Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Parameter dependency of DNA origami immobilization at micro- and nano structured CF polymer surfaces on SiO2
Hann, J.; Helke, C.; Lakatos, M.; Heerwig, A.; Nestler, J.; Erben, J.; Reuter, D.; Mertig, M.; Otto, T.
Journal Article, Conference Paper
2018Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices
Heldt, Georg; Meinecke, Christoph; Steenhusen, Sönke; Korten, Till; Groß, Matteo; Domann, Gerhard; Lindberg, F.; Reuter, Danny; Diez, S.; Linke, H.; Schulz, Stefan E.
Conference Paper
2018Characterisation of MOS transistors as an electromechanical transducer for stress
Hafez, M.; Haas, S.; Loebel, K.-U.; Reuter, D.; Ramsbeck, M.; Schramm, M.; Horstmann, J.-T.; Otto, T.
Journal Article
2018Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T.
Conference Paper
2018Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau
Dittrich, C.; Forke, R.; Hiller, K.; Kreutziger, P.; Kuerschner, R.; Meinecke, C.; Reuter, D.; Weidlich, S.; Streit, P.; Hahn, S.
Conference Paper
2018Fabrication and operation of protein-powered biocomputation using nanostructured networks
Meinecke, C.; Reuter, D.; Schulz, S.E.; Korten, T.; Heldt, G.; Diez, S.
Conference Paper
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Conference Paper
2018Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization undefined
Haugwitz, T.; Erben, J.; Neumann, N.; Reuter, D.; Plettemeier, D.
Conference Paper
20173D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T.
Journal Article
2017Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: An example for Match 1:1-, eBeam-, and nanoimprint lithography
Helke, C.; Hiller, K.; Erben, J.W.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Conference Paper
2017Fabrication and operation of kinesin-1-powered biocomputation networks
Meinecke, C.; Korten, Till; Heldt, G.; Reuter, D.; Diez, Stefan
Abstract
2017HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Journal Article
2017Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas
Conference Paper
2017Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers
Helke, C.; Hiller, K.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Conference Paper
2017Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Journal Article
2017Robust vibration Sensor for condition monitoring in railway applications
Pleul, M.; Streit, P.; Polster, K.; Schulze, R.; Schuh, A.; Meinecke, C.; Reuter, D.
Conference Paper
2017Scalable fabrication of carbon nanotube field-effect transistors (CNT-FETs) implementing wafer-level electron-beam lithography and dielectrophoretic CNT assembly
Blaudeck, T.; Hermann, S.; Hartmann, M.; Böttger, S.; Tittmann-Otto, J.; Heldt, G.; Reuter, D.; Schulz, S.E.
Abstract
2017Wertvolle Seen in der Produktion. Mit Data Lakes Informationen bedarfsgerecht und einfach bereitstellen
Krauß, Jonathan; Heutmann, Timo; Quix, Christoph; Reuter, Dominic; Harmata, Simon; Schmitt, Robert
Journal Article
2016Architecture of a web-based DICOM viewer showing segmentations and simulations
Ellerweg, R.; Reuter, D.; Weir, P.
Conference Paper
2016Design and implementation of a web based medical image viewer architecture
Ellerweg, R.; Reuter, D.; Stärk, E.; Weir, P.
Journal Article, Conference Paper
2016The development of a simulation tool for clinical use in image-guided percutaneous minimally invasive cancer treatment (MICT) - the GoSmart project
Voigt, P.; Fuchs, J.; Petersen, T.-O.; Jantschke, R.; Flanagan, R.; Weir, P.; Pollari, M.; Alhonnoro, T.; Payne, S.; Hall, S.; Fütterer, J.; Oostenbrugge, T. van; Stiegler, P.; Kalmar, P.; Fischer, S.; Zangos, S.; Voglreiter, P.; Ellerweg, R.; Reuter, D.; Stärk, E.; Kahn, T.; Kolesnik, M.; Moche, M.
Abstract
2016Direct integration of field effect transistors as electro mechanical transducer for stress on beam structures
Haas, S.; Hafez, N.; Loebel, K.-U.; Koegel, E.; Ramsbeck, M.; Reuter, D.; Horstmann, J.T.; Gessner, T.
Conference Paper
2016Stress analysis in semiconductor devices by Kelvin probe force microscopy
Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M.
Abstract
20153D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T.
Conference Paper
20153d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2015Direct integrated strain sensors for robust temperature behaviour
Haas, S.; Schramm, M.; Reuter, D.; Loebel, K.-U.; Horstmann, J.T.; Gessner, T.
