Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Doping Effects in CMOS‐compatible CoSi Thin Films for Thermoelectric and Sensor Applications
Nichenametla, Charan Krishna; Calvo, Jesús; Riedel, Stefan; Gerlich, Lukas; Hindenberg, Meike; Novikov, Sergej; Alexander Burkov; Kozelj, Primoz; Cardoso-Gil, Raul; Wagner-Reetz, Maik
Journal Article
2019The annealing effect on memory state stability and interlayer coupling in perpendicular magnetic tunnel junctions with ultrathin MgO barrier
Lv, Hua; Fidalgo, João; Leitão, Diana C.; Silva, Ana V.; Kämpfe, Thomas; Riedel, Stefan; Langer, Juergen; Wrona, Jerzy; Ocker, Berthold; Freitas, Paolo P.; Cardoso, Susana
Journal Article
2019Assessment of conduction mechanisms through MgO ultrathin barriers in CoFeB/MgO/CoFeB perpendicular magnetic tunnel junctions
Lv, Hua; Fidalgo, João; Silva, Ana V.; Leitão, Diana C.; Kämpfe, Thomas; Riedel, Stefan; Langer, Juergen; Wrona, Jerzy; Ocker, Berthold; Freitas, Paolo P.; Cardoso, Susana
Journal Article
2019High-density energy storage in Si-doped hafnium oxide thin films on area-enhanced substrates
Kühnel, Kati; Czernohorsky, M.; Riedel, Steffen; Mart, Clemens; Weinreich, Wenke
Journal Article
2018CMOS compatible pyroelectric applications enabled by doped HfO2 films on deep-trench structures
Mart, Clemens; Weinreich, Wenke; Czernohorsky, Malte; Riedel, Stefan; Zybell, Sabine; Kühnel, Kati
Conference Paper
2018High Endurance Ferroelectric Hafnium Oxide-Based FeFET Memory Without Retention Penalty
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Steinke, P.; Calvo, J.; Zimmermann, K.; Müller, J.
Journal Article
2018Reliable high-density energy storage in Si-doped HfO2 thin films on 3D-structures
Kühnel, Kati; Riedel, Stefan; Mart, Clemens; Weinreich, Wenke
2018Silicon doped hafnium oxide (HSO) and hafnium zirconium oxide (HZO) based FeFET
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Thrun, X.; Hanisch, N.; Steinke, P.; Calvo, J.; Müller, J.
Journal Article
2018Tuning parameters and their impact on ferroelectric hafnium oxide
Polakowski, Patrick; Büttner, Teresa; Ali, Tarek Nadi Ismail; Riedel, Stefan; Kämpfe, Thomas; Seidel, Konrad; Müller, Johannes; Pätzold, Björn
2017Capacitance maximization of ultra-thin Si-capacitors by atomic layer deposition of anti-ferroelectric HfO2 in high aspect ratio structures
Riedel, Stefan; Weinreich, Wenke; Mart, Clemens; Müller, Johannes
2017Enhanced reliability and capacitance stability of ZrO2-based decoupling capacitors by interface doping with Al2O3
Mart, C.; Zybell, S.; Riedel, S.; Czernohorsky, M.; Seidel, K.; Weinreich, W.
Journal Article
2017First investigations towards the feasibility of an Al/Br2 battery based on ionic liquids
Hog, M.; Burgenmeister, B.; Bromberger, K.; Schuster, M.; Riedel, S.; Krossing, I.
Journal Article
2017Gewitter im Chip - Resistive Speicher für low-power Anwendungen
Seidel, Konrad; Riedel, Stefan; Kalishettyhalli Ma, Mamathamba; Polakowski, Patrick; Müller, Johannes
Conference Paper
2016Catalytic ALD of SiO2 as spacer for an E-Beam direct write self-aligned double patterning process on 300 mm wafers
Kühnel, Kati; Riedel, Stefan; Weinreich, Wenke; Thrun, Xaver; Czernohorsky, Malte; Pätzold, Björn; Rudolph, Matthias
2016Low-temperature microwave-based plasma oxidation of Ge and oxidation of silicon followed by plasma nitridation
Lerch, W.; Schick, T.; Sacher, N.; Kegel, W.; Niess, J.; Czernohorsky, M.; Riedel, S.
