| | |
|---|
| 2020 | The Impact of Wettability and Surface Roughness on Fluid Displacement and Capillary Trapping in 2‐D and 3‐D Porous Media. 2. Combined Effect of Wettability, Surface Roughness, and Pore Space Structure on Trapping Efficiency in Sand Packs and Micromodels
Zulfiqar, B.; Vogel, H.; Ding, Y.; Golmohammadi, S.; Kuechler, M.; Reuter, D.; Geistlinger, H. | Journal Article |
| 2020 | Process monitoring and impulse detection in face milling using capacitive acceleration sensors based on MEMS
Clauß, B.; Meinecke, C.; Günther, W.; Akthari, S.; Albers, J.; Forke, R.; Streit, P.; Reuter, D.; Schubert, A. | Journal Article, Conference Paper |
| 2019 | Characterisation of MOS transistors as an electromechanical transducer for stress
Hafez, M.; Haas, S.; Loebel, K.-U.; Reuter, D.; Ramsbeck, M.; Schramm, M.; Horstmann, J.-T.; Otto, T. | Journal Article |
| 2019 | Developing a process to remove single silicon layers by atomic layer etching
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T. | Conference Paper |
| 2019 | Development of a multi-sensor system for condition monitoring and crash detection of machine tools with rotating spindles
Meinecke, C.; Clauss, B.; Albers, J.; Hoeller, H.; Streit, P.; Forke, R.; Weidlich, S.; Dittrich, C.; Stritzke, B.; Schubert, A.; Hiller, K.; Reuter, D. | Conference Paper |
| 2019 | Evaporation study based on micromodel experiments: Comparison of theory and experiment
Geistlinger, H.; Ding, Y.; Apelt, B.; Schlüter, S.; Küchler, M.; Reuter, D.; Vorhauer, N.; Vogel, H.‐J. | Journal Article |
| 2019 | Integration of plasmonic nanostructures for micro-opto-electromechanical-systems
Heldt, G.; Weiss, A.; Helke, C.; Erben, J.; Kurth, S.; Meinig, M.; Martin, J.; Hiller, K.; Reuter, D.; Otto, T. | Conference Paper |
| 2019 | Nanostructured al SWG Reflectors on thin LP-Si3N4 membranes as (TiO2/SiO2)³ Bragg reflector alternative for VIS Fabry-Pérot Interferometers
Helke, C.; Hiller, K.; Seiler, J.; Erben, J.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Otto, T. | Conference Paper |
| 2019 | Parameter dependency of DNA origami immobilization at micro- and nano structured CF polymer surfaces on SiO2
Hann, J.; Helke, C.; Lakatos, M.; Heerwig, A.; Nestler, J.; Erben, J.; Reuter, D.; Mertig, M.; Otto, T. | Journal Article, Conference Paper |
| 2019 | Role of contacts in carbon nanotube giant piezoresistive sensors
Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Heldt, G.; Reuter, D.; Schuster, J.; Hermann, S. | Conference Paper |
| 2019 | Sensoric Micro and Nano Systems. Editorial
Zahn, D.R.T.; Schulz, S.E.; Hiller, K.; Wagner, C.; Reuter, D.; Otto, T. | Journal Article |
| 2018 | Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices
Heldt, Georg; Meinecke, Christoph; Steenhusen, Sönke; Korten, Till; Groß, Matteo; Domann, Gerhard; Lindberg, F.; Reuter, Danny; Diez, S.; Linke, H.; Schulz, Stefan E. | Conference Paper |
| 2018 | Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T. | Conference Paper |
| 2018 | Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau
Dittrich, C.; Forke, R.; Hiller, K.; Kreutziger, P.; Kuerschner, R.; Meinecke, C.; Reuter, D.; Weidlich, S.; Streit, P.; Hahn, S. | Conference Paper |
| 2018 | Fabrication and operation of protein-powered biocomputation using nanostructured networks
Meinecke, C.; Reuter, D.; Schulz, S.E.; Korten, T.; Heldt, G.; Diez, S. | Conference Paper |
| 2018 | Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas | Conference Paper |
| 2018 | Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization undefined
Haugwitz, T.; Erben, J.; Neumann, N.; Reuter, D.; Plettemeier, D. | Conference Paper |
| 2018 | Technologie zur Herstellung von nanostrukturierten Netzwerken für biomolekularbetriebene Computer
Meinecke, C.; Korten, T.; Heldt, G.; Reuter, D.; Diez, S.; Schulz, S.E. | Conference Paper |
| 2017 | 3D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2017 | Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: An example for Match 1:1-, eBeam-, and nanoimprint lithography
Helke, C.; Hiller, K.; Erben, J.W.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T. | Conference Paper |
| 2017 | Fabrication and operation of kinesin-1-powered biocomputation networks
Meinecke, C.; Korten, Till; Heldt, G.; Reuter, D.; Diez, Stefan | Abstract |
| 2017 | HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2017 | Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas | Conference Paper |
| 2017 | Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers
Helke, C.; Hiller, K.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T. | Conference Paper |
| 2017 | Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2017 | Robust vibration Sensor for condition monitoring in railway applications
Pleul, M.; Streit, P.; Polster, K.; Schulze, R.; Schuh, A.; Meinecke, C.; Reuter, D. | Conference Paper |
| 2017 | Scalable fabrication of carbon nanotube field-effect transistors (CNT-FETs) implementing wafer-level electron-beam lithography and dielectrophoretic CNT assembly
Blaudeck, T.; Hermann, S.; Hartmann, M.; Böttger, S.; Tittmann-Otto, J.; Heldt, G.; Reuter, D.; Schulz, S.E. | Abstract |
| 2017 | Wertvolle Seen in der Produktion. Mit Data Lakes Informationen bedarfsgerecht und einfach bereitstellen
Krauß, Jonathan; Heutmann, Timo; Quix, Christoph; Reuter, Dominic; Harmata, Simon; Schmitt, Robert | Journal Article |
| 2016 | Architecture of a web-based DICOM viewer showing segmentations and simulations
Ellerweg, R.; Reuter, D.; Weir, P. | Conference Paper |
| 2016 | Design and implementation of a web based medical image viewer architecture
Ellerweg, R.; Reuter, D.; Stärk, E.; Weir, P. | Journal Article, Conference Paper |
| 2016 | The development of a simulation tool for clinical use in image-guided percutaneous minimally invasive cancer treatment (MICT) - the GoSmart project
Voigt, P.; Fuchs, J.; Petersen, T.-O.; Jantschke, R.; Flanagan, R.; Weir, P.; Pollari, M.; Alhonnoro, T.; Payne, S.; Hall, S.; Fütterer, J.; Oostenbrugge, T. van; Stiegler, P.; Kalmar, P.; Fischer, S.; Zangos, S.; Voglreiter, P.; Ellerweg, R.; Reuter, D.; Stärk, E.; Kahn, T.; Kolesnik, M.; Moche, M. | Abstract |
| 2016 | Direct integration of field effect transistors as electro mechanical transducer for stress on beam structures
Haas, S.; Hafez, N.; Loebel, K.-U.; Koegel, E.; Ramsbeck, M.; Reuter, D.; Horstmann, J.T.; Gessner, T. | Conference Paper |
| 2016 | Stress analysis in semiconductor devices by Kelvin probe force microscopy
Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M. | Abstract |
| 2015 | 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T. | Conference Paper |
| 2015 | 3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2015 | Direct integrated strain sensors for robust temperature behaviour
Haas, S.; Schramm, M.; Reuter, D.; Loebel, K.-U.; Horstmann, J.T.; Gessner, T. | Conference Paper |
| 2015 | Go-Smart: Web-based computational modeling of minimally invasive cancer treatments
Weir, P.; Reuter, D.; Ellerweg, R.; Alhonnoro, T.; Pollari, M.; Voglreiter, P.; Mariappan, P.; Flanagan, R.; Park, C.S.; Payne, S.; Staerk, E.; Voigt, P.; Moche, M.; Kolesnik, M. | Conference Paper |
| 2015 | Micro welding of aluminum for post process electrode gap reduction using femtosecond laser
Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T. | Conference Paper |
| 2015 | Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen
Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T. | Conference Paper |
| 2015 | TSCuPc/Au hybrid trench devices. A comparative study of solution processed and thermally evaporated molecular channels
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Salvan, G.; Zahn, D.R.T. | Abstract |
| 2014 | AIM technology and devices - from basic research to industrial proven MEMS platform
Bertz, A.; Reuter, D.; Nowack, M. | Book Article |
