Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Development and analysis of high temperature stable interconnections on thick films using micro resistance welding for sensors and MEMS
Gierth, Paul; Rebenklau, Lars
Conference Paper
2018Entwicklung von miniaturisierten Dickschicht-Thermoelement-Arrays für automobile und industrielle Anwendungen
Gierth, Paul; Rebenklau, Lars; Bachmann, Eric; Niedermeyer, Lars; Augsburg, Klaus
Conference Paper
2018Novel thermocouples for automotive applications
Gierth, Paul; Rebenklau, Lars; Augsburg, Klaus; Niedermeyer, Lars; Bachmann, Eric
Journal Article
2017Novel thermocouples for temperature measurement in automotive applications
Gierth, Paul; Rebenklau, Lars; Augsburg, Klaus; Niedermeyer, Lars; Bachmann, Eric
Conference Paper
2017Thermoelektrische Messvorrichtung und ihre Verwendung
Wodtke, Axel; Niedermeyer, Lars; Augsburg, Klaus; Bechtold, Franz; Rebenklau, Lars; Irrgang, Klaus; Lippmann, Lutz
Patent
2017Thermoelektrisches Element sowie ein Verfahren zu dessen Herstellung
Rebenklau, Lars; Gierth, Paul; Wodtke, Axel; Niedermeyer, Lars; Augsburg, Klaus
Patent
2016Entwicklung neuartiger thermoelektrischer Module für automotive und industrielle Anwendungen
Niedermeyer, Lars; Augsburg, Klaus; Wodtke, Axel; Rebenklau, Lars; Grießmann, Horst; Gierth, Paul; Irrgang, Klaus; Lippmann, Lutz; Bechtold, Franz
Conference Paper
2015Electrical characterization of thick film materials
Rebenklau, Lars; Gierth, Paul; Grießmann, Horst
Conference Paper
2015Industrial inert drying system for high efficiency heterojunction solar cells
Schörner, S.; Clement, C.; Bell, H.; Gierth, Paul; Rebenklau, Lars
Conference Paper
2015Novel thermoelectric temperature sensors
Rebenklau, Lars; Irrgang, Klaus; Wodke, Axel; Augsburg, K.; Bechtold, Franz; Gierth, Paul; Grießmann, Horst; Lippmann, Lutz; Niedermeyer, Lars
Conference Paper
2015Solder wettability and solder joint reliability of rapid thermal firing thick film pastes
Gierth, Paul; Rebenklau, Lars
Conference Paper
2015Temperature sensors based on thermoelectric effect
Rebenklau, Lars; Gierth, Paul; Paproth, Angelika; Wodtke, Axel; Niedermeier, Lars; Augsburg, Klaus; Bechtold, Franz; Irrgang, Klaus; Lippmann, Lutz
Conference Paper
2015Via hole conditioning in silicon heterojunction metal wrap through solar cells
Dirnstorfer, Ingo; Schilling, Niels; Körner, Stefan; Gierth, Paul; Waltinger, Andreas; Leszczynska, Barbara; Simon, Daniel K.; Gärtner, Jan; Jordan, Paul M.; Mikolajick, Thomas; Dani, Ines; Eberstein, Markus; Rebenklau, Lars; Krause, Jens
Journal Article, Conference Paper
2014Development of silicon heterojunction metal wrap through solar cells
Dirnstorfer, Ingo; Schilling, Niels; Körner, Stefan; Gierth, Paul; Sontag, Detlef; Jordan, Paul M.; Simon, Daniel K.; Fengler, Franz P.G.; Mikolajick, Thomas; Linaschke, Dorit; Dani, Ines; Marcinkowski, Manja; Eberstein, Markus; Rebenklau, Lars; Partsch, Uwe
Conference Paper
2014Evaluation of long time stability of solder joints on Ag thick film conductors on Al2O3
Gierth, Paul; Zieschank, Michael; Rebenklau, Lars
Conference Paper
2014Wettability of rapid thermal firing silver-pastes
Gierth, Paul; Rebenklau, Lars
Conference Paper
2013Inert drying system for copper paste application in PV
Clement, Caroline; Bell, Hans; Vogg, Florian; Rebenklau, Lars; Gierth, Paul; Partsch, Uwe
Journal Article, Conference Paper
2013Influence of the organic vehicle and inorganic additives on the properties of thick film pastes for AlN
Schmidt, Richard; Wenzel, Marco; Reinhardt, Kathrin; Partsch, Uwe; Rebenklau, Lars; Eberstein, Markus
Conference Paper
2012Evaluation of soldering processes for high efficiency solar cells
Gierth, Paul; Rebenklau, Lars; Michaelis, Alexander
Conference Paper
2012Low temperature interconnection techniques for high efficiency heterojunction solar cells
Rebenklau, L.; Gierth, P.; Partsch, U.; Mehlich, H.; Hausmann, J.; Grimm, M.; Stein, W.; Bell, H.; Clement, C.; Vogg, F.
Conference Paper
2011Sensoren in keramischer Mehrlagentechnik - aktuelle Entwicklungen am Fraunhofer IKTS
Ziesche, S.; Rebenklau, L.; Partsch, U.
Journal Article
2010Lead-oxide-free copper thick-film paste for alumina substrates
Reinhardt, K.; Kretzschmar, C.; Rebenklau, L.; Schulz-Hader, J.; Meyer, A.; Marx, C.
Conference Paper
2009Development of an AlN HTCC multilayer system with a tungsten cofiring metallization
Joedecke, B.; Fritsch, M.; Kretzschmar, C.; Rebenklau, L.; Michaelis, A.
Conference Paper
2009Fineline-Strukturierung von Dickschichtpasten
Rebenklau, L.; Partsch, U.; Fritsch, M.; Mosch, S.; Michaelis, A.
Conference Paper
2009Reliability and effective signal-to-noise ratio of RuO(sub 2)-based thick film strain gauges
Dietrich, S.; Kretzschmar, C.; Partsch, U.; Rebenklau, L.
Conference Paper
2009Technologische Aspekte zur Realisierung ROHS-konformer integrierter Schichtschaltungen
Rebenklau, L.; Detert, M.; Herzog, T.
Book Article
2008Bleifreie Lötverbindungen auf keramischen Dickschichtverdrathungsträgern
Rebenklau, L.; Detert, M.; Herzog, T.
Book Article
2008Manufacturing and electrical interconnection of piezoelectric 1-3 composite materials for phased array ultrasonic transducers
Walter, S.; Nieweglowski, K.; Rebenklau, L.; Wolter, K.-J.; Lamek, B.; Schubert, F.; Heuer, H.; Meyendorf, N.
Conference Paper
2008Thick film heater for aluminum nitride ceramics
Hentsche, M.; Kretzschmar, C.; Grießmann, H.; Marcinkowski, P.; Rebenklau, L.
Conference Paper
2007Laser-shaped thick-film and LTCC microresistors
Mi, E.; Borucki, M.; Dziedzic, A.; Kamiski, S.; Rebenklau, L.; Wolter, K.-J.; Sonntag, F.
Conference Paper
2007Modeling LTCC-based microchannels using a network approach
Schlottig, G.; Rebenklau, L.; Uhlemann, J.; Nytsch-Geusen, C.; Wolter, K.-J.
Conference Paper