Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Journal Article
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2015Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials
Ndip, I.; Oz, A.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2014A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures
Curran, B.; Ndip, I.; Engin, E.; Bauer, J.; Pötter, H.; Lang, K.-D.; Reichl, H.
Journal Article
2014On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach
Ndip, I.; Löbbicke, K.; Tschoban, C.; Ranzinger, C.; Richlowski, K.; Contag, A.; Reichl, H.; Lang, K.-D.; Henke, H.
Conference Paper
2013Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications
Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.
Conference Paper, Journal Article
2013Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs
Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2013Modeling and minimizing the inductance of bond wire interconnects
Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Conference Paper
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Conference Paper
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Journal Article
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Loss modeling in non-ideal transmission lines for optimal signal integrity
Curran, B.
: Reichl, H.
Dissertation
2012Modelling the shape, length and radiation characteristics of bond wire antennas
Ndip, I.; Oz, A.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2012Systematic design and optimization of bond wire antennas using the M3-approach
Ndip, I.; Guttowski, S.; Reichl, H.; Lang, K.D.
Conference Paper
2012A Thermal Model for Non-linear Distortion in Printed Circuit Lines for Condition Monitoring of Electronics
Krueger, Michael; Middendorf, Andreas; Nissen, Nils F.; Reichl, Herbert; Lang, Klaus-Dieter
Conference Paper
2011Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Conference Paper
2011Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications
Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.
Conference Paper
2011Efficient integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.
: Reichl, H. (Prüfer)
Dissertation
2011Effiziente Verifikation der Robustheit komplexer integrierter Schaltungen
Morgenstern, H.
: Reichl, H. (Prüfer)
Dissertation
2011Electromigration in electroplated gold micro contacts
Kleff, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Conference Paper
2011Entwicklung und Design von selbstatmenden Mikrobrennstoffzellen fur autarke Sensoren mit pulsformiger Last
Weiland, M.; Reichl, H.; Wagner, S.; Hahn, R.
Conference Paper
2011High-frequency modeling of TSVs for 3-D chip integration and silicon interposers considering skin-effect, dielectric quasi-TEM and slow-wave modes
Ndip, I.; Curran, B.; Lobbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2011The impact of moisture absorption on the electrical characteristics of organic dielectric materials
Curran, B.; Ndip, I.; Bauer, J.; Guttowski, S.; Lang, K.D.; Reichl, H.
Conference Paper
2011Influences of current collector foils with different opening ratios in passive polymer electrolyte membrane fuel cells
Krumbholz, S.; Kaiser, J.; Weiland, M.; Hahn, R.; Reichl, H.
Journal Article
2011Integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.; Fotheringham, G.; Ndip, I.; Engin, A.E.; Guttowski, S.; Reichl, H.; Lang, K.D.
Journal Article
2011Interface formation in the US-wedge/wedge-bond process of AlSi1/CuNiAu contacts
Geissler, U.; Funck, J.; Schneider-Ramelow, M.; Engelmann, H.-J.; Rooch, I.; Müller, W.H.; Reichl, H.
Journal Article
2011Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2011Prospects and limits in wafer-level-packaging of image sensors
Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D.
Conference Paper
2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.
Journal Article
2011Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds
Schreier-Alt, T.; Rehme, F.; Ansorge, F.; Reichl, H.
Journal Article
20103-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.
Conference Paper
2010An adapted filament model for accurate modeling of printed coplanar lines with significant surface roughness and proximity effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.
Journal Article
2010Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H.
Conference Paper
2010Analysis of the transient characteristics of a passive micro fuel cell for sensor applications
Weiland, M.; Reichl, H.; Wagner, S.
Conference Paper
2010Analytic model verification of the interfacial friction power in Al us w/w bonding on Au pads
Gaul, H.; Schneider-Ramelow, M.; Reichl, H.
Journal Article
2010Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Boettcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2010A comparison of thin film polymers for wafer level packaging
Töpper, M.; Fischer, T.; Baumgartner, T.; Reichl, H.
Conference Paper
2010Contactless handling and precision positioning of smallest components for assembly of microelectronics
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Jung, E.; Koch, M.; Mollath, G.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2010Contactless material deposition by jetting for heterogeneous system integration
Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T.
Conference Paper
2010Elektrisches oder elektronisches Bauelement und Verfahren zum Herstellen eines Anschlusses
Wolf, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Patent
2010Embedding of electronic and system in package using added manufacturing technologies
Ansorge, F.; Stigler, T.; Heumann, K.; Ifland, D.; Reichl, H.
Conference Paper
2010Embedding of electronic and system in package using generative processes
Ansorge, F.; Heumann, K.; Ifland, D.; Reichl, H.
Conference Paper
2010Employing solder joints of concave shape for monitoring electromigration independently of material interfaces
Jaeschke, J.; Müller, W.H.; Nissen, N.; Reichl, H.
Conference Paper
2010Equivalent circuit modeling of signal vias considering their return current paths
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Tschoban, C.; Bierwirth, M.; Guttowski, S.; Reichl, H.
Conference Paper
2010Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
Zoschke, K.; Wegner, M.; Wilke, M.; Jürgensen, N.; Lopper, C.; Kuna, I.; Glaw, V.; Röder, J.; Wünsch, O.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2010Future perspectives: From packaging to system integration
Wolf, M.J.; Reichl, H.; Lang, K.-D.
Book Article
2010Generative Herstelltechnologien im Mikro- und Nanobereich zu Aufbau und Kontaktierung von Mikro-Mechatronischen Systemen
Ansorge, F.; Stigler, T.; Heumann, K.; Ifland, D.; Reichl, H.
Conference Paper
2010Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010Heat-removal performance scaling of interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Cesar, W.; Leblebici, Y.; Wunderle, B.; Reichl, H.
Conference Paper
2010Hermeticity of eutectic bond layers for sensor packages on wafer-level
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Conference Paper
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2010Intermodulation Distortion as Indicator for Interconnect Degradation
Krüger, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010Investigation of the solder joint fatigue life in combined vibration and thermal cycling tests
Eckert, T.; Krüger, M.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Conference Paper
2010Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U.
Conference Paper
2010Light weight 12W PEM fuel cell system for UAVs
Hahn, R.; Wagner, S.; Krumbholz, S.; Blechert, M.; Höppner, K.; Stolle, T.; Reichl, H.
Conference Paper
2010Managing the return-currents of signal vias in organic and silicon substrates
Ndip, I.; Löbicke, K.; Bierwirth, M.; Tschoban, C.; Curran, B.; Erxleben, R.; Ohnimus, F.; Maaß, U.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010A methodology for combined modeling of skin, proximity, edge, and surface roughness effects
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Journal Article
2010Miniaturized implantable wireless sensor system for realtime measurement of well-being of fishes
Brockmann, C.; Großer, V.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2010Modeling and analysis of coplanar bonding wires for high-speed applications
Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.
Conference Paper
2010Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2010Modeling, quantification, and reduction of the impact of uncontrolled return currents of vias transiting multilayered packages and boards
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Bierwirth, M.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2010Modellierung des Energie- und Ressourcenbedarfs von IKT
Stobbe, L.; Schischke, K.; Nissen, N.F.; Middendorf, A.; Reichl, H.
Conference Paper
2010Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H.
Journal Article, Conference Paper
2010Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO2 - property prediction in microelectronic packaging
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.; Reichl, H.
Conference Paper
2010Nano- und micro sized filler particles for improved humidity resistance of encapsulants
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.-F.; Koch, M.; Thomas, T.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2010Nano-porous gold interconnect
Oppermann, H.; Dietrich, L.; Klein, M.; Wunderle, B.; Reichl, H.
Conference Paper
2010Eine neue planare Funktionsstruktur zur Entkopplung hochfrequenter Störungen auf Schaltungsträgern
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010New packaging and interconnect technologies for ultra thin chips
Kallmayer, C.; Aschenbrenner, R.; Haberland, J.; Reichl, H.
Conference Paper
2010Next generation system in a package manufacturing
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Conference Paper
2010Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Conference Paper, Journal Article
2010Novel test structures for hermeticity testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Abstract
2010Novel test structures for hermetictiy testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Conference Paper
2010Precision material deposition for SiP manufacturing using jetting processes
Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T.
Conference Paper
2010Reliability study of the stud bump bonding flip chip technology on molded interconnect devices
Dressler, M.; Wunderle, B.; Becker, K.-F.; Reichl, H.
Conference Paper
2010RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Journal Article
2010Silicon interposer for heterogeneous integration
Wolf, M.J.; Zoschke, K.; Wieland, R.; Klein, M.; Lang, K.-D.; Reichl, H.
Conference Paper
2010Simulation, measurement and analysis of electromagnetic band gap structures for noise suppression in electronic systems
Ndip, I.; Bierwirth, M.; Tschoban, C.; Maab, U.; Erxleben, R.; Guttowski, S.; Reichl, H.
Conference Paper
2010A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maaß, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H.
Conference Paper
2010Solidification and wetting behaviour of SnAgCu soldier alloyed by reactive metal organic flux
Zerrer, P.; Fix, A.; Hutter, M.; Reichl, H.
Journal Article
2010Study on the dynamic behavior of Zn-based hydrogen generating cells as fuel storage for a PEM micro fuel cell system
Weiland, M.; Krumbholz, S.; Wagner, S.; Reichl, H.
Journal Article
2010A system-oriented approach for modeling energy harvesting devices in wireless sensor-modules
Kravcenko, E.; Niedermayer, M.; Guttowski, S.; Nissen, N.F.; Benecke, S.; Middendorf, A.; Reichl, H.
Conference Paper
2010Eine systematische Entwurfsmethode zur Sicherstellung der elektromagnetischen Zuverlässigkeit in Mikrosystemen
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010TSV modeling considering signal integrity issues
Ndip, I.; Curran, B.; Löbbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2010The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor
Gaul, H.; Shah, A.; Mayer, M.; Zhou, Y.; Schneider-Ramelow, M.; Reichl, H.
Journal Article
2010Ultrathin 3D ACA flipchip-in-flex technology
Haberland, J.; Becker, M.; Lutke-Notarp, D.; Kallmayer, Ch.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2010Wafer level processing of integrated passive components using polyimide or polybenzoxazole/copper multilayer technology
Zoschke, K.; Fischer, T.; Töpper, M.; Samulewicz, K.; Wünsch, O.; Röder, J.; Lutz, M.; Ehrmann, O.; Reichl, H.
Journal Article
2010Water diffusion in micro- and nano-particle filled encapsulants
Braun, T.; Georgi, L.; Bauer, J.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2010Zerstörungsfreie Beobachtung von Rissen in Leiterplattendurchkontaktierungen - Quantisierung der Risslänge mittels Impulsthermographie und FEM-Simulation
Schacht, R.; Abo Ras, M.; May, D.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
20093-D Thin Chip Integration Technology - from Technology Development to Application
Fritzsch, T.; Mrossko, R.; Baumgartner, T.; Toepper, M.; Klein, M.; Wolf, J.; Wunderle, B.; Reichl, H.
Conference Paper
20093D image sensor SiP with TSV silicon interposer
Limansyah, I.; Wolf, J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Klein, M.; Oppermann, H.; Nebrich, L.; Heinig, A.; Pechlaner, A.; Reichl, H.; Weber, W.
Conference Paper
20093D integration of image sensor SiP using TSV silicon interposer
Wolf, M.J.; Zoschke, K.; Klumpp, A.; Wieland, R.; Klein, M.; Nebrich, L.; Heinig, A.; Limansyah, I.; Weber, W.; Ehrmann, O.; Reichl, H.
Conference Paper
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Advancements in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Patzelt, R.; Ostmann, A.; Reichl, H.
Conference Paper
2009Aktive RFID
Pötter, H.; Hampicke, M.; Nachsel, R.; Hoherz, C.; Lang, K.-D.; Reichl, H.
Journal Article
2009Analysis of the friction processes in ultrasonic wedge/wedge-bonding
Gaul, H.; Schneider-Ramelow, M.; Reichl, H.
Journal Article
2009Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections
Dressler, M.; Becker, K.-F.; Wunderle, B.; Auersperg, J.; Reichl, H.
Conference Paper, Journal Article
2009BCB with nano-filled BaSrTiO3 for thin film capacitors
Töpper, M.; Fischer, T.; Zoschke, K.; Zang, M.; Teipel, U.; Fehrenbacher, U.; Reichl, H.
