.; Schulz, S.E. | Conference Paper |
| 2014 | Hysteresis-free carbon nanotube field-effect transistors without passivation
Tittmann, J.; Hermann, S.; Schulz, S.E.; Pacheco-Sanchez, A.; Claus, M.; Schröter, M. | Conference Paper |
| 2014 | Influence of porosity and methyl doping inside silica network
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Journal Article |
| 2014 | Interaction Between Carbon Nanotubes and Metals: Electronic Properties, Stability, and Sensing
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Conference Paper |
| 2014 | Interaction between semiconducting carbon nanotubes and metals: Sensing, stability and electronic properties
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Conference Paper |
| 2014 | Interface Resistance of Carbon-Nanotube-Based Interconnects
Fiedler, H.; Toader, Marius; Hermann, S.; Rennau, M.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Hietschold, Michael; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2014 | Localization length of integrated multi-walled carbon nanotubes
Fiedler, H.; Hermann, S.; Rennau, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2014 | Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Hartmann, S.; Hölck, O.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2014 | Monolithic spin valve compass for autonomous MEMS navigation in geomagnetic field
Almeida, M.J.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Matthes, P.; Müller, M.; Exner, H. | Conference Paper |
| 2014 | Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium
Hartmann, S.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2014 | Raman spectroscopy study of the interaction of gold nanoparticles with carbon-nanotubefield-effect transistors
Kalbacova, Jana; Rodriguez, Raul D.; Blaudeck, T.; Hermann, S.; Sheremet, E.; Adner, David; Lang, Heinrich; Schulz, S.E.; Zahn, Dietrich R.T. | Conference Paper |
| 2014 | Sidewall Damage Analysis of Low-k Dielectricmaterial by Using Energy-Filtered Transmission Electron Microscopy
Singh, P.K.; Zimmermann, S.; Waechtler, T.; Schulze, Steffen; Schulz, S.E.; Hietschold, Michael | Conference Paper |
| 2014 | Simulation of ALD chemistry of copper metalorganic precursors on Ta(110) Surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2014 | Surface chemistry of a Cu(I) beta-diketonate precursor and the atomic layer deposition of Cu2O on SiO2 studied by x-ray photoelectron spectroscopy
Dhakal, D.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.; Mothes, R.; Tuchscherer, A. | Journal Article |
| 2014 | Tip-Enhanced Raman Spectroscopy for the Characterization of Carbon Nanotubes
Sheremet, E.; Rodriguez, Raul D.; Krayev, A.; Kalbacova, Jana; Hermann, S.; Schulz, S.E.; Zahn, Dietrich R.T. | Conference Paper |
| 2014 | Wafer-Level Functionalization of Integrated Carbon Nanotubes with Metal Nanoparticles
Blaudeck, T.; Adner, David; Hermann, S.; Schulz, S.E.; Lang, Heinrich; Gessner, T. | Conference Paper |
| 2013 | 3D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding
Hofmann, L.; Baum, M.; Schulz, S.E.; Wiemer, M.; Geßner, T. | Conference Paper |
| 2013 | Conductive AFM for CNT characterization
Toader, M.; Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.; Hietschold, M. | Journal Article, Conference Paper |
| 2013 | Controlling SWCNT assembling density by electrokinetics
Yu, H.; Hermann, S.; Dong, Z.; Mai, J.; Li, W.J.; Schulz, S.E. | Journal Article |
| 2013 | Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications
Melzer, M.; Waechtler, T.; Müller, S.; Fiedler, H.; Hermann, S.; Rodriguez, R.D.; Villabona, A.; Sendzik, A.; Mothes, R.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Lang, H.; Gessner, T. | Journal Article |
| 2013 | Determination of surface energy characteristics of plasma processed ultra low-k dielectrics for optimized wetting in wet chemical plasma etch residue removal
