Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Application of quantum cascade laser absorption spectroscopy for correlation studies in plasma etching processes in the semiconductor industry
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.; Helden, J.H. van
Conference Paper
2018Iron-based Fischer-Tropsch catalysts for higher alcohol synthesis
Schaller, Max Rudolf; Reichelt, Erik; Jahn, Matthias
Journal Article
2017Antifungal defense of probiotic Lactobacillus rhamnosus GG is mediated by blocking adhesion and nutrient depletion
Mailänder-Sánchez, D.; Braunsdorf, C.; Grumaz, C.; Müller, C.; Lorenz, S.; Stevens, P.; Wagener, J.; Hebecker, B.; Hube, B.; Bracher, F.; Sohn, K.; Schaller, M.
Journal Article
2017Fischer-Tropsch to higher alcohols
Schaller, Max Rudolf; Reichelt, Erik; Fischer, Nico; Claeys, Michael; Jahn, Matthias
Conference Paper
2016(Cost) Optimization in the aerospace supply chain
Beckenlechner, Robert; Reissich, Georg; Schaller, Mathias
Journal Article
2016A ruthenium racemisation catalyst for the synthesis of primary amines from secondary amines
Pingen, Dennis; Altıntaş, Çiğdem; Schaller, Max Rudolf; Vogt, Dieter
Journal Article
2015On treatment of ultra-low-k SiCOH in CF4 plasmas: Correlation between the concentration of etching products and etching rate
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.
Journal Article
2015Production of higher alcohols from synthesis gas
Schaller, Max; Reichelt, Eric; Männel, Dorothea; Jahn, Matthias
Conference Paper
2013Characterization of the protective and immunregulatory activity of probiotic lactobacilli in mucosal Candidiasis
Mailander-Sanchez, D.; Wagener, J.; Braunsdorf, C.; Grumaz, C.; Lorenz, S.; Sohn, K.; Wehkamp, J.; Schaller, M.
Conference Paper, Journal Article
2013Determination of surface energy characteristics of plasma processed ultra low-k dielectrics for optimized wetting in wet chemical plasma etch residue removal
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
Conference Paper
2013Metatranscriptome analysis reveals new insights in probiotic/host/Candida interaction in oral Candidiasis
Mailander-Sanchez, D.; Wagener, J.; Braunsdorf, C.; Grumaz, C.; Lorenz, S.; Sohn, K.; Schaller, M.
Conference Paper, Journal Article
2012Aqueous fluoride residue removers for 32 nm and beyond copper ultra low-K technologies
Westwood, G.; Pigliucci, A.; Oszinda, T.; Leppack, S.; Schaller, M.
Conference Paper
2012Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials
Fischer, T.; Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
Journal Article, Conference Paper
2012A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices
Zimmermann, S.; Ahner, N.; Fischer, T.; Schaller, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
Conference Paper
2011Electrical property improvements of ultra low-k ILD using a silylation process feasible for process integration
Thomas, O.; Schaller, M.; Gerlich, L.; Fischer, D.; Leppack, S.; Bartsch, C.; Schulz, S.E.
Conference Paper
2011How to evaluate surface free energies of dense and ultra low-kappa dielectrics in pattern structures
Oszinda, T.; Schaller, M.; Dittmar, K.; Jiang, L.; Schulz, S. E.
Conference Paper
2011Influence of the additives argon, O-2, C4F8, H-2, N-2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Zimmermann, H.; Rülke, H.; Lang, N.; Röpcke, J.; Schulz, S.E.; Geßner, T.
Conference Paper, Journal Article
2011Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials
Fischer, T.; Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
Conference Paper
2010Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Rülke, H.; Schulz, S.E.; Gessner, T.
Conference Paper
2010Chemical Repair of plasma damaged porous ultra low-k SiOCH film using a vapor phase process
Oszinda, T.; Schaller, M.; Schulz, S.E.
Conference Paper
2010Chemical repair of plasma damaged porous ultra low-kappa SiOCH film using a vapor phase process
Oszinda, T.; Schaller, M.; Schulz, S. E.
Journal Article
2010How to evaluate surface free energies of dense and ultra low-k dielectrics in pattern structures
Oszinda, T.; Schaller, M.; Dittmar, K.; Jiang, L.; Schulz, S.E.
Conference Paper
2010Investigation of physical and chemical property changes of ultra low-kappa SiOCH in aspect of cleaning and chemical repair processes
Oszinda, T.; Schaller, M.; Fischer, D.; Walsh, C.; Schulz, S.E.
Conference Paper, Journal Article
2010Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
Conference Paper
2009Characterization of plasma damaged porous ULK SiCOH layers in aspect of changes in the diffusion behavior of solvents and repair-chemicals
Oszinda, T.; Schaller, M.; Fischer, D.; Schulz, S.E.
Conference Paper
2009Improved characterization of Fourier transform infrared spectra analysis for post-etched ultra-low-kappa SiOCH dielectric using chemometric methods
Oszinda, T.; Beyer, V.; Schaller, M.; Fischer, D.; Bartsch, C.; Schulz, S.E.
Conference Paper, Journal Article
2009Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Zimmermann, H.; Rülke, H.; Lang, N.; Röpcke, J.; Schulz, S.E.; Gessner, T.
Conference Paper
2009Restoration of plasma damaged porous ultra low-k SiOCH films: A coating process with UV activation versus a vapor phase process with thermal activation
Oszinda, T.; Schaller, M.; Leppack, S.; Schulz, S.E.
Conference Paper
2009Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions
Ahner, N.; Schaller, M.; Bartsch, C.; Baryschpolec, E.; Schulz, S.E.
Conference Paper
2008Investigation of etch processes of dense and porous low-k dielectrics using OES and QMS as in situ diagnostic methods
Zimmermann, S.; Blaschta, F.; Schaller, M.; Rülke, H.; Schulz, S.E.; Gessner, T.
Conference Paper
2008UV assisted curing of plasma damaged porous ultralow-k material after a k-restore process: Influence of UV-wavelength and curing ambient
Ahner, N.; Schulz, S.; Schaller, M.; Prager, L.
Conference Paper
2003New 3D opto-microwave module for signal summation in active antenna applications
Nicole, P.; Fourdin, C.; Schaller, M.; Streppel, U.; Bräuer, A.
Conference Paper