Conference Paper
2009Biocompatible lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Bocchi, M.; Faenza, A.; Guerrieri, R.; Gambari, R.; Becker, K.-F.; Jung, E.; Ostmann, A.; Koch, M.; Kahle, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Breakthroughs in chip embedding technologies leading to the emergence of further miniaturised system-in-packages
Manessis, D.; Böttcher, L.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2009Chip embedding technology - New technological challenges for a reliable System-in-Package realization
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2009The collaboration between Int J Life Cycle Assess and J LCA Jpn
Matsuno, Y.; Kondo, Y.; Mishima, N.; Shibaoke, N.; Yashiro, T.; Yamamoto, Y.; Morioka, T.; Nissen, N.F.; Schischke, K.; Stobbe, L.; Reichl, H.; Kurihara, S.; Nakano, K.; Hirao, M.; Kai, H.; Ishibashi, Y.; Shimase, H.; Kamohara, S.; Takemasa, T.; Higo, M.; Dowaki, K.; Genchi, Y.; Motoshita, M.; Itsubo, N.; Inaba, A.; Torii, M.; Narita, N.; Ogawa, K.; Hondo, H.; Hirayama, Y.; Nakajima, K.; Yamada, S.; Fukuhara, I.
Journal Article
2009A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Comparison of electromagnetic field distribution in vicinity of patch and slot antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Design and integration of a planar EBG for UWB applications
Ndip, I.; Bierwirth, M.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Design study of the bump on flexible lead by FEA for wafer level packaging
Eidner, I.; Wunderle, B.; Pan, K.L.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Hahn, R.; Marquardt, K.; Blechert, M.; Lehmann, M.; Töpper, M.; Wilke, M.; Semionyk, P.; Reichl, H.
Conference Paper
2009Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Marquardt, K.; Hahn, R.; Blechert, M.; Lehmann, M.; Töpper, M.; Reichl, H.
Conference Paper, Journal Article
2009Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints
Hutter, M.; Schmidt, R.; Zerrer, P.; Rauschenbach, S.; Wittke, K.; Scheel, W.; Reichl, H.
Conference Paper
2009Electrical design and characterization of elevated antennas at PCB-level
Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Electrical modeling and analysis of the impact of slits on microstrip lines in thin film polymer layers
Ndip, I.; Töpper, M.; Becker, K.-F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Embedded Chip Packages Technology and Applications
Bttcher L.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2009Embedding technologies for an automotive radar system
Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Conference Paper
2009Embedding technology development for a 77 GHz automotive radar system
Becker, Karl-Friedrich; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Conference Paper
2009Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes
Reichl, H.; Ndip, I.
Conference Paper
2009Environmental Comparison of Energy Scavenging Technologies for Micro System Applications
Benecke, S.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Environmental comparison of energy scavenging technologies for self-sufficient micro system applications
Benecke, S.; Reichl, H.; Nissen, N.F.
Conference Paper
2009Evaluating the effects of electromigration by using adjustable solder joints of concave shape
Jaeschke, J.; Kleff, J.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Failure modeling of ACA-glued flip-chip on flex assemblies
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper, Journal Article
2009Flip chips on PCB - from single chip encapsulation to systems in package
Schreier-Alt, T.; Braun, T.; Becker, K.-F.; Rebholz, C.; Wunderle, B.; Reichl, H.
Journal Article
2009Freshscan - microsystems based spectroscopic measurements for logistic chain monitoring in the meat industry
Thomasius, R.; Jordan, G.; Kim, J.-U.; Schröder, H.; Reichl, H.
Conference Paper
2009FreshScan - Portables optisches Messsystem zur Überwachung des Frischegrades von Fleisch
Thomasius, R.; Kim, J.-U.; Nestler, V.; Reichl, H.; Jordan, G.; Schröder, H.; Lang, K.-D.; Maiwald, M.; Sumpf, B.; Schmidt, H.; Kronfeldt, H.-D.; Hengl, C.; Wulf, J.
Conference Paper
2009Functional Unit and Method aor the Production thereof
Wolf, J.; Zoschke, K.; Fischer, T.; Topper, M.; Reichl, H.
Patent
2009Hardening and Softening in AlSi1 Bond Contacts During Ultrasonic Wire Bonding
Geißler, U.; Schneider-Ramelow, M.; Reichl, H.
Journal Article
2009Heterogeneous Integration
Reichl, H.; Aschenbrenner, R.; Töpper, M.; Pötter, H.
Book Article
2009Hotspot-optimized interlayer cooling in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Reichl, H.
Conference Paper
2009The impacts of dimensions and return current path geometry on coupling in single ended through silicon vias
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology
Dieckerhoff, S.; Wernicke, T.; Kallmayer, C.; Guttowski, S.; Reichl, H.
Journal Article
2009Influence of structure dimensions on self-breathing micro fuel cells
Wagner, S.; Krumbholz, S.; Hahn, R.; Reichl, H.
Conference Paper, Journal Article
2009Innovations Based on Hetero System Integration
Reichl, H.; Wolf, J.; Lang, K.-D.
Journal Article
2009Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
Manessis, D.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Innovative package realization by Chip Embedding Technologies
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.; Reichl, H.
Conference Paper
2009Integration of reliability and environmental aspects in early design stages of mechatronics
Middendorf, A.; Deyter, S.; Gausemeier, J.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Intelligente Sensoren: Trends und Technologien
Pötter, H.; Hampicke, M.; Schmitz, S.; Lang, K.-D.; Reichl, H.
Journal Article
2009Interlayer cooling potential in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Journal Article, Conference Paper
2009Lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Jung, E.; Becker, K.-F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article, Conference Paper
2009Low cost wafer-level 3-D integration without TSV
Töpper, M.; Baumgartner, T.; Klein, M.; Fritzsch, T.; Roeder, J.; Lutz, M.; Suchodoletz, M. von; Oppermann, H.; Reichl, H.
Conference Paper
2009Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines
Krüger, M.; Middendorf, A.; Ndip, I.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Methodology and utilization of simplified eco-assessments for policy making
Stobbe, L.; Nissen, N.F.; Schischke, K.; Reichl, H.
Conference Paper
2009Microtechnology platform for cell cell interaction detection
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.
Conference Paper
2009Mit Komponenten zu miniaturisierten Systemen
Pötter, H.; Hampicke, M.; Lang, K.-D.; Reichl, H.
Book Article
2009Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed-Signal Systems
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and analysis of electromagnetic field distribution in vicinity of patch antennas at millimeter-wave frequencies
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and comparison of patch antenna configurations for 77 GHz radar applications
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and Measurement of Coplanar Transmission Lines with Significant Proximity and Surface Roughness Effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.
Conference Paper
2009Modeling and quantification of conventional and Coax-TSVs for RF applications
Ndip, I.; Curran, B.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling Solder Joint Fatigue in Combined Environmental Reliability Tests with Concurrent Vibration and Thermal Cycling
Eckert, T.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Moderne Packagingtechnologien - unverzichtbar für eine hochwertige Systemintegration
Pötter, H.; Hampicke, M.; Lang, K.-D.; Reichl, H.
Journal Article
2009Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H.
Conference Paper
2009Non-destructive electrical measurement of interconnect degradation in early states by the use of RF signals
Krüger, M.; Eckert, T.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Michel, B.; Reichl, H.
Journal Article
2009A novel Interconnected Patch-Ring (IPR) structure for noise isolation
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the integration of a 2.4 GHz ISM band antenna in proximity to transmission lines
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the quantification and improvement of the models for surface roughness
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the quantification of the state-of-the-art models for skin-effect in conductors, including those with non-rectangular cross-sections
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Optimierung von Andruckstrukturen für Mikrobrennstoffzellen in Leichtbauweise
Wagner, S.; Krumbholz, S.; Andre, F.; Anders, H.; Hahn, R.; Reichl, H.
Conference Paper
2009Parameterization of bent coils on curved flexible surface substrates for RFID applications
Fotheringham, G.; Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Photonic system-in-package technologies using thin glass substrates
Brusberg, L.; Schröder, H.; Töpper, M.; Reichl, H.
Conference Paper
2009PICSiP: New system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems
Tekin, T.; Töpper, M.; Reichl, H.
Conference Paper
2009Plastic packaging for high temperature applications
Braun, T.; Becker, K.-F.; Bauer, J.; Koch, M.; Bader, V.; Kahle, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Realisation of embedded-chip QFN packages - technological challenges and achievements
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2009Reliability study of the bump on flexible lead for wafer level packaging
Kolb, I.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2009RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Book Article
2009SENESCOPE: A design tool for cost optimization of wireless sensor nodes
Niedermayer, M.; Richter, C.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2009Sensitivity Analysis of Technological Fabrication Tolerances on the Lifetime of Flip-Chip Solder Joints
Eckert, T.; Kornelius, T.; Bochow-Ness, O.; Müller, W.H.; Reichl, H.
Conference Paper
2009A Solder Joint Fatigue Life Model for Combined Vibration and Temperature Environments
Eckert, T.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Stretchable circuit board technology and application
Vieroth, R.; Löher, T.; Seckel, M.; Dils, C.; Kallmayer, C.; Ostmann, A.; Reichl, H.
Conference Paper
2009Stretchable circuit board technology in textile applications
Ostmann, A.; Vieroth, R.; Seckel, M.; Löher, T.; Reichl, H.
Conference Paper
2009Stretchable electronic systems: Realization and applications
Löher, T.; Seckel, M.; Vieroth, R.; Dils, C.; Kallmayer, C.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Study on shielding effectiveness of mushroom-type electromagnetic bandgap structures in close proximity to patch antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H.
Journal Article
2009Thin glass based packaging technologies for optoelectronic modules
Brusberg, L.; Schröder, H.; Töpper, M.; Arndt-Staufenbiel, N.; Röder, J.; Lutz, M.; Reichl, H.
Conference Paper
2009Ultrasonic friction power during Al wire wedge-wedge bonding
Shah, A.; Gaul, H.; Schneider-Ramelow, M.; Reichl, H.; Mayer, M.; Zhou, Y.
Journal Article
2009Verbindungsstruktur und Verfahren zur Herstellung einer Verbindungsstruktur
Reichl, H.; Wolf, J.
Patent
20083D packaging for image sensor application
Wolf, M.J.; Klumpp, A.; Wieland, R.; Zoschke, K.; Klein, M.; Nebrich, L.; Heinig, A.; Weber, W.; Limansyah, I.; Ramm, P.; Reichl, H.
Conference Paper
20083D wafer level system integration - requirements & technologies
Klumpp, A.; Wolf, M.J.; Ramm, P.; Wunderle, B.; Reichl, H.
Conference Paper
2008Application opportunities of energy harvesting principles into "non-electric" output forms for small electronic systems
Tsunezawa, K.; Oberender, C.; Reichl, H.
Conference Paper
2008Automatisierter Entwurf von vertikal integrierten System-In-Package-Lösungen
Richter, C.; Guttowski, S.; Reichl, H.
Journal Article
2008The Basque Approach to EuP Compliance - a Reference for SMEs and Regional Policy Makers
Ruiz, N.; Schischke, K.; Reichl, H.
Conference Paper
2008Berührungslose Bestückverfahren - Neue Ansätze für die AVT von Mikrosystemen
Becker, K.-F.; Fiedler, S.; Bauer, J.; Kolesnik, I.; Jung, E.; Mollath, G.; Schreck, G.; Reichl, H.
Journal Article
2008Bump on flexible lead for wafer level packaging
Eidner, I.; Buschick, K.; Dietrich, L.; Pan, K.L.; Minkus, M.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2008Condition indicators for reliability monitoring of microsystems
Eckert, T.; Bochow-Ness, O.; Middendorf, A.; Tetzner, K.; Reichl, H.
Conference Paper
2008Condition monitoring of microsystems supporting sustainability
Bochow-Neß, O.; Eckert, T.; Nissen, N.F.; Jaeschke, J.; Middendorf, A.; Reichl, H.
Conference Paper
2008Contact-less handling of metal sub-micron and nanowires for microelectronic packaging applications
Fiedler, S.; Zwanzig, M.; Boettcher, M.; Jaeger, M.S.; Fuhr, G.R.; Reichl, H.
Conference Paper
2008Contactless component handling on PCB using EWOD principles
Braun, T.; Becker, K.-F.; Koch, M.; Lienemann, J.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Design and Analysis of a Bent Antenna-coil for a HF RFID Transponder
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H.
Conference Paper
2008Development of micro fuel cells with organic substrates and electronics manufacturing technologies
Hahn, R.; Wagner, S.; Krumbholz, S.; Reichl, H.
Conference Paper
2008Eco-design, energy efficiency and cleaner production strategies: SME business cases from Thailand and Malaysia
Schischke, K.; Soon, C.; Ahmad, M.; Nee, T.; Wan Hussein, W.M.; Ramasamy, R.; Reichl, H. et al.
Conference Paper
2008Eco-efficiency for smart microsystems
Reichl, H.; Middendorf, A.; Nissen, N.F.; Stobbe, L.
Conference Paper
2008An efficient and broadband slot antenna for 60 GHz Wireless applications
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008Electronics Goes Green 2008+. Merging Technology and Sustainable Development. Proceedings
: Reichl, H.; Nissen, N.F.; Müller, J.; Deubzer, O.