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E. | Conference Paper |
| 2013 | Development and characterisation of 3D integration technologies for MEMS based on copper filled TSVs and copper-to-copper metal thermo compression bonding
Baum, M.; Hofmann, L.; Wiemer, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2013 | Investigations on partially filled HAR TSVs for MEMS applications
Hofmann, L.; Schubert, I.; Gottfried, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2013 | Magneto-optical Kerr effect studies of Cu2O/nickel heterostructures
Salvan, G.; Robaschik, P.; Fronk, M.; Müller, S.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Lang, H.; Schubert, C.; Thomas, S.; Albrecht, M.; Zahn, D.R.T. | Journal Article |
| 2013 | Manipulation of Ni catalyst particle size, shape and areal density on TiN support layer for growth of vertical aligned CNTs
Tittmann, J.; Hermann, S.; Fiedler, H.; Schulz, S.E.; Gessner, T. | Abstract |
| 2013 | Modeling and simulation of the interplay between contact metallization and stress liner technologies for strained silicon
Schuster, J.; Schulz, S.E.; Herrmann, T.; Richter, R. | Journal Article |
| 2013 | TSVs mit hohem Aspektverhältnis und Kupfer-Bonden für MEMS
Hofmann, L.; Baum, M.; Gottfried, K.; Schulz, S.E.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2013 | Vertical Integration techniques for MEMS using HAR TSV
Hofmann, L.; Schubert, I.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2013 | Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes
Shaporin, A.; Hermann, S.; Kaufmann, C.; Schulz, S.E.; Gessner, T.; Voigt, S.; Mehner, J.; Hartmann, S.; Wunderle, B.; Bonitz, J. | Conference Paper |
| 2012 | ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks
Waechtler, T.; Mueller, S.; Fiedler, H.; Melzer, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | Analysis of pore sealing processes and TiN diffusion barrier deposition on a porous ultra low-k dielectric by ellipsometric porosimetry and PALS
Ahner, N.; Ecke, R.; Schulz, S.E.; Jungmann, M.; Krause-Rehberg, R.; Butterling, M.; Anwand, W.; Wagner, A.; Preusse, A. | Conference Paper |
| 2012 | Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications
Fiedler, H.; Ecke, R.; Hermann, S.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study
Sommer, J.; Zienert, A.; Gemming, S.; Schuster, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | Distinguishing between individual contributions to the via resistance in carbon nanotubes based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2012 | FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | Field emitting carbon nanotubes in MEMS-structures for movement sensors
Loschek, S.; Hermann, S.; Haibo, Y.; Schulz, S.E. | Conference Paper |
| 2012 | Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure
Hermann, S.; Schulze, S.; Ecke, R.; Liebig, A.; Schaefer, P.; Zahn, D.R.T.; Albrecht, M.; Hietschold, M.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2012 | Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials
Fischer, T.; Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E. | Journal Article, Conference Paper |
| 2012 | A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices
Zimmermann, S.; Ahner, N.; Fischer, T.; Schaller, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | A Low Damage Patterning Scheme for Ultra Low-k Dielectrics
Zimmermann, S.; Ahner, N.; Fischer,T.; Oszinda,T.; Uhlig, B.; Schulz, S.E.; Gessner,T. | Journal Article |
| 2012 | Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2
Fronk, M.; Müller, S.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Lang, H.; Zahn, D.R.T.; Salvan, G. | Journal Article, Conference Paper |
| 2012 | Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Blský, P.; Streiter, R.; Wolf, H.; Schulz, S.E.; Aubel, O.; Gessner, T. | Journal Article, Conference Paper |
| 2012 | Nanomechanics oc CNTs for Sensor Simulation
Wagner, C.; Hartmann, S.; Schuster, J.; Wunderle, B.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | Nanomechanics of CNTs for sensor application
Wagner, C.; Hartmann, S.; Wunderle, B.; Schuster, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | Nanoscale optical and electrical characterization of horizontally aligned single-walled carbon nanotubes
Rodriguez, R.D.; Toader, M.; Hermann, S.; Sheremet, E.; Mueller, S.; Gordan, O.D.; Yu, H.; Schulz, S.E.; Hietschold, M.; Zahn, D.R.T. | Journal Article, Conference Paper |
| 2012 | Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E. | Conference Paper |
| 2012 | Optimizing sonication parameters for dispersion of single-walled carbon nanotubes
Yu, H.B.; Hermann, S.; Schulz, S.E.; Gessner, T.; Dong, Z.L.; Li, W.J. | Journal Article |
| 2012 | Processes for wafer level integration of carbon nanotubes in electronic and sensor applications
Hermann, S.; Fiedler, H.; Loschek, S.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | Simulation of nanostructures for sensor and circuit applications
Zienert, A.; Wagner, C.; Mohammadzadeh, S.; Schuster, J.; Streiter, R.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | Structuring of carbon nanotubes for field emission based movement sensors
Loschek, S.; Hermann, S.; Yu, H.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | A two-step UV curing process for producing high tensile stressed silicon nitride layers
Fischer, T.; Prager, L.; Hohage, J.; Ruelke, H.; Schulz, S.E.; Richter, R.; Gessner, T. | Conference Paper |
| 2012 | Wafer level approaches for carbon nanotube integration in interconnects and MEMS/NEMS
Hermann, S.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2012 | Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications
Hermann, S.; Fiedler, H.; Haibo, Y.; Loschek, S.; Bonitz, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2011 | ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems
Waechtler, T.; Ding, S.-F.; Hofmann, L.; Mothes, R.; Xie, Q.; Oswald, S.; Detavernier, C.; Schulz, S.E.; Qu, X.-P.; Lang, H.; Gessner, T. | Conference Paper, Journal Article |
| 2011 | Electrical property improvements of ultra low-k ILD using a silylation process feasible for process integration
Thomas, O.; Schaller, M.; Gerlich, L.; Fischer, D.; Leppack, S.; Bartsch, C.; Schulz, S.E. | Conference Paper |
| 2011 | Fabrication and characterisation of CNT via interconnects for application in ULSI circuits
Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2011 | How to evaluate surface free energies of dense and ultra low-kappa dielectrics in pattern structures
Oszinda, T.; Schaller, M.; Dittmar, K.; Jiang, L.; Schulz, S.E. | Conference Paper |
| 2011 | Influence of copper on the catalytic carbon nanotube growth process
Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2011 | Influence of the additives argon, O-2, C4F8, H-2, N-2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Zimmermann, H.; Rülke, H.; Lang, N.; Röpcke, J.; Schulz, S.E.; Geßner, T. | Conference Paper, Journal Article |
| 2011 | Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials
Fischer, T.; Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E. | Conference Paper |
| 2011 | The inhibition of enhanced Cu oxidation on ruthenium/diffusion barrier layers for Cu interconnects by carbon alloying into Ru
Ding, S.-F.; Xie, Q.; Mueller, S.; Waechtler, T.; Lu, H.-S.; Schulz, S.E.; Detavernier, C.; Qu, X.-P.; Gessner, T. | Journal Article |
| 2011 | Investigations regarding through silicon via filling for 3D integration by periodic pulse reverse plating with and without additives
