Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Methodology for correlation of porosity and mechanical properties of silver sintered joints in electronics
Metasch, René; Röllig, Mike; Knoch, Philip; Weinmann, Christian; Meier, Karsten
Conference Paper
2019Numerical and experimental study of the spatial stress distribution on the cornea surface during a non-contact tonometry examination
Münch, Stefan; Röllig, Mike; Spörl, Eberhard; Balzani, Daniel
Journal Article
2019Stress Characterization of Ceramic Substrates by Laser Speckle Photometry
Chen, Lili; Cikalova, Ulana; Münch, Stefan; Röllig, Mike; Bendjus, Beatrice
Conference Paper
2018Developments for highly reliable electronics - experiments on combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Conference Paper
2018Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
Krämer, Frank; Röllig, Mike; Metasch, René; Ahmar, Joseph Al; Meier, Karsten; Wiese, Steffen
Journal Article
2018Experimental Verification of FE-Models for Thermo-Mechanical Loading using Digital Image Correlation
Schwerz, Robert; Metasch, René; Röllig, Mike; Wolter, Klaus-Jürgen
Conference Paper
2018Heat haze effects in thermal chamber tensile tests on digital image correlation
Yuile, Adam; Schwerz, Robert; Röllig, Mike; Metasch, René; Wiese, Steffen
Conference Paper
2018Langzeitzuverlässige Füllstandsmessung durch ein faserverbundintegriertes Elektroniksystem
Schwerz, Robert; Röllig, Mike; Weißenborn, Oliver; Geller, Sirko; Modler, Niels; Sauer, Sebastian
Conference Paper
2018Laser Speckle Photometry for Stress Measuring at Industrial Components
Chen, Lili; Cikalova, Ulana; Münch, Stefan; Röllig, Mike; Bendjus, Beatrice
Conference Paper
2018Novel concept of an in-situ test system for the thermal-mechanical fatigue measurement for reliability evaluation of electronic solder joints
Metasch, René; Röllig, Mike; Naumann, Uwe; Wiesenhütter, Felix; Kaufmann, R.
Conference Paper
2018Reliability analysis of encapsulated components in 3D-circuit board integration
Schwerz, Robert; Röllig, Mike; Wolter, Klaus-Jürgen
Conference Paper
2018Setup für Ermüdungsversuche an elektronischen Komponenten unter kombinierten Temperatur- und Vibrationslasten
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, K.
Conference Paper
2018Solder joint fatigue analysis under combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Liu, Y.; Bock, K.
Conference Paper
2018Thermo-Mechanical Measurement Approach of Ag-sintered Joints for Power Electronics
Metasch, René; Meier, Karsten; Röllig, Mike
Conference Paper
2018Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Weihe, Stefan
Journal Article
2018Verfahren zur Bestimmung von mechanischen Spannungen in Substraten oder Schaltungsträgern, die mit einem keramischen Werkstoff gebildet sind
Bendjus, Beatrice; Cikalova, Ulana; Münch, Stefan; Röllig, Mike
Patent
2017Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder joints
Metasch, René; Röllig, Mike; Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Meier, Karsten; Panchenko, Iuliana
Conference Paper
2017Experimental determination of the Young's modulus of various electronic packaging materials
Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten
Conference Paper
2017Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, Karlheinz
Conference Paper
2017A laser speckle photometry based non-destructive method for measuring stress conditions in direct-copper-bonded ceramics for power electronic application
Münch, Stefan; Röllig, Mike; Cikalova, Ulana; Bendjus, Beatrice; Chen, Lili; Lautenschläger, Georg; Sudip, Shohag Roy
Conference Paper
2017Method for the development of realistic boundary conditions for the simulation of non-contact tonometry
Münch, Stefan; Balzani, Daniel; Röllig, Mike; Spörl, Eberhard
Journal Article, Conference Paper
2017Sensorfunktion im Faserverbund
