Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Nachbildung des menschlichen Knochens mit Metall - das Testmaterial der Zukunft?
Hannemann, Christian; Uhlig, Mandy; Hohlfeld, Jörg; Oefner, Christoph; Schoenfelder, Stephan; Heyde, Christoph-E.
Conference Paper
2018Analysis of structured wire wafering processes to predict optimized process settings by varying particle size and wire diameter
Koepge, R.; Buehler, K.; Kaule, F.; Zeh, J.; Schoenfelder, S.; Anspach, O.
Conference Paper
2018Improved mechanical strength and reflectance of diamond wire sawn multi-crystalline silicon wafers by inductively coupled plasma (ICP) etching
Kaule, F.; Köhler, B.; Hirsch, J.; Schoenfelder, S.; Lausch, D.
Journal Article
2018Laser-assisted spalling of large-area semiconductor and solid state substrates
Kaule, F.; Swoboda, M.; Beyer, C.; Rieske, R.; Ajaj, A.; Drescher, W.D.; Schoenfelder, S.; Richter, J.
Journal Article
2018Mechanical damage of half-cell cutting technologies in solar cells and module laminates
Kaule, F.; Pander, M.; Turek, M.; Grimm, M.; Hofmüller, E.; Schönfelder, S.
Conference Paper
2018Verfahren und Anordnung zur Überwachung des Ritzprozesses beim Ritzen von Bauteilen mit einem Ritzwerkzeug
Ackermann, Thomas; Hagendorf, Christian; Kaufmann, Kai; Meier, Rico; Schönfelder, Stephan
Patent
2016Incoming control of silicon wafers - detection and rating of micro-cracks
Demant, M.; Welschehold, T.; Oswald, M.; Bartsch, S.; Schönfelder, S.; Rein, S.
Presentation
2016Microcracks in silicon wafers I: Inline detection and implications of crack morphology on wafer strength
Demant, M.; Welschehold, T.; Oswald, M.; Bartsch, S.; Brox, T.; Schoenfelder, S.; Rein, S.
Journal Article
2016Verfahren zum Teilen von plattenförmigen Objekten aus spröden Werkstoffen
Schneider, Jens; Schönfelder, Stephan; Kaufmann, Kai
Patent
2015High quality half-cell processing using thermal laser separation
Eiternick, S.; Kaule, F.; Zühlke, H.U.; Kießling, T.; Grimm, M.; Schoenfelder, S.; Turek, M.
Journal Article, Conference Paper
2014Breakage Root Cause Analysis in as-Cut Monocrystalline Silicon Wafers
Klute, C.; Kaule, F.; Schoenfelder, S.
Conference Paper
2014Loss of wire tension in the wire web during the slurry based multi wire sawing process
Meißner, D.; Schoenfelder, S.; Hurka, B.; Zeh, J.; Sunder, K.; Koepge, R.; Wagner, T.; Grün, A.; Hagel, H.-J.; Moeller, H.J.; Schwabe, H.; Anspach, O.
Journal Article
2014Micro-cracks in silicon wafers and solar cells: Detection and rating of mechanical strength and electrical quality
Demant, M.; Oswald, M.; Welschehold, T.; Nold, S.; Bartsch, S.; Schoenfelder, S.; Rein, S.
Conference Paper
2014Modeling and testing the mechanical strength of solar cells
Kaule, F.; Wang, W.; Schoenfelder, S.
Journal Article
2014Solar Module with Half Size Solar Cells
Schneider, J.; Schoenfelder, S.; Dietrich, S.; Turek, M.
Conference Paper
2013Characterization of damage and mechanical strength of wafers and cells during the cell manufacturing process
Koepge, R.; Wegert, F.; Thormann, S.; Schoenfelder, S.
Journal Article
2013Kerfless wafering for silicon wafers by using a reusable metal layer
Schoenfelder, S.; Breitenstein, O.; Rissland, S.; Donno, R. de; Bagdahn, J.
Journal Article, Conference Paper
2012Damage and breakage of silicon wafers during impact loading on the wafer edge
Kaule, F.; Koepge, R.; Schönfelder, S.
Conference Paper
2012Effect of metal-wrap-through holes and etching parameters on the strength of multicrystalline silicon wafers
Oswald, M.; Loewenstein, T.; Schubert, G.; Schoenfelder, S.
