Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Presentation
2019Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits
Franzon, Paul D.; Marinissen, Erik Jan; Bakir, Muhannad S.; Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Book
2019Introduction to Design, Test and Thermal Management of 3D Integrated Circuits
Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Book Article
20183D integration processes for advanced sensor systems and high-performance RF components
Weber, Josef; Fernandez-Bolanos, Montserrat; Ionescu, Adrian; Ramm, Peter
Conference Paper
2018Advanced sensor systems by low-temperature heterogeneous 3D integration processes
Fernandez-Bolanos, Montserrat; Muller, Andrei; Weber, Josef; Ramm, Peter
Conference Paper
2018Vision 2030 - Flagship Proposal Health-EU
Ramm, Peter; Bose, Indranil; Kutter, Christoph
Presentation
2017The Advancement of Device Packaging - A Resume on IMAPS DPC 2017
Ramm, Peter; Poupon, Gilles; Couderc, Pascal; Leitgeb, Markus; Taklo, Maaike M.V.
Journal Article
2017Highly integrated chips
Ramm, P.; Weber, J.
Journal Article
2017Low-temperature 3D integration processes for advanced sensor systems
Ramm, P.; Fernandez-Bolanos, M.; Weber, J.
Presentation
20163D TSV based high frequency components for RF IC and RF MEMS applications
Fernandez-Bolanos, M.; Vitale, W.A.; López, M.M.; Ionescu, A.M.; Klumpp, A.; Merkel, R.; Weber, J.; Ramm, P.; Ocket, I.; Raedt, W. de; Enayati, A.
Conference Paper
2015Current and future 3D activities at Fraunhofer
Heinig, A.; Chaudhary, M.W.; Schneider, P.; Ramm, P.; Weber, J.
Conference Paper
2015The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems
Ramm, P.; Klumpp, A.; Weber, J.; Mathewson, A.; Razeeb, K.M.; Pufall, R.
Conference Paper
2015Fine pitch 3D-TSV based high frequency components of RF MEMS applications
Vitale, W.A.; Fernandez-Bolanos, M.; Merkel, R.; Enayati, A.; Ocker, I.; Raedt, W. de; Weber, J.; Ramm, P.; Ionescu, A.M.
Conference Paper
2015Ultra fine-pitch TSV technology for ultra-dense high-Q RF inductors
Vitale, W.A.; Fernandez-Bolanos, M.; Klumpp, A.; Weber, J.; Ramm, P.; Ionescu, A.M.
Conference Paper
20143D heterogeneous system integration
Ramm, Peter; Schneider, Peter; Dal Molin, Renzo
Journal Article
20143D IC Integration Since 2008
Garrou, P.; Ramm, P.; Koyanagi, M.
Book Article
2014Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R.
Conference Paper
2014Handbook of 3D integration. Vol.3
: Garrou, P.; Koyanagi, M.; Ramm, P.
Book
2014Key Applications and Market Trends for 3D Integration and Interposer Technologies
Beica, R.; Eloy, J.-C.; Ramm, P.
Book Article
2014Low-temperature bonding technologies for MEMS and 3D-IC
Taklo, M.M.V.; Schjolberg-Henriksen, K.; Malik, N.; Tofteberg, H.R.; Poppe, E.; Vella, D.O.; Borg, J.; Attard, A.; Hajdarevic, Z.; Klumpp, A.; Ramm, P.
Conference Paper
2014Overview of Bonding and Assembly for 3D Integration
Lu, J.J.-Q.; Zhang, D.; Ramm, P.
Book Article
2014Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC
Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B.
Conference Paper
2014Technology, simulation and design for 3D integrated heterogeneous sensor systems
Schneider, Peter; Heinig, Andy; Bayer, Christian; Ramm, Peter; Dal Molin, Renzo; Fleischer, Maximilian
Conference Paper
2013The common ground of interposer and 3D integration technology - hand in hand to face production concerns?
Ramm, P.
Journal Article
2012Handbook of wafer bonding
: Ramm, P.; Lu, J.J.-Q.; Taklo, M.M.V.
Book
2012Temporary adhesive bonding with reconfiguration of known good dies for three-dimensional integrated systems
Klumpp, A.; Ramm, P.