Lätzsch, Hans-Joachim; Modler, Niels; Geller, Sirko; Weißenborn, Oliver; Röllig, Mike; Schwerz, Robert; Müller, Uwe; Sauer, Sebastian
Journal Article
2017Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Weihe, Stefan
Conference Paper
2016Entwicklung einer Pro-aktiven Lötstellengeometrie-unabhängigen Lebensdauersimulation für bleifrei Lote
Metais, Benjamin; Kabakchiev, Alexander; Guyenot, Michael; Metasch, René; Röllig, Mike; Buhl, Patrick; Weihe, Stefan
Conference Paper
2016Messverfahren zur thermo-mechanischen Charakterisierung von Werkstoffen der Hochtemperatur-AVT
Metasch, René; Klemm, Alexander; Röllig, Mike; Zerna, Thomas
Conference Paper
2016Multi-scale radiographic applications in microelectronic industry
Gluch, Jürgen; Löffler, Markus; Meyendorf, Norbert G.; Oppermann, Martin; Röllig, Mike; Sättler, P.; Wolter, Klaus-Jürgen; Zschech, Ehrenfried
Conference Paper
2016NDE applications in microelectronic industries
Meyendorf, Norbert; Oppermann, Martin; Krüger, Peter; Röllig, Mike; Wolter, Klaus-Jürgen
Conference Paper
2016Robust and reliable encapsulation of electronics for underwater applications
Schwerz, Robert; Röllig, Mike; Frankenstein, Bernd
Conference Paper
2016Sprödbruchrisiko an keramischen Bauelementen in Abhängigkeit vom Hochtemperatur-Lotwerkstoff und der Beanspruchungsgeschwindigkeit
Dudek, Rainer; Hildebrandt, Marcus; Rzepka, Sven; Röllig, Mike; Trodler, Jörg
Conference Paper
2016Zuverlässigkeitsuntersuchungen an organischen Leiterplatten mit dickem Kupferkern für leistungselektronische Anwendungen
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Conference Paper
2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K.
Conference Paper
2015A viscoplastic-fatigue-creep damage model for tin-based solder alloy
Metais, Benjamin; Kabakchiev, Alexander; Maniar, Youssef; Guyenot, Michael; Metasch, René; Röllig, Mike; Rettenmeier, Philipp; Buhl, Patrick; Weihe, Stefan
Conference Paper
2014Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for finite element calculations
Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Guyenot, Michael; Buhl, P.; Hossfeld, M.; Metasch, René; Röllig, Mike
Conference Paper
2014Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics
Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Meier, Karsten; Wolter, Klaus-Jürgen
Conference Paper
2014Filter-based interrogation of fiber bragg grating sensors
Wuchrer, Roland; Lautenschläger, Harald; Metasch, René; Röllig, Mike; Fleischer, Thomas; Härtling, Thomas
Conference Paper
2014Lebensdauer von SMD-Lotkontakten unter kombinierter Vibrations- und Temperaturbelastung
Meier, Karsten; Lautenschläger, Georg; Wolter, Klaus-Jürgen; Röllig, Mike; Schießl, Andreas
Journal Article
2014Lebensdauerbestimmung für Lotkontakte von SMD-Bauelementen unter Vibrations- und Temperaturbelastung
Meier, Karsten; Lautenschläger, Georg; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen
Conference Paper
2014Reliability assessment of discrete passive components embedded into PCB core
Schwerz, Robert; Röllig, Mike; Osmolovskyi, Sergii; Wolter, Klaus-Jürgen
Conference Paper
2014Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading
Meier, Karsten; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen
Conference Paper
2014Zuverlässigkeitsbewertung von elektrischen und mechanischen Verbindungen mit dem iQPro-Demonstrator
Metasch, René; Röllig, Mike; Wolter, Klaus-Jürgen; Meyendorf, Norbert
Conference Paper
2014Zuverlässigkeitspotential von eingebetteten passiven und aktiven Bauelementen für die sensorische Strukturüberwachung
Schwerz, Robert; Röllig, Mike; Franke, M.; Lautenschläger, Georg; Wolter, Klaus-Jürgen
Conference Paper
2013Determination of the life-time of solder joints under temperature and vibration loadings
Meier, Karsten; Röllig, Mike; Lautenschlaeger, Georg; Schießl, Andreas; Wolter, Klaus-Jürgen; Meyendorf, Norbert
Conference Paper