Conference Paper
2012Loss of wire tension in the wire web: Towards stable cutting conditions for all wafers
Meißner, D.; Hurka, B.; Zeh, J.; Sunder, K.; Koepge, R.; Wagner, T.; Moeller, H.-J.; Schoenfelder, S.; Anspach, O.
Conference Paper
2012Strength of thin silicon wafers with via holes
Schoenfelder, S.; Kaule, F.; Oswald, M.; Bagdahn, J.; Petzold, M.
Conference Paper
2012Thermal laser separation - damage-free and Kerfless cutting of wafers and solar cells
Koitzsch, Matthias; Lewke, Dirk; Kaule, Felix; Oswald, Marcus; Schoenfelder, Stephan; Turek, Marko; Büchel, Andreas; Zühlke, Hans-Ulrich
Conference Paper
2011Detection and analysis of micro-cracks in multi-crystalline silicon wafers during solar cell production
Demant, M.; Rein, S.; Krisch, J.; Schoenfelder, S.; Fischer, C.; Bartsch, S.; Preu, R.
Conference Paper
2011The influence of transport operations on the wafer strength and breakage rate
Köpge, Ringo; Schönfelder, Stephan; Giesen, Tim; Fischmann, Christian; Verl, Alexander; Bagdahn, Jörg
Conference Paper
2011Mechanical characterisation and modelling of thin chips
Schoenfelder, S.; Bagdahn, J.; Petzold, M.
Book Article
2011Mechanical properties of fluorozirconate-based glass ceramics for medical and photovoltaic applications
Ahrens, B.; Brand, S.; Büchner, T.; Darr, P.; Schoenfelder, S.; Paßlick, C.; Schweizer, S.
Journal Article
2010Infrared birefringence imaging of residual stress and bulk defects in multicrystalline silicon
Ganapati, V.; Schoenfelder, S.; Castellanos, S.; Oener, S.; Koepge, R.; Sampson, A.; Marcus, M.A.; Lai, B.; Morhenn, H.; Hahn, G.; Bagdahn, J.; Buonassisi, T.
Journal Article
2010Infrared birefringence imaging of residual stress and bulk defects in multicrystalline silicon
Ganapati, V.; Schoenfelder, S.; Castellanos, S.; Oener, S.; Buonassisi, T.
Conference Paper
2010Investigations of laser and design parameters of via holes on mechanical strength of metal wrap through solar cells
Schoenfelder, S.; Oswald, M.; Fischer, C.; Zühlke, H.-U.; Berbig, C.; Geppert, T.; Wütherich, T.; Krokoszinski, H.-J.; Bagdahn, J.
Conference Paper
2010Stresses and their relation to defects in multicrystalline solar silicon
Sarau, G.; Bochmann, A.; Christiansen, S.; Schönfelder, S.
Conference Paper
2008Assessment of a lasersingulation process for Si-wafers with metallized back side and small die size
Theuss, H.; Koller, A.; Kröninger, W.; Schoenfelder, S.; Petzold, M.
Conference Paper
2008Mechanical strength of mono- and multicrystalline wafers
Schönfelder, S.; Bohne, A.; Bagdahn, J.
Conference Paper
2008Verfahren zur mechanischen Charakterisierung von Produktionsmaschinen fuer sproedbrechende Materialien
Kray, D.; Bagdahn, J.; Schoenfelder, S.
Patent
2007Comparison of test methods for strength characterization of thin solar wafer
Schönfelder, S.; Bohne, A.; Bagdahn, J.
Conference Paper
2007Investigations of the influence of dicing techniques on the strength properties of thin silicon
Schönfelder, S.; Ebert, M.; Landesberger, C.; Bock, K.; Bagdahn, J.
Journal Article
2006Influence of the thickness of silicon dies on strength
Schönfelder, S.; Ebert, M.; Bagdahn, J.
Conference Paper
2006Strength characterization of laser diced silicon for application in solar industry
Schönfelder, S.; Bagdahn, J.; Baumann, S.; Kray, D.; Mayer, K.; Willeke, G.; Becker, M.; Christiansen, S.
Conference Paper
2005Investigations of strength properties of ultra-thin silicon
Schönfelder, S.; Bagdahn, J.; Ebert, M.; Petzold, M.; Bock, K.; Landesberger, C.
Conference Paper