| 2014 | Integration von MOS-Transistoren als Wandler für mechanische Spannungen
Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T. | Abstract |
| 2014 | Organic lateral trench devices fabricated by trench technology
Banerjee, S.; Richter, P.; Buelz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Zahn, D.R.T.; Salvan, G. | Abstract |
| 2013 | Direct integration of field effect transistors as electro mechanical transducer for stress
Haas, S.; Reuter, D.; Bertz, A.; Gessner, T.; Schramm, M.; Loebel, K.-U.; Horstmann, J.T. | Conference Paper |
| 2013 | Laterally stacked organic devices fabricated by trench technology
Reuter, D.; Banerjee, S.; Fronk, M.; Salvan, G.; Hiller, K.; Zahn, D.R.T.; Gessner, T. | Conference Paper |
| 2013 | Studies on the piezoresistive effect in MOS transistors for use in integrated MEMS sensors
Haas, S.; Schramm, M.; Loebel, K.-U.; Heinz, S.; Reuter, D.; Bertz, A.; Horstmann, J.T.; Gessner, T. | Conference Paper |
| 2012 | Device for storing power supply information of e.g. TV, supplies electrical charge carriers to nanoparticles selectively in regions in specific operating state
Reuter, Danny; Geßner, Thomas; Morschhauser, Andreas; Otto, Thomas; Martin, Jörg; Kießling, Torsten; Piasta, Doreen | Patent |
| 2012 | Micro arc welding for electrode gap reduction of high aspect ratio microstructures
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T. | Journal Article, Conference Paper |
| 2012 | Optimierung von Verarbeitungsprozessen und Erstellung einer Cloud-Architektur für ein Geoinformationssystem
Reuter, Dominik
: Krämer, Michel (Betreuer) | Master Thesis |
| 2012 | Out of plane capacitive transducer in air gap insulation microstructures technology for high precision monolithic 3-axis sensors
Reuter, D.; Nowack, M.; Shaporin, A.; Rockstroh, J.; Haas, S.; Bertz, A.; Mehner, J.; Gessner, T. | Conference Paper |
| 2012 | Untersuchungen zum piezoresistiven Effekt in MOS-Transistoren für die Anwendung in integrierten MEMS-Sensoren
Haas, S.; Schramm, M.; Heinz, S.; Loebel, K.-U.; Reuter, D.; Bertz, A.; Gessner, T.; Horstmann, J.T. | Conference Paper |
| 2011 | FEM simulation and its application in MEMS design
Jia, C.; Reuter, D.; Wen, Z.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2011 | Lokales Mikroschweißen als post-process Technologie zur permanenten Reduzierung des Elektrodenabstandes von HARMS
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T. | Conference Paper |
| 2011 | Novel post-process gap reduction technology of high aspect ratio microstructures utilizing micro welding
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuchler, M.; Bertz, A.; Gessner, T. | Conference Paper |
| 2010 | Aufbau einer Produktlinie für ein Geoinformationssystem und Bereitstellung unterstützender Werkzeuge
Reuter, Dominik
: Krämer, Michel (Betreuer) | Bachelor Thesis |
| 2010 | Gütebestimmung von MEMS-Strukturen im Zeitbereich mittels Laser Doppler Vibrometer und einem Logarithmierer
Voigt, S.; Tenholte, D.; Franke, D.; Reuter, D.; Hiller, K.; Gessner, T.; Mehner, J. | Conference Paper |
| 2010 | A method for the fabrication of extra-thin silicon substrates
Jia, C.; Hiller, K.; Wiemer, M.; Reuter, D.; Gessner, T. | Conference Paper |
| 2010 | A novel three-axis AIM vibration sensor for high accuracy condition monitoring
Nowack, M.; Reuter, D.; Bertz, A.; Kuechler, M.; Aurich, T.; Dittrich, C.; Gessner, T. | Conference Paper |
| 2010 | Quantized magnetic confinement in quantum wires
Tarasov, A.; Hugger, S.; Xu, H.; Cerchez, M.; Heinzel, T.; Zozoulenko, I.V.; Gasser-Szerer, U.; Reuter, D.; Wieck, A.D. | Journal Article |
| 2009 | A comparative study of freezing single cells and spheroids: Towards a new model system for optimizing freezing protocols for cryobanking of human tumours
Ehrhart, F.; Schulz, J.C.; Katsen-Globa, A.; Shirley, S.G.; Reuter, D.; Bach, F; Zimmermann, U.; Zimmermann, H. | Journal Article |