Hofmann, L.; Ecke, R.; Schulz, S.E.; Geßner, T. | Conference Paper, Journal Article |
| 2011 | Lewis-base copper(I) formates: Synthesis, reaction chemistry, structural characterization and their use as spin-coating precursors for copper deposition
Tuchscherer, A.; Shen, Y.; Jakob, A.; Mothes, R.; Al-Anber, M.; Walfort, B.; Rüffer, T.; Frühauf, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2011 | Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Belsky, P.; Streiter, R.; Wolf, H.; Schulz, S.E.; Aubel, O.; Gessner, T. | Conference Paper |
| 2011 | Prediction of wafer homogeneity maps using a virtual metrology scheme consisting of time resolved OES measurements and a neural network
Zimmermann, S.; Reich, R.; Zacher, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2011 | Smart systems
Gessner, T.; Vogel, M.; Otto, T.; Schulz, S.E.; Baumann, R. | Conference Paper |
| 2011 | Thermal ALD of Cu via reduction of CuxO films for the advanced metallization in spintronic and ULSI interconnect systems
Mueller, S.; Waechtler, T.; Tuchscherer, A.; Mothes, R.; Gordan, O.; Lehmann, D.; Haidu, F.; Ogiewa, M.; Gerlich, L.; Ding, S.-F.; Schulz, S.E.; Gessner, T.; Lang, H.; Zahn, D.R.T.; Qu, X.-P. | Conference Paper |
| 2011 | Variable-shaped e-beam lithography enabling process development for future copper damascene technology
Jaschinsky, P.; Erben, J.-W.; Choi, K.-H.; Schulze, K.; Gutsch, M.; Freitag, M.; Schulz, S.E.; Steidel, K.; Hohle, C.; Gessner, T.; Kücher, P. | Journal Article, Conference Paper |
| 2010 | Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Rülke, H.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2010 | Business units and core competences of Fraunhofer ENAS
Gessner, T.; Vogel, M.; Otto, T.; Schulz, S.E.; Baumann, R.R. | Journal Article |
| 2010 | Carbon nanotubes for nanoscale low temperature flip chip connections
Hermann, S.; Pahl, B.; Ecke, R.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2010 | Chemical Repair of plasma damaged porous ultra low-k SiOCH film using a vapor phase process
Oszinda, T.; Schaller, M.; Schulz, S.E. | Conference Paper |
| 2010 | Chemical repair of plasma damaged porous ultra low-kappa SiOCH film using a vapor phase process
Oszinda, T.; Schaller, M.; Schulz, S.E. | Journal Article |
| 2010 | How to evaluate surface free energies of dense and ultra low-k dielectrics in pattern structures
Oszinda, T.; Schaller, M.; Dittmar, K.; Jiang, L.; Schulz, S.E. | Conference Paper |
| 2010 | Inhibition of enhanced Cu oxidation on ruthenium
Ding, S.-F.; Xie, Q.; Waechtler, T.; Lu, H.-S.; Schulz, S.E.; Qu, X.-P. | Conference Paper |
| 2010 | Integration von Kohlenstoffnanoröhren für MEMS/NEMS Anwendungen
Hermann, S.; Loschek, S.; Haibo, Y.; Bonitz, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2010 | Investigation of physical and chemical property changes of ultra low-kappa SiOCH in aspect of cleaning and chemical repair processes
Oszinda, T.; Schaller, M.; Fischer, D.; Walsh, C.; Schulz, S.E. | Conference Paper, Journal Article |
| 2010 | Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2010 | Mikro- und Nanotechnologien für Smart Integrated Systems
Gessner, T.; Vogel, M.; Schulz, S.E.; Wiemer, M.; Hiller, K.; Kurth, S. | Journal Article |
| 2010 | Neue Materialien und Technologien für Nanoelektronik und Sensorik
Schulz, S.E.; Gessner, T. | Journal Article |
| 2010 | Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E. | Conference Paper |
| 2010 | Phosphane copper(I) dicarboxylates: Synthesis and their potential use as precursors for the spin-coating process in the deposition of copper
Jakob, A.; Rüffer, T.; Ecorchard, P.; Walfort, B.; Körbitz, K.; Frühauf, J.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2010 | Phosphite copper(I) trifluoroacetates [((RO)(3)P)(m)CuO2CCF3] (m=1, 2, 3): synthesis, solid state structures and their potential use as CVD precursors