Conference Paper
2016A thermally robust and thickness independent ferroelectric phase in laminated hafnium zirconium oxide
Riedel, S.; Polakowski, P.; Müller, J.
Journal Article
2015Integration challenges of ferroelectric hafnium oxide based embedded memory (Invited)
Müller, Johannes; Polakowski, Patrick; Paul, Jan; Riedel, Stefan; Hoffmann, Raik; Drescher, Maximilian; Slesazeck, Stefan; Müller, Stefan; Mulaosmanovic, Halid; Schröder, Uwe; Mikolajick, Thomas; Flachowsky, Stefan; Erben, Elke; Smith, Elliot; Binder, Robert; Triyoso, Dina H.; Metzger, Joachim; Kolodinski, Sabine
Conference Paper
2015Low temperature deposition of silicon nitride using Si3Cl8
Riedel, S.; Sundqvist, J.; Gumprecht, T.
Journal Article
2015Polyhydroxyalkanoates production with Ralstonia eutropha from low quality waste animal fats
Riedel, S.L.; Jahns, S.; Koenig, S.; Bock, M.C.E.; Brigham, C.J.; Bader, J.; Stahl, U.
Journal Article
2015Scaling and optimization of ferroelectric hafnium oxide for memory applications and beyond
Müller, Johannes; Riedel, Stefan; Polakowski, Patrick
2015Structural and Dielectric Properties of Subnanometric Laminates of Binary Oxides
Kahouli, A.; Lebedev, O.; Ben Elbahri, M.; Mercey, B.; Prellier, W.; Riedel, S.; Czernohorsky, M.; Lallemand, F.; Bunel, C.; Lüders, U.
Journal Article
2015Ultra-Thin high density capacitors for advanced packaging solutions
Seidel, K.; Böttcher, M.; Dobritz, S.; Czernohorsky, M.; Riedel, S.; Weinreich, W.
Conference Paper
2014ALD ZrO2 processes for BEoL device applications
Weinreich, Wenke; Seidel, Konrad; Polakowski, Patrick; Riedel, Stefan; Wilde, Lutz; Sundqvist, Jonas; Triyoso, Dina H.; Nolan, Mark G.
Conference Paper
2014Ferroelectric deep trench capacitors based on Al:HfO2 for 3D nonvolatile memory applications
Polakowski, Patrick; Riedel, Stefan; Weinreich, Wenke; Rudolf, M.; Sundqvist, Jonas; Seidel, Konrad; Müller, Johannes
Conference Paper
2014Ferroelectric hafnium oxide: A game changer to FRAM?
Müller, J.; Polakowski, P.; Riedel, S.; Mueller, S.; Yurchuk, E.; Mikolajick, T.
Conference Paper
2014Lipid and fatty acid metabolism in Ralstonia eutropha: Relevance for the biotechnological production of value-added products
Riedel, S.L.; Lu, J.N.; Stahl, U.; Brigham, C.J.
Journal Article
2013Evaluation of an advanced dual hard mask stack for high resolution pattern transfer
Paul, Jan; Rudolph, M.; Riedel, S.; Thrun, X.; Wege, S.; Hohle, C.
Conference Paper
2013Ferroelectric hafnium oxide: A CMOS-compatible and highly scalable approach to future ferroelectric memories
Müller, J.; Böscke, T.S.; Müller, S.; Yurchuk, E.; Polakowski, P.; Paul, J.; Martin, D.; Schenk, T.; Khullar, K.; Kersch, A.; Weinreich, W.; Riedel, S.; Seidel, K.; Kumar, A.; Arruda, T.M.; Kalinin, S.V.; Schlösser, T.; Boschke, R.; Bentum, R. van; Schröder, U.; Mikolajick, T.
Conference Paper
2013High resolution patterning for sub 30 nm technology nodes using a ceramic based dual hard mask
Paul, J.; Rudolph, M.; Riedel, S.; Thrun, X.; Beyer, V.; Wege, S.; Hohle, C.
