Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Bondfolie, elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
Hempel, Martin; Höfer, Jan; Schneider-Ramelow, Martin
Patent
2019Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik
Wöhrmann, Markus; Toepper, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2019Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications
Bickel, Jan; Eberl, Maria; Kaletta, Katrin; Ngo, Ha-Duong; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2019Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine
Schiffer, Michael; Mackowiak, Piotr; Ngo, Ha-Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Book Article
2019Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Device
Hu, Xiaodong; Schiffer, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Journal Article
2018Electrical micro-heating structures on glass created by laser ablation
Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin
Conference Paper
2018A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) for Wireless Urine Detection in Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens
Journal Article, Conference Paper
2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Book Article
2018Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Journal Article, Conference Paper
2017Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Conference Paper
2017The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
2016Aluminum-Scandium: A Material for Semiconductor Packaging
Geißler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter
Journal Article
2016The reliability of wire bonding using Ag and Al
Schneider-Ramelow, Martin; Ehrhardt, Christian
Journal Article
2016Visuelle und mechanische Prüfung von Drahtbondverbindungen
Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D.
Journal Article
2015Microelectronic Packaging in the 21st Century
: Aschenbrenner, Rolf; Schneider-Ramelow, Martin
Book
2013Development and status of Cu ball/wedge bonding in 2012
Schneider-Ramelow, Martin; Geißler, U.; Schmitz, S.; Grübl, W.; Schuch, B.
Journal Article
2013Leistungselektronik und elektrische Antriebstechnik
März, Martin; Eilers, Dirk; Gillner, Arnold; Schliwinski, Hans-Jürgen; Schneider-Ramelow, Martin; Schubert, Thomas; Partsch, Uwe; Paschen, Uwe; Wilken, Ralph
Book Article
2012Alternative Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess
Geißler, Ute; Milke, Eugen; Prenosil, Peter; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2012Aufbau- und Verbindungstechniken in der Leistungselektronik
Schneider-Ramelow, Martin; Becker, Karl-Friedrich; Ehrhardt, Christian; Göhre, Jens-Martin; Hoene, Eckart; Hutter, Matthias; Lang, Klaus-Dieter; Oppermann, Hermann
Conference Paper
2012Development of a multi-terminal crimp package for smart textile integration
Simon, Erik; Kallmeyer, Christine; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2012FE-thermo mechanische Analyse zur Beschreibung der Ausbildung der intermetallischen Phase beim Drahtbonden
Sbeiti, Mohamad; Müller, Wolfgang H.; Geißler, Ute; Schneider-Ramelow, Martin; Schmitz, Stefan
Journal Article
2012Influence of bonding parameters on the reliability of heavy wire bonds on power semiconductors
Göhre, Jens; Geißler, Ute; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2012Technologies and Trends to Improve Power Electronic Packaging
Schneider-Ramelow, Martin; Hutter, Matthias; Oppermann, Hermann; Göhre, Jens-Martin; Schmitz, Stefan; Hoene, Eckart; Lang, Klaus-Dieter
Conference Paper
2011Cu-Ball/Wedge Bonden: Entwicklung und Status 2011. Tl.2
Schneider-Ramelow, Martin; Geißler, Ute, Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard
Journal Article
2011Cu-Ball/Wedge-Bonden: Entwicklung und Status 2011. Tl.1
Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard
Journal Article
2011Cu-Ball/Wedge-bonden: Entwicklung und Status 2011. Tl.3
Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard
Journal Article
2011Entwicklungsrichtungen für das Leistungshalbleiter Packaging
Hoene, Eckart; Schneider-Ramelow, Martin; Feix, Gudrun; Ostmann, Andreas; Becker, Karl-Friedrich; Hutter, Matthias
Journal Article
2011Fortschritte beim Aufbau von Leistungshalbleitern
Hutter, Matthias; Göhre, Jens-Martin; Hoene, Eckart; Schneider-Ramelow, Martin; Oppermann, Hermann
Journal Article
2011Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper