Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020The Impact of Wettability and Surface Roughness on Fluid Displacement and Capillary Trapping in 2‐D and 3‐D Porous Media. 2. Combined Effect of Wettability, Surface Roughness, and Pore Space Structure on Trapping Efficiency in Sand Packs and Micromodels
Zulfiqar, B.; Vogel, H.; Ding, Y.; Golmohammadi, S.; Kuechler, M.; Reuter, D.; Geistlinger, H.
Journal Article
2020Process monitoring and impulse detection in face milling using capacitive acceleration sensors based on MEMS
Clauß, B.; Meinecke, C.; Günther, W.; Akthari, S.; Albers, J.; Forke, R.; Streit, P.; Reuter, D.; Schubert, A.
Journal Article, Conference Paper
2019Characterisation of MOS transistors as an electromechanical transducer for stress
Hafez, M.; Haas, S.; Loebel, K.-U.; Reuter, D.; Ramsbeck, M.; Schramm, M.; Horstmann, J.-T.; Otto, T.
Journal Article
2019Developing a process to remove single silicon layers by atomic layer etching
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T.
Conference Paper
2019Development of a multi-sensor system for condition monitoring and crash detection of machine tools with rotating spindles
Meinecke, C.; Clauss, B.; Albers, J.; Hoeller, H.; Streit, P.; Forke, R.; Weidlich, S.; Dittrich, C.; Stritzke, B.; Schubert, A.; Hiller, K.; Reuter, D.
Conference Paper
2019Evaporation study based on micromodel experiments: Comparison of theory and experiment
Geistlinger, H.; Ding, Y.; Apelt, B.; Schlüter, S.; Küchler, M.; Reuter, D.; Vorhauer, N.; Vogel, H.‐J.
Journal Article
2019Integration of plasmonic nanostructures for micro-opto-electromechanical-systems
Heldt, G.; Weiss, A.; Helke, C.; Erben, J.; Kurth, S.; Meinig, M.; Martin, J.; Hiller, K.; Reuter, D.; Otto, T.
Conference Paper
2019Nanostructured al SWG Reflectors on thin LP-Si3N4 membranes as (TiO2/SiO2)³ Bragg reflector alternative for VIS Fabry-Pérot Interferometers
Helke, C.; Hiller, K.; Seiler, J.; Erben, J.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Otto, T.
Conference Paper
2019Parameter dependency of DNA origami immobilization at micro- and nano structured CF polymer surfaces on SiO2
Hann, J.; Helke, C.; Lakatos, M.; Heerwig, A.; Nestler, J.; Erben, J.; Reuter, D.; Mertig, M.; Otto, T.
Journal Article, Conference Paper
2019Role of contacts in carbon nanotube giant piezoresistive sensors
Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Heldt, G.; Reuter, D.; Schuster, J.; Hermann, S.
Conference Paper
2019Sensoric Micro and Nano Systems. Editorial
Zahn, D.R.T.; Schulz, S.E.; Hiller, K.; Wagner, C.; Reuter, D.; Otto, T.
Journal Article
2018Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices
Heldt, Georg; Meinecke, Christoph; Steenhusen, Sönke; Korten, Till; Groß, Matteo; Domann, Gerhard; Lindberg, F.; Reuter, Danny; Diez, S.; Linke, H.; Schulz, Stefan E.
Conference Paper
2018Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T.
Conference Paper
2018Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau
Dittrich, C.; Forke, R.; Hiller, K.; Kreutziger, P.; Kuerschner, R.; Meinecke, C.; Reuter, D.; Weidlich, S.; Streit, P.; Hahn, S.
Conference Paper
2018Fabrication and operation of protein-powered biocomputation using nanostructured networks
Meinecke, C.; Reuter, D.; Schulz, S.E.; Korten, T.; Heldt, G.; Diez, S.
Conference Paper
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Conference Paper
2018Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization undefined
Haugwitz, T.; Erben, J.; Neumann, N.; Reuter, D.; Plettemeier, D.
Conference Paper
2018Technologie zur Herstellung von nanostrukturierten Netzwerken für biomolekularbetriebene Computer
Meinecke, C.; Korten, T.; Heldt, G.; Reuter, D.; Diez, S.; Schulz, S.E.
Conference Paper
20173D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T.
Journal Article
2017Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: An example for Match 1:1-, eBeam-, and nanoimprint lithography
Helke, C.; Hiller, K.; Erben, J.W.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Conference Paper
2017Fabrication and operation of kinesin-1-powered biocomputation networks
Meinecke, C.; Korten, Till; Heldt, G.; Reuter, D.; Diez, Stefan
Abstract
2017HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Journal Article
2017Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas
Conference Paper
2017Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers
Helke, C.; Hiller, K.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Conference Paper
2017Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Journal Article
2017Robust vibration Sensor for condition monitoring in railway applications
Pleul, M.; Streit, P.; Polster, K.; Schulze, R.; Schuh, A.; Meinecke, C.; Reuter, D.
Conference Paper
2017Scalable fabrication of carbon nanotube field-effect transistors (CNT-FETs) implementing wafer-level electron-beam lithography and dielectrophoretic CNT assembly
Blaudeck, T.; Hermann, S.; Hartmann, M.; Böttger, S.; Tittmann-Otto, J.; Heldt, G.; Reuter, D.; Schulz, S.E.
Abstract
2017Wertvolle Seen in der Produktion. Mit Data Lakes Informationen bedarfsgerecht und einfach bereitstellen
Krauß, Jonathan; Heutmann, Timo; Quix, Christoph; Reuter, Dominic; Harmata, Simon; Schmitt, Robert
Journal Article
2016Architecture of a web-based DICOM viewer showing segmentations and simulations
Ellerweg, R.; Reuter, D.; Weir, P.
Conference Paper
2016Design and implementation of a web based medical image viewer architecture
Ellerweg, R.; Reuter, D.; Stärk, E.; Weir, P.
Journal Article, Conference Paper
2016The development of a simulation tool for clinical use in image-guided percutaneous minimally invasive cancer treatment (MICT) - the GoSmart project
Voigt, P.; Fuchs, J.; Petersen, T.-O.; Jantschke, R.; Flanagan, R.; Weir, P.; Pollari, M.; Alhonnoro, T.; Payne, S.; Hall, S.; Fütterer, J.; Oostenbrugge, T. van; Stiegler, P.; Kalmar, P.; Fischer, S.; Zangos, S.; Voglreiter, P.; Ellerweg, R.; Reuter, D.; Stärk, E.; Kahn, T.; Kolesnik, M.; Moche, M.
Abstract
2016Direct integration of field effect transistors as electro mechanical transducer for stress on beam structures
Haas, S.; Hafez, N.; Loebel, K.-U.; Koegel, E.; Ramsbeck, M.; Reuter, D.; Horstmann, J.T.; Gessner, T.
Conference Paper
2016Stress analysis in semiconductor devices by Kelvin probe force microscopy
Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M.
Abstract
20153D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T.
Conference Paper
20153d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2015Direct integrated strain sensors for robust temperature behaviour
Haas, S.; Schramm, M.; Reuter, D.; Loebel, K.-U.; Horstmann, J.T.; Gessner, T.
Conference Paper
2015Go-Smart: Web-based computational modeling of minimally invasive cancer treatments
Weir, P.; Reuter, D.; Ellerweg, R.; Alhonnoro, T.; Pollari, M.; Voglreiter, P.; Mariappan, P.; Flanagan, R.; Park, C.S.; Payne, S.; Staerk, E.; Voigt, P.; Moche, M.; Kolesnik, M.
Conference Paper
2015Micro welding of aluminum for post process electrode gap reduction using femtosecond laser
Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T.
Conference Paper
2015Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen
Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T.
Conference Paper
2015TSCuPc/Au hybrid trench devices. A comparative study of solution processed and thermally evaporated molecular channels
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Salvan, G.; Zahn, D.R.T.
Abstract
2014AIM technology and devices - from basic research to industrial proven MEMS platform
Bertz, A.; Reuter, D.; Nowack, M.
Book Article
2014Integration von MOS-Transistoren als Wandler für mechanische Spannungen
Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Abstract
2014Organic lateral trench devices fabricated by trench technology
Banerjee, S.; Richter, P.; Buelz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Zahn, D.R.T.; Salvan, G.
Abstract
2013Direct integration of field effect transistors as electro mechanical transducer for stress
Haas, S.; Reuter, D.; Bertz, A.; Gessner, T.; Schramm, M.; Loebel, K.-U.; Horstmann, J.T.
Conference Paper
2013Laterally stacked organic devices fabricated by trench technology
Reuter, D.; Banerjee, S.; Fronk, M.; Salvan, G.; Hiller, K.; Zahn, D.R.T.; Gessner, T.
Conference Paper
2013Studies on the piezoresistive effect in MOS transistors for use in integrated MEMS sensors
Haas, S.; Schramm, M.; Loebel, K.-U.; Heinz, S.; Reuter, D.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Conference Paper
2012Device for storing power supply information of e.g. TV, supplies electrical charge carriers to nanoparticles selectively in regions in specific operating state
Reuter, Danny; Geßner, Thomas; Morschhauser, Andreas; Otto, Thomas; Martin, Jörg; Kießling, Torsten; Piasta, Doreen
Patent
2012Micro arc welding for electrode gap reduction of high aspect ratio microstructures
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T.
Journal Article, Conference Paper
2012Optimierung von Verarbeitungsprozessen und Erstellung einer Cloud-Architektur für ein Geoinformationssystem
Reuter, Dominik
: Krämer, Michel (Betreuer)
Master Thesis
2012Out of plane capacitive transducer in air gap insulation microstructures technology for high precision monolithic 3-axis sensors
Reuter, D.; Nowack, M.; Shaporin, A.; Rockstroh, J.; Haas, S.; Bertz, A.; Mehner, J.; Gessner, T.
Conference Paper
2012Untersuchungen zum piezoresistiven Effekt in MOS-Transistoren für die Anwendung in integrierten MEMS-Sensoren
Haas, S.; Schramm, M.; Heinz, S.; Loebel, K.-U.; Reuter, D.; Bertz, A.; Gessner, T.; Horstmann, J.T.
Conference Paper
2011FEM simulation and its application in MEMS design
Jia, C.; Reuter, D.; Wen, Z.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2011Lokales Mikroschweißen als post-process Technologie zur permanenten Reduzierung des Elektrodenabstandes von HARMS
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T.
Conference Paper
2011Novel post-process gap reduction technology of high aspect ratio microstructures utilizing micro welding
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuchler, M.; Bertz, A.; Gessner, T.
Conference Paper
2010Aufbau einer Produktlinie für ein Geoinformationssystem und Bereitstellung unterstützender Werkzeuge
Reuter, Dominik
: Krämer, Michel (Betreuer)
Bachelor Thesis
2010Gütebestimmung von MEMS-Strukturen im Zeitbereich mittels Laser Doppler Vibrometer und einem Logarithmierer
Voigt, S.; Tenholte, D.; Franke, D.; Reuter, D.; Hiller, K.; Gessner, T.; Mehner, J.
Conference Paper
2010A method for the fabrication of extra-thin silicon substrates
Jia, C.; Hiller, K.; Wiemer, M.; Reuter, D.; Gessner, T.
Conference Paper
2010A novel three-axis AIM vibration sensor for high accuracy condition monitoring
Nowack, M.; Reuter, D.; Bertz, A.; Kuechler, M.; Aurich, T.; Dittrich, C.; Gessner, T.
Conference Paper
2010Quantized magnetic confinement in quantum wires
Tarasov, A.; Hugger, S.; Xu, H.; Cerchez, M.; Heinzel, T.; Zozoulenko, I.V.; Gasser-Szerer, U.; Reuter, D.; Wieck, A.D.
Journal Article
2009A comparative study of freezing single cells and spheroids: Towards a new model system for optimizing freezing protocols for cryobanking of human tumours
Ehrhart, F.; Schulz, J.C.; Katsen-Globa, A.; Shirley, S.G.; Reuter, D.; Bach, F; Zimmermann, U.; Zimmermann, H.
Journal Article
2009Hermetic thin film encapsulation of mechanical transducers for smart label applications
Reuter, D.; Nowack, M.; Rennau, M.; Bertz, A.; Wiemer, M.; Kriebel, F.; Gessner, T.
