Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20163D TSV based high frequency components for RF IC and RF MEMS applications
Fernandez-Bolanos, M.; Vitale, W.A.; López, M.M.; Ionescu, A.M.; Klumpp, A.; Merkel, R.; Weber, J.; Ramm, P.; Ocket, I.; Raedt, W. de; Enayati, A.
Conference Paper
2015Fine pitch 3D-TSV based high frequency components of RF MEMS applications
Vitale, W.A.; Fernandez-Bolanos, M.; Merkel, R.; Enayati, A.; Ocker, I.; Raedt, W. de; Weber, J.; Ramm, P.; Ionescu, A.M.
Conference Paper
20103D integration technology: Status and application development
Ramm, P.; Klumpp, A.; Weber, J.; Lietaer, N.; Taklo, M.; Raedt, W. de; Fritzsch, T.; Couderc, P.
Conference Paper
2010The European 3D technology platform (e-CUBES)
Ramm, P.; Lietaer, N.; Raedt, W. de; Fritzsch, T.; Hilt, T.; Couderc, P.; Val, C.; Mathewson, A.; Razeeb, K.M.; Stam, F.; Klumpp, A.; Weber, J.; Taklo, M.
Journal Article
2009Body surface backed flexible antennas and 3D Si-level integrated wireless sensor nodes for 17 GHz wireless body area networks
Rydberg, A.; Engen, P. van; Cheng, S.; Doremalen, R. van; Sanduleanu, M.; Hjort, K.; Raedt, W. de; Fritzsch, T.; Hallbjörner, P.
Conference Paper
2009Wireless activity monitor using 3D integration
Doremalen, R. van; Engen, P. van; Jochems, W.; Rommers, A.; Maas, G.; Cheng, S.; Rydberg, A.; Fritzsch, T.; Wolf, J.; Raedt, W. de; Jansen, R.; Müller, P.; Alarcon, E.; Sanduleanu, M.
Conference Paper
2008Demonstration of heterogeneous integration of technologies for a Ku-Band SiP Doppler radar
Sun, X.; Brebels, S.; Stoukatch, S.; Jansen, R.; Dussopt, L.; Dubois, M.-A.; O'Mahony, C.; Berberich, S.; Houlihan, R.; Raedt, W. de
Conference Paper
2008Demonstration of heterogeneous integration of technologies for a Ku-Band SiP Doppler radar
Sun, X.; Brebels, S.; Stoukatch, S.; Jansen, R.; Dussopt, R.; Dubois, M.-A.; O'Mahony, C.; Berberich, S.; Houlihan, R.; Raedt, W. de
Conference Paper