Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2011Observation of free surface-induced bending upon nanopatterning of ultrathin strained silicon layer
Moutanabbir, O.; Reiche, M.; Zakharov, N.; Naumann, F.; Petzold, M.
Journal Article
2011Strain nano-engineering: SSOI as a playground
Moutanabbir, O.; Hähnel, A.; Reiche, M.; Erfurth, W.; Tarun, A.; Hayazawa, N.; Kawata, S.; Naumann, F.; Petzold, M.
Conference Paper
2011Strain stability in nanoscale patterned strained silicon-on-insulator
Moutanabbir, O.; Reiche, M.; Hähnel, A.; Erfurth, W.; Motohashi, M.; Tarun, A.; Hayazawa, N.; Kawata, S.; Naumann, F.; Patzold, M.; Holt, M.; Maser, J.
Conference Paper
2010Impact of stress on recombination of metal precipitates in silicon
Gundel, P.; Schubert, M.C.; Heinz, F.D.; Kwapil, W.; Warta, W.; Martinez-Criado, G.; Reiche, M.; Weber, E.R.
Journal Article
2010Numerical investigations of the strain behavior in nanoscale patterned strained silicon structures
Naumann, F.; Moutanabbir, O.; Reiche, M.; Schriever, C.; Schilling, J.; Petzold, M.
Conference Paper
2010Strain stability in nanoscale patterned strained silicon-on-insulator
Moutanabbir, O.; Reiche, M.; Hähnel, A.; Erfurth, W.; Tarun, A.; Hayazawa, N.; Kawata, S.; Naumann, F.; Petzold, M.
Journal Article, Conference Paper
2009The complex evolution of strain during nanoscale patterning of 60 nm thick strained silicon layer directly on insulator
Moutanabbir, O.; Reiche, M.; Erfurth, W.; Naumann, F.; Petzold, M.; Gösele, U.
Journal Article
2009Micro-luminescence spectroscopy on multicrystalline silicon
Gundel, P.; Schubert, M.C.; Kwapil, W.; Schön, J.; Reiche, M.; Savin, H.; Yli-Koski, M.; Sans, J.A.; Martinez-Criado, G.; Warta, W.; Weber, E.R.
Conference Paper
2009Micro-photoluminescence spectroscopy on metal precipitates in silicon
Gundel, P.; Schubert, M.C.; Kwapil, W.; Schon, J.; Reiche, M.; Savin, H.; Yli-Koski, M.; Sans, J.A.; Martinez-Criado, G.; Seifert, W.; Warta, W.; Weber, E.R.
Journal Article
2009Probing the strain states in nanopatterned strained SOI
Moutanabbir, O.; Reiche, M.; Hähnel, A.; Erfurth, W.; Naumann, F.; Petzold, M.; Gösele, U.
Conference Paper
2008Strained silicon on wafer level by waferbonding: Materials processing, strain measurements and strain relaxation
Reiche, M.; Moutanabbir, O.; Himcinschi, C.; Christiansen, S.; Erfurth, W.; Gösele, U.; Mantl, S.; Buca, D.; Zhao, Q.; Loo, R.; Nguyen, D.; Muster, F.; Petzold, M.
Conference Paper
2007Strain relaxation in nanopatterned strained silicon round pillars
Himcinschi, C.; Singh, R.; Radu, I.; Milenin, A.P.; Erfurth, W.; Reiche, M.; Gösele, U.; Christiansen, S.H.; Muster, F.; Petzold, M.
Journal Article
2007Uniaxially strained silicon by wafer bonding and layer transfer
Himcinschi, C.; Radu, I.; Muster, F.; Singh, R.; Reiche, M.; Petzold, M.; Gösele, U.; Christiansen, S.H.
Conference Paper, Journal Article
2006Ambient pressure plasma activation for low temperature bonding
Eichler, M.; Michel, B.; Thomas, M.; Klages, C.-P.; Ruddy, C.; Reinecke, H.; Reiche, M.; Radu, I.; Gabriel, M.
Conference Paper
2006Patterned DBD pretreatment at ambient pressure for low temperature wafer bonding
Eichler, M.; Michel, B.; Thomas, M.; Ruddy, C.; Reinecke, H.; Reiche, M.; Gabriel, M.; Klages, C.-P.
Conference Paper
2006Patterned surface modification using ambient pressure plasma processes for enhanced wafer packaging by low temperature bonding
Eichler, M.; Mewes, H.; Thomas, M.; Klages, C.-P.; Ruddy, C.; Reinecke, H.; Reiche, M.; Gabriel, M.
Conference Paper
2006Wafer direct bonding with ambient pressure plasma activation
Gabriel, M.; Johnson, B.; Suss, R.; Reiche, M.; Eichler, M.
Journal Article
2005Capabilities of an ambient pressure plasma for activation in LT wafer bonding processes
Gabriel, M.; Cetin, V.; Hansen, S.; Reiche, M.; Radu, I.; Eichler, M.
Conference Paper
2005Mechanisms of low-temperature wafer bonding
Reiche, M.; Radu, I.; Gabriel, M.; Zoberbier, M.; Hansen, S.; Eichler, M.
Conference Paper
2005Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding
Bakke, T.; Friedrichs, M.; Völker, B.; Reiche, M.; Leonardsson, L.; Schenk, H.; Lakner, H.
Conference Paper
2005Wafer bonding for optical MEMS
Bakke, T.; Völker, B.; Schenk, H.; Radu, I.; Reiche, M.
Conference Paper
1998The effect of plasma pretreatment on the Si/Si bonding behaviour
Reiche, M.; Gutjahr, K.; Stolze, D.; Burczyk, D.; Petzold, M.
Conference Paper
1997Characterisation of directly bonded silicon wafers by means of the double cantilever crack opening method
Bagdahn, J.; Petzold, M.; Reiche, M.; Gutjahr, K.
Conference Paper
1997Mechanical reliability tests for bonded wafers
Bagdahn, J.; Petzold, M.; Reiche, M.; Wiemer, M.
Conference Paper
1995Charakterisierung mehrfach gebondeter Wafer für die Sensorik
Wiemer, M.; Hiller, K.; Hopfe, S.; Petzold, M.; Reiche, M.; Geßner, T.; Gösele, U.
Conference Paper
1995Interface strength characterization of bonded wafers
Petzold, M.; Petersilge, M.; Abe, T.; Reiche, M.
Conference Paper
1995Investigations of the interface strength of bonded silicon wafers
Bagdahn, J.; Heinzelmann, M.; Petzold, M.; Reiche, M.
Conference Paper