| 2009 | Hermetic thin film encapsulation of mechanical transducers for smart label applications
Reuter, D.; Nowack, M.; Rennau, M.; Bertz, A.; Wiemer, M.; Kriebel, F.; Gessner, T. | Conference Paper |
| 2009 | Integration of inertial MEMS sensors in active smart RFID labels for transport monitoring
Reuter, D.; Nowack, M.; Bertz, A.; Wiemer, M.; Semar, R.; Kriebel, F.; Hopp, K.-F.; Dittrich, S.; Thieme, T. | Conference Paper |
| 2009 | Integration von MEMS-Inertialsensoren in Smart RFID Label zur Transportüberwachung empfindlicher Güter
Nowack, M.; Reuter, D.; Bertz, A.; Gessner, T. | Conference Paper |
| 2009 | Smart systems integration by using micro- and nanotechnologies
Gessner, T.; Reuter, D. | Conference Paper |
| 2008 | Magnetic-barrier-induced conductance fluctuations in quantum wires
Hugger, S.; Xu, H.; Tarasov, A.; Cerchez, M.; Heinzel, T.; Zozoulenko, I.V.; Reuter, D.; Wieck, A.D. | Journal Article |
| 2008 | Thin film encapsulation technology for harms using sacrificial CF-polymer
Reuter, D.; Bertz, A.; Nowack, A.; Gessner, T. | Conference Paper, Journal Article |
| 2007 | Bulksiliziummikromechanik, Entwicklungstendenzen und Beispiele
Wiemer, M.; Frömel, J.; Hiller, K.; Reuter, D.; Jia, C. | Conference Paper |
| 2007 | Thin Film Encapsulation of High Aspect Ratio Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Gessner, T. | Conference Paper |
| 2007 | Thin Film Encapsulation of Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Werner, T.; Nowack, M.; Gessner, T. | Conference Paper |
| 2007 | Wafer-Level Active Testing of Capacitive Inertial Sensors
Nowack, M.; Reuter, D.; Rennau, M.; Bertz, A.; Gessner, T. | Conference Paper |
| 2006 | In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Dötzel, W.; Gessner, T. | Journal Article |
| 2005 | Efficient and flexible high aspect ratio micromachining for the fabrication of low-g-sensors
Bertz, A.; Lohmann, C.; Reuter, D.; Geßner, T. | Abstract |
| 2005 | Flexible Herstellung und Charakterisierung von Inertialsensoren basierend auf der AIM-Technologie
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T. | Conference Paper |
| 2005 | In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Buschnakowski, S.; Doetzel, W.; Gessner, T. | Conference Paper |
| 2005 | Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement
Billep, D.; Hiller, K.; Frömel, J.; Tenholte, D.; Reuter, D.; Dötzel, W.; Gessner, T. | Conference Paper |
| 2005 | Selective adhesive bonding with SU-8 for zero-level-packaging
Reuter, D.; Bertz, A.; Schwenzer, G.; Gessner, T. | Conference Paper |
| 2005 | A spectral vibration detection system based on tunable micromechanical resonators
Scheibner, D.; Mehner, J.; Reuter, D.; Gessner, T.; Dötzel, W. | Conference Paper, Journal Article |
| 2005 | Validierung der AIM Technologie: Darstellung der Leistungsfähigkeit anhand hergestellter Sensor- und Aktorstrukturen
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T. | Conference Paper |
| 2004 | Characterization and self-test of electrostatically tunable resonators for frequency selective vibration measurements
Scheibner, D.; Mehner, J.; Reuter, D.; Kotarsky, U.; Geßner, T.; Dötzel, W. | Conference Paper, Journal Article |
| 2004 | High aspect ratio micromachining using the AIM technology
Lohmann, C.; Reuter, D.; Bertz, A.; Geßner, T. | Book Article |
| 2004 | MEMS Metallization
Lohmann, C.; Gottfried, K.; Bertz, A.; Reuter, D.; Hiller, K.; Kuhn, M.; Gessner, T. | Conference Paper |
| 2003 | Mechanical reliability of MEMS fabricated by a special technology using standard silicon wafers
Lohmann, C.; Bertz, A.; Küchler, M.; Reuter, D.; Gessner, T. | Conference Paper |
| 2003 | Selektives Niedertemperaturbonden mit SU-8 für Wafer-Level-Verkappung von mikromechanischen Strukturen
Reuter, D.; Frömel, J.; Schwenzer, G.; Bertz, A.; Geßner, T. | Conference Paper |
| 1998 | 3D product presentation online
Dauner, Jens; Landauer, Jürgen; Stimpfig, Elke; Reuter, D. | Conference Paper |