Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2011Use of lock-in thermography for non-destructive 3D defect localization on system in package and stacked-die technology
Schlangen, R.; Motegi, S.; Nagatomo, T.; Schmidt, C.; Altmann, F.; Murakami, H.; Hollingshead, S.
Conference Paper
2010Dynamic lock-in thermography for operation mode-dependent thermally active fault localization
Schlangen, R.; Deslandes, H.; Lundquist, T.; Schmidt, C.; Altmann, F.; Yu, K.; Andreasyan, A.; Li, S.
Conference Paper, Journal Article
2010Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography
Schmidt, C.; Altmann, F.; Schlangen, R.; Deslandes, H.
Conference Paper