Conference Paper
2015Go-Smart: Web-based computational modeling of minimally invasive cancer treatments
Weir, P.; Reuter, D.; Ellerweg, R.; Alhonnoro, T.; Pollari, M.; Voglreiter, P.; Mariappan, P.; Flanagan, R.; Park, C.S.; Payne, S.; Staerk, E.; Voigt, P.; Moche, M.; Kolesnik, M.
Conference Paper
2015Micro welding of aluminum for post process electrode gap reduction using femtosecond laser
Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T.
Conference Paper
2015Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen
Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T.
Conference Paper
2015TSCuPc/Au hybrid trench devices. A comparative study of solution processed and thermally evaporated molecular channels
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Salvan, G.; Zahn, D.R.T.
Abstract
2014AIM technology and devices - from basic research to industrial proven MEMS platform
Bertz, A.; Reuter, D.; Nowack, M.
Book Article
2014Integration von MOS-Transistoren als Wandler für mechanische Spannungen
Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Abstract
2014Organic lateral trench devices fabricated by trench technology
Banerjee, S.; Richter, P.; Buelz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Zahn, D.R.T.; Salvan, G.
Abstract
2013Direct integration of field effect transistors as electro mechanical transducer for stress
Haas, S.; Reuter, D.; Bertz, A.; Gessner, T.; Schramm, M.; Loebel, K.-U.; Horstmann, J.T.
Conference Paper
2013Laterally stacked organic devices fabricated by trench technology
Reuter, D.; Banerjee, S.; Fronk, M.; Salvan, G.; Hiller, K.; Zahn, D.R.T.; Gessner, T.
Conference Paper
2013Studies on the piezoresistive effect in MOS transistors for use in integrated MEMS sensors
Haas, S.; Schramm, M.; Loebel, K.-U.; Heinz, S.; Reuter, D.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Conference Paper
2012Device for storing power supply information of e.g. TV, supplies electrical charge carriers to nanoparticles selectively in regions in specific operating state
Reuter, Danny; Geßner, Thomas; Morschhauser, Andreas; Otto, Thomas; Martin, Jörg; Kießling, Torsten; Piasta, Doreen
Patent
2012Micro arc welding for electrode gap reduction of high aspect ratio microstructures
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T.
Journal Article, Conference Paper
2012Optimierung von Verarbeitungsprozessen und Erstellung einer Cloud-Architektur für ein Geoinformationssystem
Reuter, Dominik
: Krämer, Michel (Betreuer)
Master Thesis
2012Out of plane capacitive transducer in air gap insulation microstructures technology for high precision monolithic 3-axis sensors
Reuter, D.; Nowack, M.; Shaporin, A.; Rockstroh, J.; Haas, S.; Bertz, A.; Mehner, J.; Gessner, T.
Conference Paper
2012Untersuchungen zum piezoresistiven Effekt in MOS-Transistoren für die Anwendung in integrierten MEMS-Sensoren
Haas, S.; Schramm, M.; Heinz, S.; Loebel, K.-U.; Reuter, D.; Bertz, A.; Gessner, T.; Horstmann, J.T.
Conference Paper
2011FEM simulation and its application in MEMS design
Jia, C.; Reuter, D.; Wen, Z.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2011Lokales Mikroschweißen als post-process Technologie zur permanenten Reduzierung des Elektrodenabstandes von HARMS
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T.
Conference Paper
2011Novel post-process gap reduction technology of high aspect ratio microstructures utilizing micro welding
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuchler, M.; Bertz, A.; Gessner, T.
Conference Paper
2010Aufbau einer Produktlinie für ein Geoinformationssystem und Bereitstellung unterstützender Werkzeuge
Reuter, Dominik
: Krämer, Michel (Betreuer)
Bachelor Thesis
2010Gütebestimmung von MEMS-Strukturen im Zeitbereich mittels Laser Doppler Vibrometer und einem Logarithmierer
Voigt, S.; Tenholte, D.; Franke, D.; Reuter, D.; Hiller, K.; Gessner, T.; Mehner, J.
Conference Paper
2010A method for the fabrication of extra-thin silicon substrates
Jia, C.; Hiller, K.; Wiemer, M.; Reuter, D.; Gessner, T.
Conference Paper
2010A novel three-axis AIM vibration sensor for high accuracy condition monitoring
Nowack, M.; Reuter, D.; Bertz, A.; Kuechler, M.; Aurich, T.; Dittrich, C.; Gessner, T.
Conference Paper
2010Quantized magnetic confinement in quantum wires
Tarasov, A.; Hugger, S.; Xu, H.; Cerchez, M.; Heinzel, T.; Zozoulenko, I.V.; Gasser-Szerer, U.; Reuter, D.; Wieck, A.D.
