Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system
Adamietz, Raphael; Desmulliez, Marc P.Y.; Pavuluri, Sumanth Kumar; Tilford, Tim; Bailey, Chris; Schreier-Alt, Thomas; Warmuth, Jens
Journal Article
2017Prediction and compensation of reference voltage shift in IC sensors due to mechanical stress
Warmuth, Jens; Schreier-Alt, Thomas
Conference Paper
2015 Hochstromkontakte für Smart-Power Mechanics
Ansorge, F.; Ratke, H.; Schreier-Alt, T.; Baar, C.; Ifland, D.; Lang, K.-D.
Journal Article
2015Design, setup and test of a heterogeneous module and characterization by stress measurement
Schreier-Alt, T.; Reitlinger, C.; Kaul, F.; Metzger, T.; Revenberg, K.
Conference Paper
2015Smart Power Mechanics – Elektrische Anschlusstechnologien für Morgen
Schreier-Alt, T.; Ansorge, F.; Baar, C.; Radtke, H.; Amende, T.
Conference Paper
2014Prozessoptimierung und Produktprüfung von QFN-Bauteilen mit dem iForce-Stressmesschip
Schreier-Alt, T.; Ansorge, F.; Chmiel, G.; Lang, K.-D.
Conference Paper
2014Raffungsmodelle für die Qualifikation von Einpresskontakten für Leiterplatten
Schreier-Alt, T.; Heimerle, D.; Ring, K.; Möhler, A.; Baar, C.; Ansorge, F.
Journal Article
2013Piezoresistive stress sensor for inline monitoring during assembly and packaging of QFN
Schreier-Alt, T.; Chmiel, G.; Ansorge, F.; Lang, K.-D.
Conference Paper
2013Stressmessung auf Chip-Ebene - Ein Fahrtenschreiber für die Elektronikverarbeitung
Schreier-Alt, T.; Fraunhofer, F.A.
Journal Article
2013Transfer molding compounds for power electronic applications - a qualification methodology for HT capable materials
Braun, Tanja; Becker, K.-F.; Koch, M.; Thomas, T.; Amende, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2012Transfer molding technology for smart power electronics modules - materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D.
Conference Paper
2012Transfer molding technology for smart power electronics modules: Materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Thomas, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Bochow-Ness, O.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2011Measurement of pressure distribution during MEMS and Flip Chip encapsulation
Schreier-Alt, T.; Stark, J.M.
Journal Article
2011Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds
Schreier-Alt, T.; Rehme, F.; Ansorge, F.; Reichl, H.
Journal Article
2011Stress analysis during assembly and packaging
Schreier-Alt, T.; Unterhofer, K.; Ansorge, F.; Lang, K.-D.
Conference Paper
2010Measurement of pressure distribution during encapsulation of flip chips
Schreier-Alt, T.; Stark, J.G.
Journal Article
2009Flip chips on PCB - from single chip encapsulation to systems in package
Schreier-Alt, T.; Braun, T.; Becker, K.-F.; Rebholz, C.; Wunderle, B.; Reichl, H.
Journal Article
2009Licht ins Dunkel der Elektronikverkapselung
Schreier-Alt, T.; Ansorge, F.
Journal Article
2009Reliability of press fit contacts and adjoining SMD components on printed circuit boards
Ring, K.; Schreier-Alt, T.
Conference Paper
2009Simulation and experimental analysis of substrate overmolding
Schreier-Alt, T.; Ansorge, F.; Rebholz, C.
Conference Paper
2009Stress measurement on chip level optimizes packaging and assembly of microsystems
Schreier-Alt, T.; Schindler-Saefkow, F.; Niehoff, K.; Ansorge, F.; Kittel, H.
Journal Article
2009Thermo-mechanical stress analysis
Niehoff, K.; Schreier-Alt, T.; Schindler-Saefkow, F.; Ansorge, F.; Kittel, H.
Conference Paper
2009Throwing light on electronics encapsulation
Schreier-Alt, T.; Anscirse, F.
Journal Article
2008Encapsulation of systems in package - process characterization and optimization
Schreier-Alt, T.; Schindler-Saefkow, F.; Wittler, O.; Kittel, H.
Conference Paper
2008Flaechiges Hochtemperatur-Drucksensorarray und Druckmessverfahren zur Bestimmung von Druckverteilungen sowie Verwendung derselben
Schreier-Alt, T.; Rehme, F.; Leidl, A.
Patent
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B.
Conference Paper
2007Fiber optic strain and structural health monitoring in polymer electronic packaging
Schreier-Alt, T.; Ansorge, F.; Reichl, H.
Conference Paper
2007Packaging design and testing for high temperature applications > 150 °C
Schreier-Alt, T.; Rebholz, C.; Ansorge, F.
Conference Paper
2007Polymerverkapselung mechatronischer Systeme
Schreier-Alt, T.
Dissertation
2007Stress monitoring in epoxy resins and embedded components during packaging and curing processes
Schreier-Alt, T.; Badstuebner, K.; Rebholz, C.; Reichl, H.; Ansorge, F.
Conference Paper
2005FEA of electronic encapsulation with moldflow
Schreier-Alt, T.
Conference Paper
2005Measurement and simulation of packaging induced stress on sensors
Schreier-Alt, T.
Conference Paper
2005Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes
Schreier-Alt, T.; Sehnert, J.; Rebholz, C.; Michel, B.; Ansorge, F.
Conference Paper