Book Article
2012Three-Dimensional Integration
Garrou, P.; Lu, J.J.-Q.; Ramm, P.
Book Article
2012Verfahren zur Herstellung eines Chips
Klumpp, Armin; Ramm, Peter
Patent
2011Characterization and failure analysis of 3D integrated systems using a novel plasma-FIB system
Kwakman, L.; Franz, G.; Taklo, M.M.V.; Klumpp, A.; Ramm, P.
Conference Paper
2011Failure analysis and reliability of 3D integrated systems
Ramm, P.; Klumpp, A.; Franz, G.; Kwakman, L.
Conference Paper
2011Reliability testing and failure analysis of 3D integrated systems
Klumpp, A.; Ramm, P.; Franz, G.; Rue, C.; Kwakman, L.
Conference Paper
20103D integration technology: Status and application development
Ramm, P.; Klumpp, A.; Weber, J.; Lietaer, N.; Taklo, M.; Raedt, W. de; Fritzsch, T.; Couderc, P.
Conference Paper
20103D interconnect technologies for advanced MEMS/NEMS applications
Lietaer, N.; Taklo, M.M.V.; Schjolberg-Henriksen, K.; Ramm, P.
Conference Paper
20103D System-on-Chip technologies for More than Moore systems
Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.
Journal Article
20103D-integration of silicon devices: A key technology for sophisticated products
Klumpp, A.; Ramm, P.; Wieland, R.
Conference Paper
2010Enabling technologies for 3D integration
Klumpp, A.; Ramm, P.
Book Article
2010The European 3D technology platform (e-CUBES)
Ramm, P.; Lietaer, N.; Raedt, W. de; Fritzsch, T.; Hilt, T.; Couderc, P.; Val, C.; Mathewson, A.; Razeeb, K.M.; Stam, F.; Klumpp, A.; Weber, J.; Taklo, M.
Journal Article
2010High performance 3D interconnects based on electrochemical etch and liquid metal fill
Hedler, H.; Scheiter, T.; Schieber, M.; Klumpp, A.; Ramm, P.
Conference Paper
2010IEEE 3D System Integration Conference 2010 (3DIC)
Ramm, P.; Beyne, E.
Conference Paper
2010Miniaturization of a wireless sensor node by means of 3D interconnects
Prainsack, J.; Stolle, J.; Weber, J.; Dielacher, M.; Flatscher, M.; Herndl, T.; Matischek, R.; Ramm, P.; Weber, W.
Conference Paper
2010Processing, materials, and integration of damascene and 3D interconnects: Preface
Flake, J.; Ritzdorf, T.; Koyangi, M.; Leonte, O.; Mathad, G.S.; Ramm, P.; Rathore, H.S.; Roozeboom, F.
Conference Paper
2010Reliability of through silicon via technologies
Klumpp, A.; Ramm, P.
Conference Paper
2010Welcome to the IEEE International: 3D system integration conference (3DIC)
Ramm, P.; Beyne, E.
Conference Paper
20093D integration technologies
Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.
Conference Paper
20093D integration technologies for MEMS/IC systems
Ramm, P.; Klumpp, A.; Weber, J.
Conference Paper
20093D integration technologies for miniaturized Tire Pressure Monitor System (TPMS)
Lietaer, N.; Taklo, M.M.V.; Klumpp, A.; Weber, J.; Ramm, P.
Conference Paper
20093D MEMS and IC integration
Taklo, M.M.V.; Lietaer, N.; Tofteberg, H.R.; Seppanen, T.; Prainsack, J.; Weber, J.; Ramm, P.
Conference Paper
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.
Conference Paper
20093D stacked MEMS and ICs in a miniaturized sensor node
Taklo, M.M.V.; Lietaer, N.; Tofteberg, H.; Seppänen, T.; Ramm, P.; Weber, W.
Conference Paper
2009Design support for 3D system integration by multi physics simulation
Schneider, P.; Reitz, S.; Stolle, J.; Martin, R.; Wilde, A.; Ramm, P.; Weber, J.
Conference Paper
2009Electrostatic carrier technique for thin wafer processing
Landesberger, C.; Wieland, R.; Ramm, P.; Bock, K.
Journal Article
2009Electrostatic wafer handling for thin wafer processing
Landesberger, C.; Wieland, R.; Klumpp, A.; Ramm, P.; Drost, A.; Schaber, U.; Bonfert, D.; Bock, K.
Conference Paper
2009Miniaturised sensor node for tire pressure monitoring (e-CUBES)
Schjølberg-Henriksen, K.; Taklo, M.M.V.; Lietaer, N.; Prainsack, J.; Dielacher, M.; Klein, M.; Wolf, M.J.; Weber, J.; Ramm, P.; Seppänen, T.
Conference Paper
20083D integration technologies for miniaturized tire pressure monitor system (TPMS)
Lietaer, N.; Taklo, M.M.V.; Klumpp, A.; Ramm, P.
Conference Paper
20083D integration technologies for wireless sensor systems (e-CUBES)
Ramm, P.; Taklo, M.; Weber, J.; Wolf, M.J.
Conference Paper
20083D packaging for image sensor application
Wolf, M.J.; Klumpp, A.; Wieland, R.; Zoschke, K.; Klein, M.; Nebrich, L.; Heinig, A.; Weber, W.; Limansyah, I.; Ramm, P.; Reichl, H.
Conference Paper
20083D wafer level system integration - requirements & technologies
Klumpp, A.; Wolf, M.J.; Ramm, P.; Wunderle, B.; Reichl, H.
Conference Paper
2008Fabrication Challenges of 3D Integration Technologies for More Than Moore Applications
Ramm, P.; Taklo, M.M.V.
Conference Paper
2008MAGIC: A european program to push the insertion of maskless lithography
Pain, L.; Icard, B.; Tedesco, S.; Kampherbeck, B.; Gross, G.; Klein, C.; Loeschner, H.; Platzgummer, E.; Morgan, R.; Manakli, S.; Kretz, J.; Holhe, C.; Choi, K.-H.; Thrum, F.; Kassel, E.; Pilz, W.; Keil, K.; Butschke, J.; Irmscher, M.; Letzkus, F.; Hudek, P.; Paraskevopoulos, A.; Ramm, P.; Weber, J.
Conference Paper
2008Technologies for 3D wafer level heterogeneous integration
Wolf, M.J.; Ramm, P.; Klumpp, A.; Reichl, H.
Conference Paper
2008Through silicon via technology - processes and reliability for wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Klumpp, A.; Wieland, R.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2008Through silicon vias as enablers for 3D systems
Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M.
Conference Paper
2008Through-Silicon Via Technologies for Extreme Miniaturized 3D Integrated Wireless Sensor Systems (e-CUBES)
Ramm, P.; Klumpp, A.
Conference Paper
2008Wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Wunderle, B.
Book Article
20073D integration technologies for ultrasmall wireless sensor systems - The e-Cubes project
Ramm, P.; Sauer, A.
Journal Article
20073D system integration
Klumpp, A.; Merkel, R.; Ramm, P.; Wieland, R.
Conference Paper
20073D system integration for high density interconnects
Wieland, R.; Klumpp, A.; Ramm, P.
Conference Paper
20073D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology
Wieland, R.; Ecke, R.; Klumpp, A.; Merkel, R.; Schulz, S.E.; Ramm, P.
Conference Paper
2007Design support for 3D-integration by physical oriented modeling of interconnect structures
Schneider, P.; Reitz, S.; Wilde, A.; Stolle, J.; Weber, J.; Ramm, P.
Presentation
2007Elektronisches System und Verfahren zur Herstellung eines dreidimensionalen elektronischen Systems
Ramm, P.; Klumpp, A.
Patent
2007Modeling and simulation of parasitic effects in stacked silicon
Elst, G.; Schneider, P.; Ramm, P.
Conference Paper
2007System Integration on Wafer Level - Requirements and Technical Solutions
Wolf, M.J.; Michel, B.; Ramm, P.; Reichl, H.
Conference Paper
2007Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon
Wunderle, B.; Mrossko, R.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michl, B.; Reichl, H.
Conference Paper
2007Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H.
Conference Paper
20063d system integration
Ramm, P.
Conference Paper
2006Multi-Chip-Modul und Verfahren zum Herstellen eines Multi-Chip-Moduls
Landesberger, C.; Reichl, H.; Ansorge, F.; Ramm, P.; Ehrmann, O.
