Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Reactive bonding with oxide based reactive multilayers
Vogel, K.; Roscher, F.; Wiemer, M.; Zimmermann, S.; Otto, T.
Conference Paper
2017Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T.
Conference Paper
2017Prüfvorrichtung und Verfahren zur Ermittlung einer Abreißfestigkeit
Roscher, Frank; Vogel, Klaus; Wiemer, Maik; Bräuer, Jörg; Schade, Dirk
Patent
2017Reliability characterization of aerosol jet printing technology for multilayer secure envelopes
Lecavelier, A.; Tezenas, A.; Brizoux, M.; Roscher, F.; Saeidi, N.
Conference Paper
2016Ceramic substrate technology for wafer level packaging of MEMS
Ziesche, Steffen; Ihle, Martin; Gabler, Felix; Roscher, Frank
Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Low temperature thermo compression bonding with printed intermediate bonding layers
Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T.
Conference Paper
2016Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas
Conference Paper
2016A new approach for 3D Integration based on printed multilayers and through polymer vias
Roscher, F.; Saeidi, N.; Enderlein, T.; Selbmann, F.; Wiemer, M.; Gessner, T.
Conference Paper
2015Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing
Seifert, T.; Sowade, E.; Roscher, F.; Wiemer, M.; Gessner, T.; Baumann, R.R.
Journal Article
2015Aerosol jet printing of nano particle based electrical chip interconnects
Seifert, T.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2015Assembly and packaging of micro systems by using reactive bonding processes
Schumacher, Axel; Gaiß, Ulrike; Knappmann, Stefan; Dietrich, Georg; Braun, Stefan; Pflug, Erik; Roscher, Frank; Vogel, Klaus; Hertel, Silvia; Kähler, Dirk; Reinert, Wolfgang
Conference Paper
2015Fügeverfahren, Material- oder Phasentransformationsverfahren, Sicherungsverfahren, Fügemittel und Sicherheitssystem unter Verwendung reaktiver Materialsysteme
Bräuer, Jörg; Besser, Jan; Roscher, Frank; Seifert, Tobias; Wiemer, Maik
Patent
2014Improvement of copper bonding by analyzing the mechanical properties of the bond interface
Vogel, K.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Book Article
2014Introducing aerosol-jet printing as semiconductor and MEMS fabrication process
Roscher, F.; Seifert, T.; Wiemer, M.
Book Article
2013Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers
Ihle, Martin; Ziesche, Steffen; Roscher, Frank; Capraro, Beate; Partsch, Uwe
Conference Paper
2012Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung
Vogel, K.; Baum, M.; Roscher, F.; Kinner, R.; Rank, H.; Mayer, T.; Wiemer, M.; Gessner, T.
Conference Paper
2012Sensormodul und Verfahren zum Herstellen eines Sensormoduls
Roscher, F.; Baum, M.; Wiemer, M.; Geßner, T.; Gebhardt, C.
Patent
2012Si interposer technologies for three dimensional AMR sensor systems
Raukopf, S.; Gebhardt, C.; Roscher, F.; Baum, M.; Kinner, R.; Wiemer, M.; Gessner, T.
Conference Paper
2011Aerosol jet as a deposition method for conductive layers in micro- system-technology using nanoparticle inks
Müller, M.; Roscher, F.; Sowade, E.; Seifert, T.; Wiemer, M.; Gessner, T.; Baumann, R.R.
Conference Paper
2011Investigations of thermocompression bonding with thin metal layers
Froemel, J.; Baum, M.; Wiemer, M.; Roscher, F.; Haubold, M.; Jia, C.; Gessner, T.
Conference Paper
2011Metal thermo compression bonding at wafer level and its capabilities for 3D integration
Baum, M.; Roscher, F.; Froemel, J.; Jia, C.; Rank, H.; Hausner, R.; Reichenbach, R.; Wiemer, M.; Gessner, T.
Conference Paper
2011Si interposer technologies for three dimensional sensor systems
Roscher, F.; Baum, M.; Gebhardt, C.; Raukopf, S.; Wiemer, M.; Gessner, T.
Conference Paper