Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Conference Paper
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Conference Paper
2016Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, J.; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.
Conference Paper
2016Master curve synthesis by effective viscoelastic plastic material modeling
Schindler-Saefkow, F.; Pantou, R.; Schlottig, G.; Kumar, S.; Brunschwiler, T.; Keller, J.; Wunderle, B.; Rzepka, S.
Conference Paper
2016Re-building the underfill: Performance of percolating fillers at package scale
Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow,F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B.
Conference Paper
2016Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R.
Conference Paper
2015Advances in percolated thermal underfill (PTU) simulations for 3D-integration
Kumar, S.G.; Zschenderlein, U.; Pantou, R.; Brunschwiler, T.; Schlottig, G.; Schindler-Saefkow, F.; Wunderle, B.
Conference Paper
2015Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Zürcher, J.; Yu, K.; Schlottig, G.; Baum, M.; Taklo, M.M.V.; Wunderle, B.; Warszyński, P.; Brunschwiler, T.
Conference Paper
2011Establishing the critical fracture properties of the die backside-to-molding compound interface
Schlottig, G.; Pape, H.; Wunderle, B.; Ernst, L.J.
Conference Paper
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design
Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd
Journal Article, Conference Paper
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design An effcient and comprehensive method for critical mixed-mode data extraction
Wunderle, B.; Schulz, M.; Keller, J.; Schlottig, G.; Maus, I.; May, D.; Hölck, O.; Pape, H.; Michel, B.
Conference Paper
2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Conference Paper
2010Delamination and combined compound cracking of EMC-copper interfaces
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Conference Paper
2010Interface fracture mechanics evaluation by correlation of experiment and simulation
Keller, J.; Maus, I.; Schlottig, G.; Pape, H.; Wunderle, B.; Michel, B.
Conference Paper
2010Interfacial fracture parameters of silicon-to-molding compound
Schlottig, G.; Maus, I.; Walter, H.; Jansen, K.M.B.; Pape, H.; Wunderle, B.; Ernst, L.J.
Conference Paper
2010Interfacial strength of silicon-to-molding compound changes with thermal residual stress
Schlottig, G.; Xiao, A.; Pape, H.; Wunderle, B.; Ernst, L.J.
Conference Paper
2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
Xiao, A.; Pape, H.; Schlottig, G.; Wunderle; Leung, Y.Y.; Jansen, K.B.; Ernst, L.J.
Conference Paper
2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughness
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Conference Paper
2009Establishing fracture properties of EMC-copper (-oxide) interfaces: Test procedures and simulations for establishing the interface toughness, depending on temperature, humidity and mode mixity
Ernst, L.J.; Xiao, A.; Vreugd, J. de; Jansen, K.M.B.; Pape, H.; Schlottig, G.; Wunderle, B.
Conference Paper
2009Establishing mixed mode fracture properties of EMC-Copper (-oxide) interfaces at various temperatures
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Sluis, O. van der; Jansen, K.M.B.; Ernst, L.J.
Conference Paper
2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurements
Schlottig, G.; Pape, H.; Xiao, A.; Wunderle, B.; Ernst, L.
Conference Paper
2009Induced delamination of silicon-molding compound interfaces
Schlottig, G.; Pape, H.; Wunderle, B.; Ernst, L.J.
Conference Paper
2008Mixed mode interface characterization considering thermal residual stress
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Conference Paper
2007Modeling LTCC-based microchannels using a network approach
Schlottig, G.; Rebenklau, L.; Uhlemann, J.; Nytsch-Geusen, C.; Wolter, K.-J.
Conference Paper