Patent
2006Verdrahtungsverfahren fuer Halbleiter-Bauelemente zur Verhinderung von Produktpiraterie und Produktmanipulation, durch das Verfahren hergestelltes Halbleiter-Bauelement und Verwendung des Halbleiter-Bauelements in einer Chipkarte
Ramm, P.; Buchner, R.
Patent
20053D integration of CMOS transistors with ICV-SLID technology
Wieland, R.; Bonfert, D.; Klumpp, A.; Merkel, R.; Nebrich, L.; Weber, J.; Ramm, P.
Conference Paper, Journal Article
2005High quality strained Si/SiGe substrates for CMOS and optical devices
Weber, J.; Nebrich, L.; Bensch, F.; Neumeier, K.; Vogg, G.; Wieland, R.; Bonfert, D.; Ramm, P.
Conference Paper
2005Process integration of infrared-sensitive PIN photodiodes and CMOS transistors in a single-SiGe substrate
Nebrich, L.; Neumeier, K.; Stadler, A.; Weber, J.; Bensch, F.; Kreuzer, S.; Vogg, G.; Herrmann, K.; Klumpp, A.; Wieland, R.; Bonfert, D.; Soldner, W.; Ramm, P.
Conference Paper, Journal Article
2005Spectroscopic techniques for characterization of high-mobility strained-Si CMOS
Schmidt, J.; Vogg, G.; Bensch, F.; Kreuzer, S.; Ramm, P.; Zollner, S.; Liu, R.; Wennekers, P.
Conference Paper, Journal Article
2004Herausforderung an den Entwurf von Systems-on-Chip in 3D-Integration
Elst, G.; Ramm, P.
Conference Paper
2004Vertical system integration by using inter-chip vias and solid-liquid interdiffusion bonding
Klumpp, A.; Merkel, R.; Ramm, P.; Weber, J.; Wieland, R.
Journal Article
2004Vertical System Integration Technology for High Speed Applications by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding
Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Elst, G.; Ramm, P.
Book Article
20033D system integration technologies
Ramm, P.; Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Ostmann, A.; Wolf, J.
Conference Paper
2003Chip-to-wafer stacking technology for 3D system integration
Klumpp, A.; Merkel, R.; Wieland, R.; Ramm, P.
Conference Paper
2003Verfahren zur vertikalen Integration von elektrischen Bauelementen mittels Rückseitenkontaktierung
Ramm, P.; Klumpp, A.
Patent
2002Herstellungsverfahren fuer mikroelektronische Systeme zur Verhinderung von Produktpiraterie und Produktmanipulation, durch das Verfahren hergestelltes Halbleiter-Bauelement und Verwendung des Halbleiter-Bauelements in einer Chipkarte
Ramm, P.
Patent
2002InterChip via technology by using copper for vertical system integration
Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T.
Conference Paper
2002Verdrahtungsverfahren fuer mikroelektronische Systeme zur Verhinderung von Produktpiraterie und Produktmanipulation, durch das Verfahren hergestelltes mikroelektronisches System und Verwendung des mikroelektronischen Systems in einer Chipkarte
Ramm, P.
Patent
2002VERFAHREN ZUR HERSTELLUNG VON DREIDIMENSIONALEN SCHALTUNGEN
Buchner, R.; Ramm, P.
Patent
2001Copper metallization scheme for vertical chip integration
Riedel, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Wieland, R.; Leutenecker, R.; Klumpp, A.; Ramm, P.
Conference Paper
2001Interchip Via Technology for Vertical System Integration
Ramm, P.; Bonfert, D.; Gieser, H.; Haufe, J.; Iberl, F.; Klumpp, A.; Kux, A.; Wieland, R.
Conference Paper
2001Verfahren zur Herstellung einer dreidimensionalen integrierten Schaltung
Ramm, P.; Buchner, R.
Patent
2000Verfahren zum Erzeugen einer Titanmonophosphidschicht und ihre Verwendung
Froeschle, B.; Leutenecker, R.; Ramm, P.
Patent
2000Verfahren zum Herstellen dreidimensionaler Schaltungen
Ramm, P.
Patent
2000Verfahren zur Herstellung eines Halbleiterbauelements mit Rueckseitenkontaktierung
Ramm, P.
