Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019A coculture system composed of THP-1 cells and 3D reconstructed human epidermis to assess activation of dendritic cells by sensitizing chemicals after topical exposure
Schellenberger, Mario T.; Bock, Udo; Hennen, Jennifer; Groeber-Becker, Florian Kai; Walles, Heike; Blömeke, Brunhilde
Journal Article
2018Elektronik
Bauer, Anton; Bär, Eberhard; Erlbacher, Tobias; Friedrich, Jochen; Lorenz, Jürgen; Rommel, Mathias; Schellenberger, Martin
Book Article
2018An in vitro coculture system composed of THP-1 cells and 3D reconstructed human epidermis to assess activation of dendritic cells by sensitizing chemicals
Schellenberger, M.T.; Bock, U.; Hennen, J.; Gröber-Becker, F.; Walles, Heike; Blömeke, B.
Abstract
2018TLS-dicing for SiC - Latest assessment results
Lewke, D.; Cerezuela Barreto, M.; Dohnke, K.; Zühlke, H.-U.; Belgardt, C.; Schellenberger, M.
Conference Paper
2018The use of a THP-1/3D reconstructed human epidermis (RHE) coculture system to assess the sensitizing potential of chemicals
Schellenberger, M.T.; Bock, U.; Hennen, J.; Groeber-Becker, Florian Kai; Walles, Heike; Blömeke, B.
Abstract
2017Raman micro-spectroscopy as a non-destructive key analysis tool in current power semiconductor manufacturing
Biasio, M. de; Kraft, M.; Geier, E.; Goller, B.; Bergmann, C.; Esteve, R.; Cerezuela-Barreto, M.; Lewke, D.; Schellenberger, M.; Roesner, M.
Conference Paper
2017Verfahren zur Überprüfung eines Trennschrittes bei der Zerteilung eines flachen Werkstückes in Teilstücke
Tobisch, Alexander; Schellenberger, Martin; Lewke, Dirk
Patent
2016Direct optical stress sensing in semiconductor manufacturing using raman micro-spectrometry
Biasio, M. de; Kraft, M.; Roesner, M.; Bergmann, C.; Cerezuela-Barreto, M.; Lewke, D.; Schellenberger, M.
Conference Paper
2015Nachbearbeitung von teilgetrennten Bauelementen in der Halbleitertechnik
Lewke, Dirk; Schellenberger, Martin
Study
2015Thermal laser separation - a novel dicing technology fulfilling the demands of volume manufacturing of 4H-SiC devices
Lewke, D.; Dohnke, K.O.; Zühlke, H.U.; Cerezuela Barret, M.; Schellenberger, M.; Bauer, A.; Ryssel, H.
Conference Paper
2014Automated tool for measuring nanotopography of 300 mm wafers at early stages of wafer production
Tröger, B.; Mühlig, A.; Fries, T.; Bauer, S.; Wihr, H.; Riedel, F.; Lewke, D.; Schellenberger, M.
Conference Paper
2014The Factory Integration Roadmap in Semiconductor manufacturing
Moyne, J.; Schellenberger, M.; Pfitzner, L.
Conference Paper
2014Feasibility evaluation of virtual metrology for the example of a trench etch process
Roeder, G.; Winzer, S.; Schellenberger, M.; Jank, S.; Pfitzner, L.
Journal Article
2014High quality and high speed cutting of 4H-SiC JFET wafers including PCM structures by using thermal laser separation
Lewke, D.; Koitzsch, M.; Dohnke, K.O.; Schellenberger, M.; Zuehlke, H.-U.; Rupp, R.; Pfitzner, L.; Ryssel, H.
Conference Paper
2014Optical characterization of patterned thin films
Rosu, D.; Petrik, P.; Rattmann, G.; Schellenberger, M.; Beck, U.; Hertwig, A.
Conference Paper, Journal Article
2013Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment. Results from European collaborative SEAL project
Le Barillec, Olivier; Davenet, Magali; Bellet, B.; Koitzsch, Matthias; Lewke, Dirk; Schellenberger, Martin; Zühlke, Hans-Ulrich
Conference Paper
2013Characterization of thin ZnO films by vacuum ultra-violet reflectometry
Gumprecht, T.; Petrik, P.; Roeder, G.; Schellenberger, M.; Pfitzner, L.; Pollakowski, B.; Beckhoff, B.
Conference Paper
2013Full wafer nanotopography analysis on rough surfaces using stitched white light interferometry images
Lewke, D.; Schellenberger, M.; Pfitzner, L.; Fries, T.; Tröger, B.; Muehlig, A.; Riedel, F.; Bauer, S.; Wihr, H.