Conference Proceedings
2008Embedded chip packages - technology and application
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2008Embedding of chips for system in package realization - technology and applications
Boettcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2008Energy efficiency meets ecodesign - technology impacts of the European EuP directive
Schischke, K.; Nissen, N.F.; Stobbe, L.; Reichl, H.
Conference Paper
2008Evaluation of innovative nano-coated stencils in ultra-fine-pitch flip chip bumping processes
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Forced Convection Interlay Cooling in Vertically Integrated Packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Conference Paper
2008Funktionseinheit und Verfahren zu deren Herstellung
Wolf, J.; Zoschke, K.; Fischer, T.; Toepper, M.; Reichl, H.
Patent
2008Global responsibility for green electronics and ICT
Griese, H.; Reichl, H.; Stobbe, L.
Conference Paper
2008Heterogeneous System Integration - A Key Technology for Future Microelectronic Applications
Reichl, H.; Wolf, M.J.
Conference Paper
2008High aspect ratio TSV copper filling with different seed layers
Wolf, M.J.; Dretschkow, T.; Wunderle, B.; Jürgensen, N.; Engelmann, G.; Ehrmann, O.; Uhlig, A.; Michel, B.; Reichl, H.
Conference Paper
2008Highly integrated flexible electronic circuits and modules
Loher, T.; Seckel, M.; Pahl, B.; Böttcher, L.; Ostmann, A.; Reichl, H.
Conference Paper
2008Immersion Ag as an alternative in 'Green' COB technology
Schneider-Ramelow, M.; Müller, J.; Göhre, J.-M.; Reichl, H.
Conference Paper
2008Interdependencies between reliability and standby
Nissen, N.F.; Middendorf, A.; Stobbe, L.; Schlösser, A.; Reichl, H.
Conference Paper
2008Lamination and laser structuring for a microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.; Iafelice, B.; Destro, F.; Gambari, R.
Journal Article
2008Latest developments in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Aschenbrenner, R.; Ostmann, A.; Reichl, H.
Conference Paper
2008Lead free solder joints: reliability and metallurgical reactions
Hutter, M.; Schmidt, R.; Pape, U.; Oppermann, H.; Reichl, H.
Conference Paper
2008Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Low Temperature Au-Au Flip Chip Interconnections
Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Managing losses in through silicon vias with different return current path configurations
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.
Conference Paper
2008Manufacturing Concepts for Stretchable Electronic Systems
Ostmann, A.; Löher, T.; Seckel, M.; Böttcher, L.; Reichl, H.
Conference Paper
2008Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Mikrosysteme zur Sicherung der Fleischqualität
Thomasius, R.; Kim, J.-U.; Guttowski, S.; Reichl, H.
Journal Article
2008Minimizing electromagnetic interference in power-ground cavities
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008A Model for Gaining Significant Data to Establish Energy Profiles of Passive Electronic Components
Körber, G.; Schulz, G.; Viehmann, K.-R.; Huck, W.; Dietrich, M.; Schischke, K.; Nissen, N.F.; Stobbe, L.; Reichl, H.
Conference Paper
2008Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008Modelling Guidelines and Non-Destructive Analysis for Thermal and Mechanical Behaviour of Via-Structures in Organic Boards
Schacht, R.; Wunderle, B.; May, D.; Michel, B.; Reichl, H.
Conference Paper
2008More than moore, hetero system integration and smart system integration
Reichl, H.; Aschenbrenner, R.; Pötter, H.; Schmitz, S.
Book Article
2008Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Journal Article, Conference Paper
2008Novel multimodal high-speed structures using substrate integrated waveguides with shielding walls in thin film technology
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.
Conference Paper
2008Novel rapid prototyping processes - Building movable parts
Ansorge, F.; Badstübner, K.; Reichl, H.
Conference Paper
2008On the interactions between mushroom-type EBGs and striplines
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008On-line condition monitoring of power semiconductors
Wernicke, T.; Gegusch, R.; Dieckerhoff, S.; Middendorf, A.; Seliger, G.; Reichl, H.
Conference Paper
2008Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators
Hahn, R.; Wagner, S.; Krumbholz, S.; Reichl, H.
Conference Paper
2008Profile of the wafer level ECD gold bumps under variable parameters
Jing, X.M.; Engelmann, G.; Chen, D.; Wolf, J.; Ehrmann, O.; Reichl, H.
Journal Article
2008Realization of system-in-package modules by embedding of chips
Boettcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2008Reliability and environmental evaluation in early design stages of mechatronics
Middendorf, A.; Jaeschke, J.; Tsunezawa, K.; Reichl, H.
Conference Paper
2008Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Reliable Encapsulation of Microsystems for Automotive Use
Becker, K.-F.; Braun, T.; Koch, M.; Bauer, J.; Wunderle, B.; Sommer, J.-P.; Aschenbrenner, R.; Reichl, H.
Conference Paper, Journal Article
2008Review of exemptions from electronics-related material bans - status of reviews, backgrounds and experiences of a reviewer
Deubzer, O.; Reichl, H.
Conference Paper
2008RoHS-like regulations worldwide
Müller, J.; Griese, H.; Nissen, N.F.; Reichl, H.
Conference Paper
2008Spare Part Management from the View of Sustainability
Oberender, C.; Hiller, V.; Reichl, H.
Conference Paper
2008Specifying mechatronic systems in early design phases for analysing sustainability aspects
Deyter, S.; Gausemeier, J.; Middendorf, A.; Reichl, H.; Steffen, D.; Tsunezawa, K.; Walachowicz, F.
Conference Paper
2008Stretchable electronic systems for wearable and textile applications
Löher, T.; Vieroth, R.; Seckel, M.; Ostmann, A.; Reichl, H.
Conference Paper
2008Studying the interactions between mushroom-type EBGs, transmission lines and vias
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008System-in-Package
Wolf, M.J.; Reichl, H.
Journal Article
2008Technologies for 3D wafer level heterogeneous integration
Wolf, M.J.; Ramm, P.; Klumpp, A.; Reichl, H.
Conference Paper
2008Through silicon via technology - processes and reliability for wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Klumpp, A.; Wieland, R.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2008Trends in der Mikrosystemtechnik
Hampicke, M.; Reichl, H.; Lang, K.-D.; Schmitz, S.; Pötter, H.
