Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Effective viscoelastic plastic material modeling for faster and reliable calculations
Schindler-Saefkow, F.; Pantou, R.; Keller, J.; Rzepka, S.
Conference Paper
2016Master curve synthesis by effective viscoelastic plastic material modeling
Schindler-Saefkow, F.; Pantou, R.; Schlottig, G.; Kumar, S.; Brunschwiler, T.; Keller, J.; Wunderle, B.; Rzepka, S.
Conference Paper
2016Re-building the underfill: Performance of percolating fillers at package scale
Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow, F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B.
Conference Paper
2016Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R.
Conference Paper
2015Advances in percolated thermal underfill (PTU) simulations for 3D-integration
Kumar, S.G.; Zschenderlein, U.; Pantou, R.; Brunschwiler, T.; Schlottig, G.; Schindler-Saefkow, F.; Wunderle, B.
Conference Paper
2015Mechanical stress induced in Si sensors during bonding and packaging processes
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Vogel, D.; Michel, B.; Mehner, J.; Rzepka, S.
Conference Paper
2015Parameteridentifikation von Material und Prozessparametern im Package mit Hilfe des Stresschips
Schindler-Saefkow, F.; Rost, F.; Rzepka, S.
Conference Paper
2014Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips
Rezaie Adli, A.R.; Jansen, K.M.B.; Schindler-Saefkow, F.; Rost, F.
Conference Paper
2014Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Tsapkolenko, A.; Nossol, P.; Vogel, D.; Adli, A.R.; Jansen, K.; Rzepka, S.; Michel, B.
Conference Paper
2014Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
Schindler-Saefkow, F.; Rost, F.; Schingale, A.; Wolf, D.; Wunderle, B.; Keller, J.; Michel, B.; Rzepka, S.
Conference Paper
2014Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
Schindler-Saefkow, F.; Rost, F.; Rezaie-Adli, A.; Jansen, K.M.B.; Wunderle, B.; Keller, J.; Rzepka, S.; Michel, B.
Conference Paper
2014Modelling and testing of mechanical stresses by means of stress chips for the MERGE project
Rost, F.; Schindler-Saefkow, F.; Vogel, D.; Rzepka, S.; Michel, B.
Book Article
2014Stress chip measurements during temperature cycling test
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Michel, B.; Rzepka, S.
Book Article
2014Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J.
Journal Article, Conference Paper
2013DoE Simulation for a Micro Cantilever with a Piezo Resistivity Sensor
Schindler-Saefkow, F.; Wiora, N.
Journal Article
2013Package Characterization with Stress Chip Measurements for Health Monitoring
Rost, F.; Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Michel, B.
Conference Paper
2013Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J.
Conference Paper
2013Stress impact of thermal-mechanical loads measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Winkler, T.; Wunderle, B.; Michel, B.; Rzepka, S.
Conference Paper
2012Health Monitoring durch In-situ Messung der Eigenspannungen im Package
Rost, F.; Schindler-Saefkow, F.; Schulz, M.; Otto, A.; Rzepka, S.
Conference Paper
2012Hochgenaue Bestimmung mechanischer Spannungen in Elektronik- und MEMS-Komponenten durch ein Stressmesschip
Schindler-Saefkow, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S.
Conference Paper
2012Stress chip measurements of the internal package stress for process characterization and health monitoring
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S.
Conference Paper
2011DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Rzepka, S.; Wunderle, B.; Michel, B.
Conference Paper
2010Comparative study of residual stress measurement techniques with high spatial resolution
Vogel, D.; Maus, I.; Schindler-Saefkow, F.; Michel, B.
Conference Paper
2010DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B.
Conference Paper
2010Thermo mechanical behaviour of dies in multi material stacks
Hintz, M.; Dudek, R.; Koch, I.; Schindler-Saefkow, F.; Steinke, A.
Conference Paper
2009Stress measurement on chip level optimizes packaging and assembly of microsystems
Schreier-Alt, T.; Schindler-Saefkow, F.; Niehoff, K.; Ansorge, F.; Kittel, H.
Journal Article
2009Thermo-mechanical stress analysis
Niehoff, K.; Schreier-Alt, T.; Schindler-Saefkow, F.; Ansorge, F.; Kittel, H.
Conference Paper
2008Encapsulation of systems in package - process characterization and optimization
Schreier-Alt, T.; Schindler-Saefkow, F.; Wittler, O.; Kittel, H.
Conference Paper
2008Novel stress measurement system for evaluation of package induced stress
Kittel, H.; Endler, S.; Osterwinter, H.; Österle, S.; Schindler-Saefkow, F.
Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Kittel, H.; Michel, B.
Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B.
Conference Paper
2007Fully integrated one phase liquid cooling system for organic boards
May, D.; Wunderle, B.; Schindler-Saefkow, F.; Nguyen, B.; Schacht, R.; Michel, B.; Reichl, H.
Conference Paper
2007Thermal-Electric Simulation of Micropeltier Elements for Hot Spot Cooling
Schindler-Saefkow, F.; Jägle, M.; Wunderle, B.; Böttner, H.; Nurnus, J.
Conference Paper
20063D-PCB-Packages mit Wasserkühlung für High-Power-Anwendungen
Schindler-Saefkow, F.; Schramm, H.; Schacht, R.; Wunderle, B.; Michel, B.
Conference Paper
20063D-PCB-packaging technology for high power applications with water cooling
Schindler-Saefkow, F.; May, D.; Wunderle, B.; Schacht, R.; Michel, B.
Conference Paper
2006Thermal management in a 3D-PCB-package with water cooling
Schindler-Saefkow, F.; Wittler, O.; May, D.; Michel, B.
Conference Paper
20053D-PCB-Packaging Technology for Electric and Fluidic Applications
Schindler-Saefkow, F.; Schramm, H.; Amiri Jam, K.; Gaßmann, S.
Presentation
2005Hochintegrierte 3D-Packages in PCB Technologie
Schindler-Saefkow, F.; Schramm, H.; Amiri Jam, K.; Meier, P.
Journal Article
2005Thermal Management for 3D-Packages with Fluidical Cooling
Schindler-Saefkow, F.; Schramm, H.; Schacht, R.
Conference Paper
2004A 3D-package technology for fluidic applications based on match-X
Schindler-Saefkow, F.; Amiri Jam, K.; Großer, V.; Reichl, H.
Conference Paper
2004Modular 3D Packages in PCB Technology
Schindler-Saefkow, F.; Amiri Jam, K.; Hillmann, V.; Großer, V.
Book Article
2004Test und Integration von MEMS in fluidisch-elektrischen 3D-Packages aus FR4
Amiri Jam, K.; Schindler-Saefkow, F.; Großer, V.; Reichl, H.
Conference Paper
2003Fluidisch-Elektrisch-Thermisches 3D-Package mit Match-X Schnittstelle
Schindler-Saefkow, F.; May, D.; Großer, V.; Michel, B.
Conference Paper
2003Thermal management in stacks of MATCH-X MOEMS
Schindler-Saefkow, F.; Wittler, O.; May, D.; Schacht, R.; Großer, V.; Michel, B.
Conference Paper
2002A modular fluidic demonstrator for the Match-X framework
Schindler-Saefkow, F.; Amiri Jam, K.; Luczak, F.; Großer, V.; Michel, B.; Günther, G.
Conference Paper