Conference Paper
2013Improving electric behavior and simplifying production of Si-based diodes by using thermal laser separation
Koitzsch, M.; Lewke, D.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Kolb, R.; Zühlke, H.-U.
Conference Paper
2013Practical aspects of virtual metrology and predictive maintenance model development and optimization
Schöpka, U.; Roeder, G.; Mattes, A.; Schellenberger, M.; Pfeffer, M.; Pfitzner, L.; Scheibelhofer, P.
Conference Paper
2013Verfahren und Vorrichtung zum parallelen Trennen eines Werkstücks in mehrere Teilstücke
Lorenz, Jürgen; Koitzsch, Matthias; Schellenberger, Martin; Lewke, Dirk; Gumprecht, Thomas
Patent
2013Virtual metrology for prediction of etch depth in a trench etch process
Roeder, G.; Schellenberger, M.; Pfitzner, L.; Winzer, S.; Jank, S.
Conference Paper
2012Der "Zauberspiegel" als Messprinzip
Tobisch, Alexander; Schellenberger, Martin; Pfitzner, Lothar
Journal Article
2012Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to 200 mm/s by Using Thermal Laser Separation
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke Hans-Ulrich
Conference Paper
2012Enhancements in resizing single crystalline silicon wafers up to 450 mm by using thermal laser separation
Koitzsch, M.; Lewke, D.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Zühlke, H.U.
Conference Paper
2012Framework for integration of virtual metrology and predictive maintenance
Roeder, G.; Mattes, A.; Pfeffer, M.; Schellenberger, M.; Pfitzner, L.; Knapp, A.; Mühlberger, H.; Kyek, A.; Lenz, B.; Frisch, M.; Bichlmeier, J.; Leditzky, G.; Lind, E.; Zoia, S.; Fazio, G.
Conference Paper
2012IMPROVE - a joint European effort to boost efficiency in semiconductor manufacturing
Schellenberger, Martin; Koitzsch, Matthias; Roeder, Georg; Pfeffer, Markus; Schöpka, Ulrich; Mattes, Andreas; Pfitzner, Lothar
Presentation
2012Measurement strategy for dielectric ultra-thin film characterization by vacuum ultra-violet reflectometry
Gumprecht, T.; Roeder, G.; Schellenberger, M.; Pfitzner, L.
Conference Paper
2012Stationsanordnung zur Bearbeitung und/oder Vermessen von Halbleiterscheiben sowie Bearbeitungsverfahren
Schellenberger, Martin; Lewke, Dirk
Patent
2012Thermal laser separation and its applications
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke, Hans-Ulrich
Journal Article
2012Virtual Equipment for benchmarking Predictive Maintenance algorithms
Mattes, A.; Schöpka, U.; Schellenberger, M.; Scheibelhofer, P.; Leditzky, G.
Conference Paper
2011Determination of the dill parameters of thick positive resist for use in modeling applications
Roeder, G.; Liu, S.; Aygun, G.; Evanschitzky, P.; Erdmann, A.; Schellenberger, M.; Pfitzner, L.
Conference Paper, Journal Article
2011Developing a framework for virtual metrology and predictive maintenance
Schellenberger, Martin; Roeder, Georg; Mattes, Andreas; Pfeffer, Markus; Pfitzner, Lothar; Knapp, Alexander; Mühlberger, Heribert; Bichlmeier, Josef; Valeanu, Christian; Kyek, Andreas; Lenz, Benjamin; Frisch, Markus; Leditzky, Günther
Journal Article
2011Modulares Steuerungskonzept für integrierte Messtechnik in der Halbleiterfertigung am Beispiel einer Mehrkammerprozessanlage
Schellenberger, Martin
: Ryssel, H.; Frey, L.
Dissertation
2011Thermal Laser Separation (TLS) for separating multi-crystalline silicon wafers: A comparison with state-of-the-art methods
Koitzsch, Matthias; Schellenberger, Martin
Poster
2011A virtual equipment as a test bench for evaluating virtual metrology algorithms
Mattes, Andreas; Koitzsch, Matthias; Lewke, Dirk; Müller-Zell, Michael; Schellenberger, Martin
Conference Paper
2011Virtual equipment. A test bench for virtual metrology algorithms
Mattes, Andreas; Lewke, Dirk; Schellenberger, Martin
Presentation
2010Advanced process control - lessons learned from semiconductor manufacturing
Schellenberger, M.; Roeder, G.; Öchsner, R.; Schöpka, U.; Kasko, I.