Journal Article
2008Trends und Technologien - "More than Moore" und neue Konzepte der Aufbau- und Verbindungstechnik
Pötter, H.; Hampicke, M.; Lang, K.-D.; Schmitz, S.; Reichl, H.
Journal Article
2008Verfahren zum Herstellen einer halbleiterbasierten Schaltung und halbleiterbasierte Schaltung mit dreidimensionaler Schaltungstopologie
Reichl, H.; Wolf, J.; Wieland, R.; Zoschke, K.
Patent
2008Vorrichtung zur Unterdrueckung der Ausbreitung einer elektromagnetischen Stoerung in einem elektrischen System und ein elektrisches System mit derselben
Ndip, I.; Guttowski, S.; Reichl, H.
Patent
2008Wireless Sensor Networks for Agriculture and Automation: Challenges and Chances for Sustainability
Beucker, S.; Clausen, J.; Schischke, K.; Mwanza, J.; Altendorf, P.; Reichl, H.
Conference Paper
2007Accurate characterization of package and board components for efficient system level signal integrity analysis
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2007Applications of biopolymers in electronic products
Nissen, N.F.; Kleinert, G.; Petermann, C.; Mothes, G.; Müller, J.; Reichl, H.; Scheel, W.; Schmidt, R.
Conference Paper
2007Condition Indicators for Reliability Monitoring of Microsystems
Bochow-Ness, O.; Eckert, T.; Fujino, M.; Middendorf, A.; Reichl, H.
Conference Paper
2007Conformal coating and patterning of 3D structures on wafer level with electrophoretic photoresists
Fischer, T.; Töpper, M.; Jürgensen, N.; Ehrmann, O.; Wiemer, M.; Reichl, H.
Conference Paper
2007Copper / Benzocyclobutene multi layer wiring - A Flexible base technology for wafer level integration of passive components
Zoschke, K.; Wolf, J.; Ehrmann, O.; Toepper, M.; Reichl, H.
Conference Paper
2007Design for miniaturization of wireless sensor nodes based on 3D-packaging technologies
Niedermayer, M.; Thomasius, R.; Polityko, D.-D.; Schrank, K.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2007Development of an M3-approach for optimal electromagnetic reliability in system packages
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2007ECD wafer bumping and packaging for pixel detector applications
Fritzsch, T.; Jordan, R.; Ehrmann, O.; Reichl, H.
Conference Paper
2007An efficient methodology for design and implementation of embedded bandpass filters for RF/wireless applications
Baba, M.; Guttowski, S.; Reichl, H.
Conference Paper
2007Electric characteristics of planar interconnect technologies for power MOSFETs
Dieckerhoff, S.; Kirfo, T.; Wernicke, T.; Kallmayer, C.; Ostmann, A.; Jung, E.; Wunderle, B.; Reichl, H.
Conference Paper
2007European environmental legislation - insights into the EuP process
Nissen, N.F.; Stobbe, L.; Schischke, K.; Müller, J.; Reichl, H.
Conference Paper
2007Evaluation of micro structured glass layers as dielectric-and passivation material for wafer level integrated thin film capacitors and resistors
Zoschke, K.; Feige, C.; Wolf, J.; Mund, D.; Töpper, M.; Ehrmann, O.; Schmückle, F.J.; Reichl, H.
Conference Paper
2007Experimental characterization methods for power MOSFET assemblies
Wernicke, T.; Dieckerhoff, S.; Kirfe, T.; Feix, G.; Guttowski, S.; Reichl, H.
Conference Paper
2007Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H.
Journal Article
2007Fiber optic strain and structural health monitoring in polymer electronic packaging
Schreier-Alt, T.; Ansorge, F.; Reichl, H.
Conference Paper
2007Foil type micro PEM fuel cell with self-breathing cathode side
Wagner, S.; Hahn, R.; Reichl, H.
Book Article
2007From Microelectronic Packaging to System Integration
Wolf, M.J.; Reichl, H.
Conference Paper
2007Fully integrated one phase liquid cooling system for organic boards
May, D.; Wunderle, B.; Schindler-Saefkow, F.; Nguyen, B.; Schacht, R.; Michel, B.; Reichl, H.
Conference Paper
2007Global harmonization of RoHS-like regulations
Müller, J.; Griese, H.; Reichl, H.
Conference Paper
2007Global sustainable development needs advanced electronics
Griese, H.; Mueller, J.; Nissen, N.F.; Reichl, H.; Stobbe, L.
Conference Paper
2007High temperature and element alloying influences on Kirkendall voiding in Au ball bond interconnects on Al chip metallization
Schneider-Ramelow, M.; Schuch, B.; Lang, K.-D.; Reichl, H.
Conference Paper
2007Hochgeschwindigkeitsaufnahmen der Wedgebewegung beim US-Bonden/Wedge-Bonden
Schneider-Ramelow, M.; Gaul, H.; Schmitz, S.; Reichl, H.
Journal Article
2007Hochgeschwindigkeitsaufnahmen der Werkzeug- und Drahtschwingung beim US-Wedge/Wedge-Bonden
Gaul, H.; Schneider-Ramelow, M.; Reichl, H.
Journal Article
2007Integration of reliability and environmental aspects in the early design stages of mechatronics
Tsunezawa, K.; Middendorf, A.; Nissen, N.F.; Reichl, H.; Walachowicz, F.
Conference Paper
2007Interface reactions during Au-ball/wedge and AlSi1- Wedge/wedge bonding at room temperature
Schneider-Ramelow, M.; Lang, K.-D.; Geißler, U.; Scheel, W.; Reichl, H.
Conference Paper
2007Kostenaspekte beim Entwurf von Funksensorknoten
Niedermayer, M.; Hefer, J.; Guttowski, S.; Thomasius, R.; Reichl, H.
Conference Paper
2007Lamination and laser structuring for a DEP microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.
Conference Paper
2007Lamination process studies for realisation of chip embedding technologies-current applications and technical challenges
Manessis, D.; Ostmann, A.; Yen, S.-F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2007Linking geometrical and electrical parameters of flex substrate vertical interconnects for 2.5D system-in-package design
Maaß, U.; Polityko, D.-D.; Richter, C.; Ndip, I.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2007Localized stress measurements - a new approach covering needs for advanced micro and nanoscale system development
Vogel, D.; Gollhardt, A.; Sabate, N.; Keller, J.; Michel, B.; Reichl, H.
Conference Paper
2007Measurement techniques for the thermal characterization of power modules
Wernicke, T.; Dieckerhoff, S.; Guttowski, S.; Reichl, H.