Journal Article
2009A comparative study of freezing single cells and spheroids: Towards a new model system for optimizing freezing protocols for cryobanking of human tumours
Ehrhart, F.; Schulz, J.C.; Katsen-Globa, A.; Shirley, S.G.; Reuter, D.; Bach, F; Zimmermann, U.; Zimmermann, H.
Journal Article
2009Hermetic thin film encapsulation of mechanical transducers for smart label applications
Reuter, D.; Nowack, M.; Rennau, M.; Bertz, A.; Wiemer, M.; Kriebel, F.; Gessner, T.
Conference Paper
2009Integration of inertial MEMS sensors in active smart RFID labels for transport monitoring
Reuter, D.; Nowack, M.; Bertz, A.; Wiemer, M.; Semar, R.; Kriebel, F.; Hopp, K.-F.; Dittrich, S.; Thieme, T.
Conference Paper
2009Integration von MEMS-Inertialsensoren in Smart RFID Label zur Transportüberwachung empfindlicher Güter
Nowack, M.; Reuter, D.; Bertz, A.; Gessner, T.
Conference Paper
2009Smart systems integration by using micro- and nanotechnologies
Gessner, T.; Reuter, D.
Conference Paper
2008Magnetic-barrier-induced conductance fluctuations in quantum wires
Hugger, S.; Xu, H.; Tarasov, A.; Cerchez, M.; Heinzel, T.; Zozoulenko, I.V.; Reuter, D.; Wieck, A.D.
Journal Article
2008Thin film encapsulation technology for harms using sacrificial CF-polymer
Reuter, D.; Bertz, A.; Nowack, A.; Gessner, T.
Conference Paper, Journal Article
2007Bulksiliziummikromechanik, Entwicklungstendenzen und Beispiele
Wiemer, M; Frömel, J.; Hiller, K.; Reuter, D.; Jia, C.
Conference Paper
2007Thin Film Encapsulation of High Aspect Ratio Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Gessner, T.
Conference Paper
2007Thin Film Encapsulation of Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Werner, T.; Nowack, M.; Gessner, T.
Conference Paper
2007Wafer-Level Active Testing of Capacitive Inertial Sensors
Nowack, M.; Reuter, D.; Rennau, M.; Bertz, A.; Gessner, T.
Conference Paper
2006In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Dötzel, W.; Gessner, T.
Journal Article
2005Efficient and flexible high aspect ratio micromachining for the fabrication of low-g-sensors
Bertz, A.; Lohmann, C.; Reuter, D.; Geßner, T.
Abstract
2005Flexible Herstellung und Charakterisierung von Inertialsensoren basierend auf der AIM-Technologie
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T.
Conference Paper
2005In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Buschnakowski, S.; Doetzel, W.; Gessner, T.
Conference Paper
2005Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement
Billep, D.; Hiller, K.; Frömel, J.; Tenholte, D.; Reuter, D.; Dötzel, W.; Gessner, T.
Conference Paper
2005Selective adhesive bonding with SU-8 for zero-level-packaging
Reuter, D.; Bertz, A.; Schwenzer, G.; Gessner, T.
Conference Paper
2005A spectral vibration detection system based on tunable micromechanical resonators
Scheibner, D.; Mehner, J.; Reuter, D.; Gessner, T.; Dötzel, W.
Conference Paper, Journal Article
2005Validierung der AIM Technologie: Darstellung der Leistungsfähigkeit anhand hergestellter Sensor- und Aktorstrukturen
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T.
Conference Paper
2004Characterization and self-test of electrostatically tunable resonators for frequency selective vibration measurements
Scheibner, D.; Mehner, J.; Reuter, D.; Kotarsky, U.; Geßner, T.; Dötzel, W.
Conference Paper, Journal Article
2004High aspect ratio micromachining using the AIM technology
Lohmann, C.; Reuter, D.; Bertz, A.; Geßner, T.
Book Article
2004MEMS Metallization
Lohmann, C.; Gottfried, K.; Bertz, A.; Reuter, D.; Hiller, K.; Kuhn, M.; Gessner, T.
Conference Paper
2003Mechanical reliability of MEMS fabricated by a special technology using standard silicon wafers
Lohmann, C.; Bertz, A.; Küchler, M.; Reuter, D.; Gessner, T.
Conference Paper
2003Selektives Niedertemperaturbonden mit SU-8 für Wafer-Level-Verkappung von mikromechanischen Strukturen
Reuter, D.; Frömel, J.; Schwenzer, G.; Bertz, A.; Geßner, T.
Conference Paper
19983D product presentation online
Dauner, Jens; Landauer, Jürgen; Stimpfig, Elke; Reuter, D.
Conference Paper