Mothes, R.; Rüffer, T.; Shen, Y.Z.; Jakob, A.; Walfort, B.; Petzold, H.; Schulz, S.E.; Ecke, R.; Gessner, T.; Lang, H. | Journal Article |
| 2010 | Pulse reverse electroplating for TSV filling in 3D integration
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2009 | Characterization of plasma damaged porous ULK SiCOH layers in aspect of changes in the diffusion behavior of solvents and repair-chemicals
Oszinda, T.; Schaller, M.; Fischer, D.; Schulz, S.E. | Conference Paper |
| 2009 | Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications
Hermann, S.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2009 | Copper oxide ALD from a Cu(I) beta-diketonate: Detailed growth studies on SiO2 and TaN
Wächtler, T.; Roth, N.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Conference Paper |
| 2009 | Copper oxide ALD from a Cu(I) beta-diketonate: Growth studies and application as seed layers for electrochemical copper deposition
Waechtler, T.; Hofmann, L.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Abstract |
| 2009 | Copper oxide films grown by atomic layer deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2
Waechtler, T.; Oswald, S.; Roth, N.; Jakob, A.; Lang, H.; Ecke, R.; Schulz, S.E.; Gessner, T.; Moskvinova, A.; Schulze, S.; Hietschold, M. | Journal Article |
| 2009 | Detailed study of copper oxide ALD on SiO2, TaN, and Ru
Wächtler, T.; Schulze, S.; Hofmann, L.; Hermann, S.; Roth, N.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Poster |
| 2009 | Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration
Hofmann, L.; Braeuer, J.; Baum, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2009 | Improved characterization of Fourier transform infrared spectra analysis for post-etched ultra-low-kappa SiOCH dielectric using chemometric methods
Oszinda, T.; Beyer, V.; Schaller, M.; Fischer, D.; Bartsch, C.; Schulz, S.E. | Conference Paper, Journal Article |
| 2009 | Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Zimmermann, H.; Rülke, H.; Lang, N.; Röpcke, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2009 | Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2009 | Process development for smart systems integration in MEMS
Ecke, R.; Frömel, J.; Schulz, S.E.; Wiemer, M.; Gessner, T. | Journal Article |
| 2009 | Restoration of plasma damaged porous ultra low-k SiOCH films: A coating process with UV activation versus a vapor phase process with thermal activation
Oszinda, T.; Schaller, M.; Leppack, S.; Schulz, S.E. | Conference Paper |
| 2009 | Selective deposition of aligned carbon nanotubes for NEMS applications
Bonitz, J.; Hermann, S.; Loschek, S.; Liu, P.; Schulz, S.E. | Conference Paper |
| 2009 | Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions
Ahner, N.; Schaller, M.; Bartsch, C.; Baryschpolec, E.; Schulz, S.E. | Conference Paper |
| 2009 | Surfactants as an additive to wet cleaning solutions for plasma etch residue removal: Compatibility to a porous CVD-SiCOH ultra low-k dielectric material
Ahner, N.; Schulz, S.E.; Zacher, M. | Conference Paper |
| 2009 | Vom Open Government zur digitalen Agora
Graudenz, D.; Krug, B.; Hoffmann, C.; Schulz, S.E.; Warnecke, T.; Klessmann, J. | Report |
| 2008 | Airgap structures by using sacrificial wet etch: Fabrication, thermal and mechanical behaviour, reliability
Schulze, K.; Schulz, S.E.; Koerner, H.; Gessner, T. | Conference Paper |
| 2008 | ALD of Copper and Copper Oxide Thin Films for Applications in Metallization Systems of ULSI Devices
Waechtler, T.; Oswald, S.; Roth, N.; Lang, H.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2008 | Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers
