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| 2019 | Automated polyp detection in the colorectum: A prospective study (with videos)
Klare, P.; Sander, C.; Prinzen, M.; Haller, B.; Nowack, S.; Abdelhafez, M.; Poszler, A.; Brown, H.; Wilhelm, D.; Schmid, R.M.; Delius, S. von; Wittenberg, T. | Journal Article |
| 2019 | Human brain arousal in the resting state: A genome-wide association study
Jawinski, P.; Kirsten, H.; Sander, C.; Spada, J.; Ulke, C.; Huang, J.; Burkhardt, R.; Scholz, M.; Hensch, T.; Hegerl, U. | Journal Article |
| 2019 | A hybrid simulation tool to improve the energy efficiency in production environment
Zhou, Beiyan; Frye, Maik; Sander, C.; Schmitt, Robert H. | Conference Paper |
| 2018 | Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried | Conference Paper |
| 2018 | A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits
Kutukova, Kristina; Niese, Sven; Sander, Christoph; Standke, Yvonne; Gluch, Jürgen; Gall, Martin; Zschech, Ehrenfried | Journal Article |
| 2018 | Vorrichtung zur Durchführung von Biegeversuchen an plattenförmigen Proben
Clausner, André; Gall, Martin; Macher, Frank; Sander, Christoph; Zschech, Ehrenfried | Patent |
| 2016 | The impact of MS-related cognitive fatigue on future brain parenchymal loss and relapse: A 17-month follow-up study
Sander, C.; Eling, P.; Hanken, K.; Klein, J.; Kastrup, A.; Hildebrandt, H. | Journal Article |
| 2016 | Novel approaches to determine thermomechanical materials data in advanced interconnect stacks
Zschech, Ehrenfried; Gall, Martin; Clausner, André; Sander, Christoph; Sukharev, Valeriy | Conference Paper |
| 2016 | TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried | Journal Article |
| 2015 | In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried | Journal Article |
| 2015 | In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried | Journal Article, Conference Paper |
| 2014 | Advanced 3D packaging of chips and materials integrity: Stress-induced effects and mechanical properties of new ultra low-k dielectrics for on-chip interconnect stacks
Sander, Christoph; Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried | Conference Paper |
| 2014 | Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration
Sander, Christoph; Standke, Yvonne; Niese, Sven; Rosenkranz, Rüdiger; Clausner, André; Gall, Martin; Zschech, Ehrenfried | Journal Article, Conference Paper |
| 2014 | In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
Yeap, Kong Boon; Gall, Martin; Liao, Zhongquan; Sander, Christoph; Mühle, Uwe; Justison, Patrick; Aubel, Oliver; Hauschildt, Meike; Beyer, Armand; Vogel, Norman; Zschech, Ehrenfried | Journal Article |
| 2014 | A new in situ microscopy approach to study the degradation and failure mechanisms of time-dependent dielectric breakdown: Set-up and opportunities
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Aubel, Oliver; Mühle, Uwe; Gluch, Jürgen; Niese, Sven; Standke, Yvonne; Rosenkranz, Rüdiger; Löffler, Markus; Vogel, Norman; Beyer, Armand; Engelmann, Hans Jürgen; Guttmann, Peter; Schneider, Gerhard; Zschech, Ehrenfried | Journal Article |
| 2013 | An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures
Yeap, K.B.; Gall, M.; Sander, C.; Niese, S.; Liao, Z.; Ritz, Y.; Rosenkranz, R.; Mühle, U.; Gluch, J.; Zschech, E.; Aubel, O.; Beyer, A.; Hennesthal, C.; Hauschildt, M.; Talut, G.; Poppe, J.; Vogel, N.; Engelmann, H.-J.; Stauffer, D.; Major, R.; Warren, O. | Conference Paper |
| 2013 | Multi-scale materials data for 3D TSV stack performance simulation and model validation
Zschech, E.; Yeap, K.B.; Sander, C.; Muehle, U.; Gall, M.; Sukharev, V. | Conference Paper |