Patent
2000Verfahren zur Herstellung eines Transponders, Verfahren zur Herstellung einer Chipkarte, die einen Transponder aufweist, sowie nach dem erfindungsgemaessen Verfahren hergestellter Transponder und nach dem erfindungsgemaessen Verfahren hergestellte Chipkarte
Haberger, K.; Ramm, P.
Patent
2000Vertikal integrierte Schaltung und Verfahren zum Herstellen einer vertikal integrierten Schaltung
Ramm, P.; Gieser, H.
Patent
1999Single step DUV laser based stripping of photoresist with wafer cleaning for key 0.18 micron processes
Klumpp, A.; Ramm, P.
Conference Paper
1999VERDRAHTUNGSVERFAHREN ZUR HERSTELLUNG EINER VERTIKALEN INTEGRIERTEN SCHALTUNGSSTRUKTURUND VERTIKALE INTEGRIERTE SCHALTUNGSSTRUKTUR
Ramm, P.
Patent
1999Verfahren zur Herstellung einer dreidimensionalen integrierten Schaltung unter Erreichung hoher Systemausbeuten
Ramm, P.; Buchner, R.
Patent
1999Verfahren zur Herstellung einer vertikalen integrierten Schaltungsstruktur
Ramm, P.; Buchner, R.
Patent
1998Interchip via technology-three dimensional metallization for vertically integrated circuits
Bertagnolli, E.; Bollmann, D.; Braun, R.; Buchner, R.; Engelhardt, M.; Grassl, T.; Hieber, K.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Pamler, W.; Popp, R.; Ramm, P.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Sänger, A.
Conference Paper
1998Verfahren zum Aetzen von Strukturen in einer Siliziumschicht
Klumpp, A.; Bollmann, D.; Ramm, P.
Patent
1997Entwicklung einer Waferverbindungstechnik für vertikal integrierte IC's
Landesberger, C.; Klumpp, A.; Ramm, P.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Ramm, P.; Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schertel, A.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Sänger, A.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Ramm, P.; Sänger, A.
Conference Paper
1997Titanium monophosphide (TiP) layers as potential diffusion barriers
Leutenecker, R.; Fröschle, B.; Ramm, P.
Conference Paper
1997Titanium monophosphide (TiP) layers as potential diffusion barriers
Leutenecker, R.; Fröschle, B.; Ramm, P.
Conference Paper
1997Vertically integrated circuits. A key technology for future high performance systems
Engelhardt, M.; Hübner, H.; Jacobs, H.; Kleiner, M.; Kühn, S.; Pamler, W.; Renner, E.; Sänger, A.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, W.; Braun, R.; Grassl, T.; Hieber, K.; Kawala, G.; Klumpp, A.; Landesberger, C.; Popp, R.; Ramm, P.; Ruhl, G.; Weber, J.
Conference Paper
1996Verfahren zur vertikalen Integration mikroelektronischer Systeme
Ramm, P.
Patent
1995Verfahren zum Herstellen eines integrierten ionensensitiven Feldeffekttransistors in CMOS-Silizium-Planartechnologie
Hein, P.; Ramm, P.
Patent
1995Verfahren zum Herstellen eines ionensensitiven Feldeffekttransistors mit Rueckseitenkontakt
Hein, P.; Ramm, P.
Patent
1994Insitu post deposition anneal of rapid thermal chemical vapor deposited titanium nitride
Fröschle, B.; Leutenecker, R.; Cao-Minh, U.; Ramm, P.
Conference Paper
1994Rapid thermal chemical vapor deposition of titanium nitride for barrier application
Fröschle, B.; Leutenecker, R.; Cao-Minh, U.; Ramm, P.
Conference Paper
1993Verfahren zum Herstellen eines Biosensors
Hein, P.; Ramm, P.
Patent
1992ONO structures investigated by SIMS, RBS, and NRA
Ramm, P.; Iberl, F.; Lang, W.
Journal Article, Conference Paper
1992Verfahren zum Herstellen einer integrierten CMOS-Schaltung mit einem ISFET und mit einem Auswertungs-MISFET in Polysiliziumtechnologie
Hein, P.; Ramm, P.
Patent