Wächtler, T.; Oswald, S.; Pohlers, A.; Schulze, S.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2008 | Copper(I) Carboxylates of Type [(nBu3P)mCuO2CR] (m = 1, 2, 3) - Synthesis, Properties, and their Use as CVD Precursors
Jakob, A.; Shen, Y.; Wächtler, T.; Schulz, S.E.; Gessner, T.; Riedel, R.; Fasel, C.; Lang, H. | Journal Article |
| 2008 | Copper oxide and copper thin films grown by ALD for seed layer applications
Wächtler, T.; Schulz, S.E. | Conference Paper |
| 2008 | Evaluation of airgap structures produced by wet etch of sacrificial dielectrics: Impact of wet etch media on diffusion barriers, copper, and the Cu/SiC:H interface
Schulze, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2008 | Investigation of etch processes of dense and porous low-k dielectrics using OES and QMS as in situ diagnostic methods
Zimmermann, S.; Blaschta, F.; Schaller, M.; Rülke, H.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2008 | Metallization by chemical vapor deposition of W and Cu
Klumpp, A.; Wieland, R.; Ecke, R.; Schulz, S.E. | Book Article |
| 2008 | New precursors for CVD copper metallization
Norman, J.A.T.; Perez, M.; Schulz, S.E.; Wächtler, T. | Conference Paper, Journal Article |
| 2008 | Optical, electrical and structural properties of spin-on MSQ low-k dielectrics over a wide temperature range
Ahner, N.; Schulz, S.E.; Blaschta, F.; Rennau, M. | Conference Paper, Journal Article |
| 2008 | Study of nano-mechanical properties for thin porous films through instrumented indentation: SiO2 low dielectric constant films as an example
Herrmann, M.; Richter, F.; Schulz, S.E. | Conference Paper, Journal Article |
| 2007 | 3D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology
Wieland, R.; Ecke, R.; Klumpp, A.; Merkel, R.; Schulz, S.E.; Ramm, P. | Conference Paper |
| 2007 | Achieving ultra low k dielectric constant for nanoelectronics interconnect systems
Schulz, S.E.; Schulze, K. | Conference Paper |
| 2007 | Atomic layer deposition of copper and copper oxide for applications in microelectronic metallization systems
Waechtler, T.; Schulz, S.E.; Oswald, S.; Gessner, T. | Journal Article, Conference Paper |
| 2007 | Characterization of sputtered Ta and TaN films by spectroscopic ellipsometry
Waechtler, T.; Gruska, B.; Zimmermann, S.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2007 | CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices
Gottfried, K.; Schubert, I.; Schulze, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2007 | Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation
Schulze, K.; Schulz, S.E.; Gessner, T. | Conference Paper, Journal Article |
| 2007 | Impact of dielectric material and metal arrangement on thermal behaviour of interconnect systems
Schulze, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2007 | Influence of barrier crystallization on CV characteristics of MIS structures
Ecke, R.; Rennau, M.; Zimmermann, S.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2007 | Novel Copper(I) and Silver(I) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver
Frühauf, S.; Gessner, T.; Haase, T.; Jakob, A.; Kohse-Hoeinghaus, K.; Lang, H.; Schulz, S.E.; Wächtler, T. | Conference Paper |
| 2007 | Phosphane copper(I) complexes as CVD precursors
Roth, N.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article, Conference Paper |
| 2007 | Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics
Ahner, N.; Schulz, S.E.; Blaschta, F.; Rennau, M. | Conference Paper, Journal Article |
| 2007 | Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure
Iacopi, F.; Beyer, G.; Travaly, Y.; Waldfried, C.; Gage, D.M.; Dauskardt, R.H.; Houthoofd, K.; Jacobs, P.; Adriaensens, P.; Schulze, K.; Schulz, S.E.; List, S.; Carlotti, G. | Journal Article |
| 2006 | Cu/barrier CMP on porous low-k based interconnect schemes
