Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019State of the Art Packaging
Schletz, Andreas; Endruschat, Achim; Heckel, Thomas
Presentation
2019Temperature Challenges for Integrated Systems due to High Power Density
Schletz, Andreas; Bayer, Christoph; Hutzler, Aaron
Presentation
2019Testing Wide Band-Gap Devices II (Focus on Packaging)
Schletz, Andreas
Presentation
2018Aufbau für mindestens einen mit elektronischen und/oder elektrischen Bauelementen bestückten Träger
Bayer, Christoph; Schletz, Andreas; Waltrich, Uwe
Patent
2018Electrochemical corrosion on ceramic substrates for power electronics causes, phenomenological description and outlook
Bayer, Christoph Friedrich; Diepgen, Antonia; Filippi, Thomas; Fuchs, Carmen; Wüstefeld, Sophie; Kellner, Simon; Waltrich, Uwe; Schletz, Andreas
Conference Paper
2018Heterogeneous integration of vertical GaN power transistor on Si capacitor for DC-DC converters
Yu, Zechun; Zeltner, Stefan; Boettcher, Norman; Rattmann, Gudrun; Leib, Jürgen; Bayer, Christoph Friedrich; Schletz, Andreas; Erlbacher, Tobias; Frey, Lothar
Presentation
2018Lifetime testing method for ceramic capacitors for power electronics applications
Dresel, Fabian; Tham, Nils; Erlbacher, Tobias; Schletz, Andreas
Conference Paper
2018Modeling the rate-dependent inelastic deformation of porous polycrystalline silver films
Letz, Sebastian; Farooghian, Azin; Simon, Flaviu-Bogdan; Schletz, Andreas
Presentation
2018Power Interconnect Trends - Cost Savings for PCB Power Electronics by Enabling Wear Out
Schletz, Andreas
Presentation
2018Selective silver sintering of semiconductor dies on PCB
Dresel, Fabian; Letz, Sebastian; Zischler, Sigrid; Schletz, Andreas; Novak, Michael
Conference Paper
2018Vias in DBC substrates for embedded power modules
Bach, Hoang Linh; Yu, Zechun; Letz, Sebastian; Bayer, Christoph Friedrich; Waltrich, Uwe; Schletz, Andreas; März, Martin
Conference Paper
2017Kühlelement für mindestens einen mit elektronischen und/oder elektrischen Bauelementen bestückten Träger
Schletz, Andreas; Schimanek, Ernst
Patent
2017Verfahren zu Ausbildung elektrisch leitender Durchkontaktierungen in keramischen Schaltungsträgern
Schletz, Andreas; Tham, Nils; Hutzler, Aaron
Patent
2016Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation
Bayer, Christoph Friedrich; Waltrich, Uwe; Soueidan, Amal; Schneider, Richard; Bär, Eberhard; Schletz, Andreas
Conference Paper
2016Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength
Bayer, Christoph Friedrich; Waltrich, Uwe; Schneider, Richard; Soueidan, Amal; Bär, Eberhard; Schletz, Andreas
Conference Paper
2016Erweiterte Messsystemanalyse mittels statistischer Versuchsplanung. Anwendungsbeispiel anhand eines Lebensdauertests für Leistungselektronik
Hutzler, Aaron; Schletz, Andreas
Presentation
2016Mechanical properties of silver-sintering bond lines
Letz, Sebastian; Hutzler, Aaron; Schletz, Andreas; Waltrich, Uwe
Conference Paper
2016Partial discharges in ceramic substrates - correlation of electric field strength simulations with phase resolved partial discharge measurements
Bayer, Christoph Friedrich; Waltrich, Uwe; Soueidan, Amal; Baer, Eberhard; Schletz, Andreas
Conference Paper
2016Partial discharges in ceramic substrates - correlation of electric field strength simulations with phase resolved partial discharge measurements
Bayer, Christoph Friedrich; Waltrich, Uwe; Soueidan, Amal; Bär, Eberhard; Schletz, Andreas
Journal Article
2016Stacking of insulating substrates and a field plate to increase the PDIV for high voltage power modules
Bayer, Christoph Friedrich; Waltrich, Uwe; Soueidan, Amal; Baer, Eberhard; Schletz, Andreas
Conference Paper
2016Verfahren zum Herstellen eines Metall-Keramik-Substrates und zugehöriges Metall-Keramik-Substrat
Bayer, Christoph; Waltrich, Uwe; Schletz, Andreas; Bär, Eberhard; Meyer, Andreas
Patent
2015High temperature die-attach materials for aerospace power electronics: Lifetime tests and modeling
Hutzler, Aaron; Tokarski, Adam; Schletz, Andreas
Conference Paper
2015Simulation of the electric field strength in the vicinity of metallization edges on dielectric substrates
Bayer, Christoph; Bär, Eberhard; Waltrich, Uwe; Malipaard, Dirk; Schletz, Andreas
Journal Article
2015Thermische Impedanzmessungen zur Lebensdaueranalyse von Leistungselektronik
Hutzler, Aaron; Schletz, Andreas; Tokarski, Adam; Zeyss, Felix
Presentation
2014Hohe Lebensdauer durch hohe Temperatur
Hutzler, Aaron; Schletz, Andreas
Presentation
2014Increasing the lifetime of electronic packaging by higher temperatures: Solders vs. silver sintering
Hutzler, Aaron; Tokarski, Adam; Kraft, Silke; Zischler, Sigrid; Schletz, Andreas
Conference Paper
2014Increasing the lifetime of power modules by smaller bond wire diameters
Hutzler, Aaron; Wright, Alan; Schletz, Andreas
Presentation
2014Modellierung von Ermüdungsausfällen durch aktive Lastwechseltests
Hutzler, Aaron; Tokarski, Adam; Schletz, Andreas
Conference Paper
2014Modellierung von Ermüdungsausfällen durch aktive Lastwechseltests
Hutzler, Aaron; Tokarski, Adam; Schletz, Andreas
Book Article
2014Power cycling community 1995-2014 - an overview of test results over the last 20 years
Hutzler, Aaron; Zeyss, Felix; Vater, Stephan; Tokarski, Adam; Schletz, Andreas; März, Martin
Journal Article
2014Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules
Wright, Alan; Hutzler, Aaron; Schletz, Andreas; Pichler, Peter
Conference Paper
2013Extending the lifetime of power electronic assemblies by increased cooling temperatures
Hutzler, Aaron; Tokarski, Adam; Schletz, Andreas
Journal Article, Conference Paper
2013Extending the power cycling lifetime of SiC diodes (by increased cooling temperatures)
Hutzler, Aaron; Schletz, Andreas; Tokarski, Adam
Presentation
2013Statistical analysis of power cycling data
Hutzler, Aaron; Schletz, Andreas
Conference Paper
2012Aktive Temperaturwechsel - Test und Interpretation
Schletz, Andreas
Presentation
2012Messplatz für aktive Temperaturwechsel (Power Cycling Test) - Test und Interpretation
Schletz, Andreas
Presentation