Conference Paper
2007Methodical design of EMI filters for power electronics
Hoene, E.; Lissner, A.; Guttowski, S.; Reichl, H.
Conference Paper
2007Micro-Nanostructural Investigations of AlSi1 Bondcontacts
Geißler, U.; Schneider-Ramelow, M.; Reichl, H.
Conference Paper
2007Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
Braun, T.; Böttcher, L.; Bauer, J.; Manessis, D.; Jung, E.; Ostmann, A.; Becker, K.-F.; Aschenbrenner, R.; Reichl, H.; Guerrieri, R.; Gambari, R.
Conference Paper
2007Molecular Dynamics Simulation and Mechanical Characterisation of Epoxy Resins Examined at Different Temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007Molecular dynamics simulation for the diffusion of water in amorphous polymers examined at different temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007New sensor packaging concept for avionic application
Aschenbrenner, R.; Jung, E.; Braun, T.; Oestermann, U.; Bauer, J.; Becker, K.-F.; Reichl, H.
Conference Paper
2007Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H.
Conference Paper
2007Optimal Electrical Design of System Packages and Integrated Components using the M3-Approach
Ndip, I.; Salhi, F.; Maaß, U.; Fotheringham, G.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2007Overmolded FC-SiP for miniaturized devices
Jung, E.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2007Packaging concepts for neuroprosthetic implants
Töpper, M.; Klein, M.; Wilke, M.; Oppermann, H.; Kim, S.; Tathireddy, P.; Solzbacher, F.; Reichl, H.
Conference Paper
2007Predicting the influence of placement of passive components on EMI behaviour
Lissner, E.; Hoene, S.; Guttowski, S.; Reichl, H.
Conference Paper
2007Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H.
Conference Paper
2007Prospects and yield of electrochemical wafer plating for bumping and signal routing
Dietrich, L.; Töpper, M.; Fritzsch, Th.; Ehrmann, O.; Reichl, H.
Conference Paper
2007Pulse and Lock-In Infrared Thermography - Possibilities for Non-Destructive Reliability Analysis of Micro-Electronic Assemblies
May, D.; Schacht, R.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007Rapid interface reliability testing of flip chip encapsulants
Rau, I.; Becker, K.-F.; Wunderle, B.; Reichl, H.
Conference Paper
2007Realization of large area stretchable electronic systems using lamination processes
Loeher, T.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2007Reliability Aspect Integration in Early Stages of Design Processes for Mechatronic Systems
Middendorf, A.; Keller, J.; Walter, H.; Reichl, H.
Conference Paper
2007Reliability Aspects in Heterogeneous System Integration Technologies
Reichl, H.; Wolf, M.J.
Conference Paper
2007Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H.
Conference Paper
2007Smart System Integration - Grundlage zukünftiger Anwendungen im Maschinenbau
Pötter, H.; Großer, V.; Lang, K.-D.; Reichl, H.; Schmitz, S.; Wolf, J.
Journal Article
2007State of RoHS (non) compliance in small and medium sized enterprises
Liu, R.; Schischke, K.; Bukat, K.; Koziol, G.; Sitek, J.; Zuber, K.-H.; Reichl, H.
Conference Paper
2007Status and impacts of RoHS-like regulations - the role of material bans in sustainable development
Deubzer, O.; Griese, H.; Zangl, S.; Andrae, A.; Reichl, H.
Conference Paper
2007Stress monitoring in epoxy resins and embedded components during packaging and curing processes
Schreier-Alt, T.; Badstuebner, K.; Rebholz, C.; Reichl, H.; Ansorge, F.
Conference Paper
2007System Integration on Wafer Level - Requirements and Technical Solutions
Wolf, M.J.; Michel, B.; Ramm, P.; Reichl, H.
Conference Paper
2007System Integration Technologies for Wireless Sensor Nodes
Reichl, H.; Wolf, M.J.
Conference Paper
2007Technical understanding of resin-coated-copper (RCC) lamination processes for realization of reliable chip embedding technologies
Manessis, D.; Yen, S.F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2007Technology aware modeling of 2.5D-SiP for automation in physical design
Richter, C.; Polityko, D.-D.; Hefer, J.; Gutowski, S.; Reichl, H.; Berger, M.; Nowak, U.; Schroeder, M.
Conference Paper
2007Thermal constraints of PEM micro fuel cells for portable electronics
Hahn, R.; Wagner, S.; Reichl, H.
Book Article
2007Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon
Wunderle, B.; Mrossko, R.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michl, B.; Reichl, H.
Conference Paper
2007Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H.
Conference Paper
2007Thin film encapsulation for secondary batteries on wafer level
Marquardt, K.; Hahn, R.; Luger, T.; Reichl, H.
Conference Paper
2007UBM-PAD, Loetkontakt und Verfahren zur Herstellung einer Loetverbindung
Jurenka, C.; Wolf, J.; Engelmann, G.; Reichl, H.
Patent
2006Accelerated active high-temperature cycling test for power MOSFETs
Schacht, R.; Wunderle, B.; Auerswald, E.; Michel, B.; Reichl, H.
Conference Paper
2006Assembly and hermetic encapsulation of wafer level secondary batteries
Marquardt, K.; Hahn, R.; Luger, T.; Reichl, H.
Conference Paper
2006Assembly and reliability of ultrathin flip chips on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F.
Conference Paper
2006Characterization of thermal interface materials to support thermal simulation
Schacht, R.; May, D.; Gollhardt, A.; Wittler, O.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2006Chip embedding into polymer matrices of printed wiring boards
Loeher, T.; Neumann, A.; Sommer, J.-P.; Ostmann, A.; Reichl, H.
Presentation
2006Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Dietrich, L.; Toepper, M.; Ehrmann, O.; Reichl, H.
Conference Paper
2006A cost-effective alternative technology for wafer bumping - Electroless Ni/Au UBM deposition and ultra fine pitch printing of solder paste
Boettcher, L.; Ostmann, A.; Manessis, D.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Design of integrated inductances based on ferromagnetic LTCC layers
Hahn, R.; Sommer, G.; Dörr, I.; Schwerzel, S.; Reichl, H.; Muller, E.
Journal Article
2006Development of a 3D wafer-level re-routing, using dielectric lamination technology
Böttcher, L.; Ostmann, A.; Manessis, D.; Polityko, D.; Reichl, H.
Conference Paper
2006Development of a nano-structure based interconnection technology
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H.
Presentation
2006EcoDesign in european small and medium sized enterprises of the electrical and electronics sector
Schischke, K.; Müller, J.; Reichl, H.