Gottfried, K.; Schubert, I.; Schulz, S.E.; Gessner, T. | Conference Paper, Journal Article |
| 2005 | The current limits of the laser-acoustic test method to characterize low-k films
Schneider, D.; Frühauf, S.; Schulz, S.E.; Gessner, T. | Conference Paper, Journal Article |
| 2005 | Material development for integrated optics, microelectronics and display technology - selected examples
Dreyer, C.; Schneider, J.; Keil, N.; Zawadzki, C.; Yao, H.H.; Schuldt, U.; Schulze, K.; Kahle, O.; Schulz, S.E.; Uhlig, M.; Uhlig, C.; Boeffel, C.; Gessner, T.; Bauer, M. | Conference Paper |
| 2005 | Novel low-k polycyanurates for integrated circuit (IC) metallization
Schulze, K.; Schuldt, U.; Kahle, O.; Schulz, S.E.; Uhlig, M.; Uhlig, C.; Dreyer, C.; Bauer, M.; Gessner, T. | Conference Paper, Journal Article |
| 2005 | Scaling down thickness of ULK materials for 65 nm node and below and its effect on electrical performance
Frühauf, S.; Himcinschi, C.; Rennau, M.; Schulze, K.; Schulz, S.E.; Friedrich, M.; Gessner, T.; Zahn, D.R.T.; Le, Q.T.; Caluwaerts, R. | Conference Paper, Journal Article |
| 2004 | Contributions to the static dielectric constant of low-k xerogel films derived from ellipsometry and IR spectroscopy
Himcinschi, C.; Friedrich, M.; Frühauf, S.; Schulz, S.E.; Gessner, T.; Zahn, D.R.T. | Conference Paper, Journal Article |
| 2004 | Improvement of mechanical integrity of ultra low k dielectric stack and CMP compatibility
Schulze, K.; Schulz, S.E.; Frühauf, S.; Körner, H.; Seidel, U.; Schneider, D.; Gessner, T. | Conference Paper, Journal Article |
| 2003 | CVD TiN layers as diffusion barrier films on porous SiO2 aerogel
Bonitz, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2003 | Deposition and treatment of titanium based barrier layers by MOCVD
Ecke, R.; Schulz, S.E.; Gessner, T.; Riedel, S.; Lipp, E.; Eizenberg, M. | Conference Paper |
| 2003 | Influence of SiH4 on the WN4-PECVD process
Ecke, R.; Schulz, S.E.; Hecker, M.; Mattern, N.; Gessner, T. | Conference Paper |
| 2003 | Thermal conductivity of ultra low-k dielectrics
Delan, A.; Rennau, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2002 | Copper alloy formation and film properties after annealing of Al/Cu stacks in different ambients
Chen, Z.; Richter, K.; Riedel, S.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2002 | InterChip via technology by using copper for vertical system integration
Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T. | Conference Paper |
| 2001 | Charakterisierung von CVD-WNx-Schichten als Barriere gegen Kupferdiffusion
Ecke, R.; Richter, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2001 | Copper metallization scheme for vertical chip integration
Riedel, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Wieland, R.; Leutenecker, R.; Klumpp, A.; Ramm, P. | Conference Paper |
| 2001 | Influence of barrier and cap layer deposition on the properties of capped and non-capped porous silicon oxide
Schulz, S.E.; Koerner, H.; Murray, C.; Streiter, I.; Gessner, T. | Journal Article |
| 2001 | Influence of different treatment techniques on the barrier properties of MOCVD TiN against copper diffusion
Riedel, S.; Schulz, S.E.; Baumann, J.; Rennau, M.; Gessner, T. | Conference Paper, Journal Article |
| 2001 | Nanoporous dielectric materials for advanced CMOS
Gessner, T.; Bohuslavova, A.; Schulz, S.E. | Conference Paper |
| 2001 | Neue Dünnschichtmaterialien für die fortgeschrittene Mikroelektronik
Gessner, T.; Schulz, S.E. | Abstract |
| 2000 | Investigation of the plasma treatment in a multistep TiN MOCVD process
Riedel, S.; Schulz, S.E.; Gessner, T. | Journal Article |
| 1998 | Morphology and electromigration lifetime of copper lines with different barriers
Schulz, S.E.; Baumann, J.; Weidner, J.-O.; Hasse, W.; Koerner, H.; Gessner, T. | Conference Paper |