Conference Paper
2013High-density capacitors for SiP and SoC applications based on three-dimensional integrated metal-isolator-metal structures
Weinreich, Wenke; Rudolph, Matthias; Koch, Johannes; Paul, Jan; Seidel, Konrad; Riedel, Stefan; Sundqvist, Jonas
Conference Paper
2013Optimized electrode and interface for enhanced reliability of high-k based metal-insulator-metal capacitors
Koch, Johannes; Seidel, Konrad; Weinreich, Wenke; Riedel, Stefan; Chiang, Jung-Chin; Beyer, Volkhard
Journal Article
2013Scaling and optimization of high-density integrated Si-capacitors
Weinreich, W.; Seidel, K.; Rudolph, M.; Koch, J.; Paul, J.; Riedel, S.; Sundqvist, J.; Steidel, K.; Gutsch, M.; Beyer, V.; Hohle, C.
Conference Paper
2013TEMAZ/O-3 atomic layer deposition process with doubled growth rate and optimized interface properties in metal-insulator-metal capacitors
Weinreich, W.; Tauchnitz, T.; Polakowski, P.; Drescher, M.; Riedel, S.; Sundqvist, J.; Seidel, K.; Shirazi, M.; Elliott, S.D.; Ohsiek, S.; Erben, E.; Trui, B.
Journal Article
2012Incipient ferroelectricity in Al-doped HfO2 thin films
Mueller, Stefan; Mueller, Johannes; Singh, Aarti; Riedel, Stefan; Sundqvist, Jonas; Schroeder, Uwe; Mikolajick, Thomas
Journal Article
2012Introduction of zirconium oxide in a hardmask concept for highly selective patterning of scaled high aspect ratio trenches in silicon
Paul, Jan; Riedel, Stefan; Rudolph, Matthias; Wege, Stephan; Czernohorsky, Malte; Sundqvist, Jonas; Hohle, Christoph; Beyer, Volkhard
Journal Article, Conference Paper
2011Atomic layer deposition of ruthenium films on strontium titanate
Kukli, K.; Kemell, M.; Lu, J.; Hultman, L.; Riedel, S.; Sundqvist, J.; Ritala, M.; Leskela, M.
Journal Article
2011Inter-Event Dependencies support Event Extraction from Biomedical Literature
Klinger, R.; Riedel, S.; McCallum, A.
Conference Paper
2011Synthesis of SrTiO3 by crystallization of SrO/TiO2 superlattices prepared by atomic layer deposition
Riedel, Stefan; Neidhardt, J.; Jansen, S.; Wilde, Lutz; Sundqvist, Jonas; Erben, E.; Teichert, S.; Michaelis, A.
Journal Article
2010Patterning of deep silicon trenches using a novel hardmask concept with ultra-thin E-Beam resist
Paul, J.; Riedel, S.; Wege, S.; Beyer, V.; Kücher, P.
2010Thermal ALD of SrTiO3 films using Sr(iPr3Cp)2 and Star-Ti
Riedel, S.; Sundqvist, J.; Wilde, L.; Boitier, L.; Wilde, C.; Blasco, N.; Lachaud, C.; Zauner, A.; Michaelis, A.
2009Massenspektroskopie zur Analyse chlorhaltiger Plasmen beim reaktiven lonenätzen von Silizium und Siliziumoxid
Riedel, S.
Conference Paper
2003Deposition and treatment of titanium based barrier layers by MOCVD
Ecke, R.; Schulz, S.E.; Gessner, T.; Riedel, S.; Lipp, E.; Eizenberg, M.
Conference Paper
2002Copper alloy formation and film properties after annealing of Al/Cu stacks in different ambients
Chen, Z.; Richter, K.; Riedel, S.; Schulz, S.E.; Gessner, T.
Journal Article
2002InterChip via technology by using copper for vertical system integration
Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T.
Conference Paper
2001Copper metallization scheme for vertical chip integration
Riedel, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Wieland, R.; Leutenecker, R.; Klumpp, A.; Ramm, P.
Conference Paper
2001Influence of different treatment techniques on the barrier properties of MOCVD TiN against copper diffusion
Riedel, S.; Schulz, S.E.; Baumann, J.; Rennau, M.; Gessner, T.
Conference Paper, Journal Article
2000Investigation of the plasma treatment in a multistep TiN MOCVD process
Riedel, S.; Schulz, S.E.; Gessner, T.
Journal Article
1999Process and equipment simulation of copper CVD using Cu(hfac)vtms
Wolf, H.; Gieser, H.; Riedel, S.; Streiter, R.; Gessner, T.
Journal Article