Conference Paper
2009Integration of inertial MEMS sensors in active smart RFID labels for transport monitoring
Reuter, D.; Nowack, M.; Bertz, A.; Wiemer, M.; Semar, R.; Kriebel, F.; Hopp, K.-F.; Dittrich, S.; Thieme, T.
Conference Paper
2009Integration von MEMS-Inertialsensoren in Smart RFID Label zur Transportüberwachung empfindlicher Güter
Nowack, M.; Reuter, D.; Bertz, A.; Gessner, T.
Conference Paper
2009Smart systems integration by using micro- and nanotechnologies
Gessner, T.; Reuter, D.
Conference Paper
2008Magnetic-barrier-induced conductance fluctuations in quantum wires
Hugger, S.; Xu, H.; Tarasov, A.; Cerchez, M.; Heinzel, T.; Zozoulenko, I.V.; Reuter, D.; Wieck, A.D.
Journal Article
2008Thin film encapsulation technology for harms using sacrificial CF-polymer
Reuter, D.; Bertz, A.; Nowack, A.; Gessner, T.
Conference Paper, Journal Article
2007Bulksiliziummikromechanik, Entwicklungstendenzen und Beispiele
Wiemer, M.; Frömel, J.; Hiller, K.; Reuter, D.; Jia, C.
Conference Paper
2007Thin Film Encapsulation of High Aspect Ratio Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Gessner, T.
Conference Paper
2007Thin Film Encapsulation of Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Werner, T.; Nowack, M.; Gessner, T.
Conference Paper
2007Wafer-Level Active Testing of Capacitive Inertial Sensors
Nowack, M.; Reuter, D.; Rennau, M.; Bertz, A.; Gessner, T.
Conference Paper
2006In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Dötzel, W.; Gessner, T.
Journal Article
2005Efficient and flexible high aspect ratio micromachining for the fabrication of low-g-sensors
Bertz, A.; Lohmann, C.; Reuter, D.; Geßner, T.
Abstract
2005Flexible Herstellung und Charakterisierung von Inertialsensoren basierend auf der AIM-Technologie
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T.
Conference Paper
2005In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Buschnakowski, S.; Doetzel, W.; Gessner, T.
Conference Paper
2005Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement
Billep, D.; Hiller, K.; Frömel, J.; Tenholte, D.; Reuter, D.; Dötzel, W.; Gessner, T.
Conference Paper
2005Selective adhesive bonding with SU-8 for zero-level-packaging
Reuter, D.; Bertz, A.; Schwenzer, G.; Gessner, T.
Conference Paper
2005A spectral vibration detection system based on tunable micromechanical resonators
Scheibner, D.; Mehner, J.; Reuter, D.; Gessner, T.; Dötzel, W.
Conference Paper, Journal Article
2005Validierung der AIM Technologie: Darstellung der Leistungsfähigkeit anhand hergestellter Sensor- und Aktorstrukturen
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T.
Conference Paper
2004Characterization and self-test of electrostatically tunable resonators for frequency selective vibration measurements
Scheibner, D.; Mehner, J.; Reuter, D.; Kotarsky, U.; Geßner, T.; Dötzel, W.
Conference Paper, Journal Article
2004High aspect ratio micromachining using the AIM technology
Lohmann, C.; Reuter, D.; Bertz, A.; Geßner, T.
Book Article
2004MEMS Metallization
Lohmann, C.; Gottfried, K.; Bertz, A.; Reuter, D.; Hiller, K.; Kuhn, M.; Gessner, T.
Conference Paper
2003Mechanical reliability of MEMS fabricated by a special technology using standard silicon wafers
Lohmann, C.; Bertz, A.; Küchler, M.; Reuter, D.; Gessner, T.
Conference Paper
2003Selektives Niedertemperaturbonden mit SU-8 für Wafer-Level-Verkappung von mikromechanischen Strukturen
Reuter, D.; Frömel, J.; Schwenzer, G.; Bertz, A.; Geßner, T.
Conference Paper
19983D product presentation online
Dauner, Jens; Landauer, Jürgen; Stimpfig, Elke; Reuter, D.
Conference Paper