Journal Article
2010Highly sensitive wavefront sensor for visual inspection of bare and patterned silicon wafers
Lazareva, I.; Nutsch, A.; Schellenberger, M.; Pfitzner, L.; Frey, L.
Conference Paper
2010Impact of temperature increments on tunneling barrier height and effective electron mass for plasma nitrided thin SiO2 layer on a large wafer area
Aygun, G.; Roeder, G.; Erlbacher, T.; Wolf, M.; Schellenberger, M.; Pfitzner, L.
Journal Article
2010Photovoltage versus microprobe sheet resistance measurements on ultrashallow structures
Clarysse, T.; Moussa, A.; Parmentier, B.; Bogdanowicz, J.; Vandervorst, W.; Bender, H.; Pfeffer, M.; Schellenberger, M.; Nielsen, P.F.; Thorsteinsson, S.; Lin, R.; Petersen, D.
Journal Article
2010Virtual equipment engineering: A continuous simulation chain leveraging development of new semiconductor manufacturing equipment
Mattes, A.; Koitzsch, M.; Schellenberger, M.; Pfitzner, L.
Conference Paper
2010Virtual equipment engineering: A novel approach for the integrated development of semiconductor manufacturing equipment
Koitzsch, M.; Mattes, A.; Schellenberger, M.; Pfitzner, L.; Frey, L.
Conference Paper
2008Characterization of Ru and RuO2 thin films prepared by pulsed metal organic chemical vapor deposition
Roeder, G.; Manke, C.; Baumann, P.K.; Petersen, S.; Yanev, V.; Gschwandtner, A.; Ruhl, G.; Petrik, P.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.
Conference Paper, Journal Article
2007Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites
Oechsner, R.; Pfeffer, M.; Frickinger, J.; Schellenberger, M.; Roeder, G.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.; Kaushik, V.; Renaud, D.; Danel, A.; Claeys, C.; Bearda, T.; Lering, M.; Graef, M.; Murphy, B.; Walther, H.; Hury, S.
Journal Article
2007Integrated monitoring of ULK dielectrics out-gassing and measurement of pore sealing efficiency by residual gas analysis technique
Delsol, R.; Chapelon, L.; Chaabouni, H.; Broussous, L.; Schellenberger, M.; Ostrovski, A.; Normandon, P.
Conference Paper, Journal Article
2007Process optimization by means of integrated monitoring tools in the semiconductor industry
Pfitzner, L.H.; Nutsch, A.; Roeder, G.; Schellenberger, M.
Conference Paper
2006Approach for a standardized methodology for mulit-site processing of 300 mm wafers at R&D-sites
Öchsner, R.; Frickinger, J.; Pfeffer, M.; Schellenberger, M.; Roeder, G.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.; Kaushik, V.; Renaud, D.; Danel, A.; Claeys, C.; Bearda, T.; Lering, M.; Graef, M.; Murphy, B.; Walther, H.; Hury, S.
Conference Paper
2006Flying Wafer - A standardised methodology for multi-site processing of 300 mm wafers at R&D-sites
Frickinger, J.; Oechsner, R.; Schellenberger, M.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Claeys, C.; Claes, M.; Bearda, T.; Renaud, D.; Danel, A.; Lering, M.; Graef, M.; Kaushik, V.; Murphy, B.; Fritzsche, M.; Walther, H.; Hury, S.
Conference Paper
2006Flying wafer - A standardised methodology for multi-site processing Of 300 Mm wafers at research and development-sites
Frickinger, J.; Öchsner, R.; Schellenberger, M.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Claes, M.; Bearda, T.; Renaud, D.; Danel, A.; Lering, M.; Graef, M.; Kaushik, V.; Murphy, B.; Fritzsche, M.; Walther, H.; Hury, S.
Conference Paper
2006Prospects for the realization of APC in a distributed 300 mm R&D-line
Roeder, G.; Schellenberger, M.; Öchsner, R.; Pfeffer, M.; Frickinger, J.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.
Conference Paper
2006Standardization of integrated ellipsometry for semiconductor manufacturing
Roeder, G.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Richter, U.; Stehle, J.L.; Piel, J.-P.
Conference Paper
2006Trends in European R&D - Advanced process control down to atomic scale for micro- and nanotcchnologies
Pfitzner, L.; Schellenberger, M.; Oechsner, R.; Roeder, G.; Pfeffer, M.
Conference Paper
2005Unit process aspects for APC-software implementation
Roeder, G.; Schellenberger, M.; Pfitzner, L.; Ryssel, H.; Spitzlsperger, G.
Conference Paper
2002EuSIC: The information network grows. Pt.2
Roeder, G.; Schellenberger, M.; Schneider, C.
Journal Article