Conference Paper
2006Efficient HF modeling and model parameterization of induction machines for time and frequency domain simulations
Schinkel, M.; Weber, S.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Electronic systems from the perspective of sustainability and reliability
Oberender, C.; Middendorf, A.; Bochow-Neß, O.; Griese, H.-J.; Reichl, H.
Conference Paper
2006Electronic textiles
Reichl, Herbert; Kallmayer, Christine; Linz, Torsten
Book Article
2006Embedding of active and passive components into printed wiring boards
Löher, T.; Neumann, A.; Vieroth, R.; Ostmann, A.; Reichl, H.
Presentation
2006Entwurf kleinster energieautarker Funksensoren
Thomasius, R.; Niedermayer, M.; Polityko, D.-D.; Schrank, K.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Ergebnisdarstellung "SHIFT" - Chipintegrationstechnologie
Löher, T.; Kallmayer, C.; Neumann, A.; Pahl, B.; Ostmann, A.; Reichl, H.
Conference Paper
2006Evaluating customer requirements in Eco-VA
Sakao, T.; Oberender, C.; Krone, N.; Shimomura, Y.; Birkhofer, H.; Reichl, H.
Conference Paper
2006Evaluation of Metallic Nano-Lawn Structures for Application in Microelectronic Packaging
Fiedler, S.; Zwanzig, M.; Schmidt, R.; Auerswald, E.; Klein, M.; Scheel, W.; Reichl, H.
Conference Paper
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper, Journal Article
2006Experimentelle Charakterisierung von Thermischen Interface Materialien für die thermische Simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2006Flexible Leiterplatten (FPC) - Innovationsfaktor mit Mehrwert für die elektronische Baugruppe
Scheel, W.; Reichl, H.
Conference Paper
2006Flip chip bumping technology - Status and update
Wolf, M.J.; Engelmann, G.; Dietrich, L.; Reichl, H.
Conference Paper, Journal Article
2006Fully integrated EKG shirt based on embroidered electrical interconnections with conductive yarn and miniaturized flexible electronics
Linz, Torsten; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Hetero System Integration - Challenges and Requirements for Packaging
Wolf, M.J.; Reichl, H.
Conference Paper
2006High-temperature reliability of flip chip assemblies
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2006Identifying the reliability affecting parameters of SBB flip chip interconnections for automotive applications
Dreßler, M.; Rohde, H.; Liebing, G.; Becker, K.-F.; Wunderle, B.; Auersperg, J.; Reichl, H.
Conference Paper
2006Improved reliability of leadfree flip chip assemblies using direct underfilling by transfer molding
Braun, T.; Wunderle, B.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Influence of assembly process - material properties and geometry on the reliability of flip chip interconnections on MID for automotive applications
Dreßler, M.; Rohde, H.; Liebing, G.; Becker, K.-F.; Wunderle, B.; Reichl, H.
Conference Paper
2006Innovative substrate technologies for new products
Aschenbrenner, R.; Löher, T.; Ostmann, A.; Kallmayer, C.; Scheel, W.; Reichl, H.
Conference Paper
2006Integration technology parameters for physical design of vertical system-in-package
Polityko, D.; Guttowski, S.; Reichl, H.
Conference Paper
2006Laminate Concepts for Chip Embedding: Process Technologies and Reliability Results
Löher, T.; Neumann, A.; Pahl, B.; Patzelt, R.; Ostmann, A.; Reichl, H.
Conference Paper
2006Lamination technology of Resin-Coated-Copper (RCC) films for chip and component embedding in printed circuit boards
Manessis, D.; Yen, S.-F.; Newmann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Latest Technological Advancements in Stencil Printing Processes for Ultra-Fine-Pitch Flip Chip Bumping up to 60µm Pitch
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Lebensdauerprognostik für Drahtbond-Verbindungen mittels der Life-Cycle-Unit
Middendorf, A.; Reichl, H.; Griese, H.
Conference Paper
2006Low profile power inductors based on ferromagnetic LTCC technology
Hahn, R.; Krumbholz, S.; Reichl, H.
Conference Paper
2006Metallische Nanorasen-Strukturen für das Mikroelektronik-Packaging
Fiedler, S.; Zwanzig, M.; Schmidt, R.; Scheel, W.; Reichl, H.
Journal Article
2006Microelectronics to Nanoelectronics - Reliability and Packaging Considerations
Michel, B.; Reichl, H.
Conference Paper
2006Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies
Niedermayer, M.; Guttowski, S.; Thomasius, R.; Polityko, D.; Schrank, K.; Reichl, H.
Conference Paper
2006Miniaturized Wireless Sensors for Automotive Applications
Thomasius, R.; Grundmann, S.; Niedermayer, M.; Achterholt, R.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Modeling of striplines between a power and a ground plane
Engin, A.E.; John, W.; Sommer, G.; Mathis, W.; Reichl, H.
Journal Article
2006Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV
Weber, S.-P.; Linde, A.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
Huang, M.L.; Löher, T.; Manessis, D.; Böttcher, L.; Ostmann, A.; Reichl, H.
Journal Article
2006Multi-Chip-Modul und Verfahren zum Herstellen eines Multi-Chip-Moduls
Landesberger, C.; Reichl, H.; Ansorge, F.; Ramm, P.; Ehrmann, O.
Patent
2006Multiple flip-chip assembly for hybrid compact optoelectroi modules using electroplated AuSn solder Bumps
Chu, K.-M.; Lee, J.-S.; Oppermann, H.; Engelmamr, G.; Wolf, J.; Reichl, H.; Jeon, D.Y.
Conference Paper
2006Nano-structured interconnects for system integration
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H.
Conference Paper
2006A novel methodology for defining the boundaries of geometrical discontinuities in electronic packages
Ndip, I.; Reichl, H.; Guttowski, S.
Conference Paper
2006Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N.
Conference Paper
2006Parasitic effects in EMI filters
Hoene, E.; Lissner, A.; Weber, S.-P.; Guttowski, S.; Reichl, H.
Conference Paper
2006Performance comparison of advanced power electronic packages for automotive applications
Dieckerhoff, S.; Guttowski, S.; Reichl, H.
Conference Paper
2006Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder
Hutter, M.; Oppermann, H.; Engelmann, G.; Dietrich, L.; Reichl, H.
Conference Paper
2006Predicting parasitics and inductive coupling in EMI-filters
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Predicting parasitics and inductive coupling in EMI-filters
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper

 

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