Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Copper electroplating with polyethylene Glycol. Pt.II. Experimental analysis and determination of model parameters
Yang, Hongliu; Krause, Robert; Scheunert, Christin; Liske, Romy; Uhlig, Benjamin; Preusse, Axel; Dianat, Arezoo; Bobeth, Manfred; Cuniberti, Gianaurelio
Journal Article
2017BEoL post CMP cleaning challenges for 22 nm FD-SOI and beyond
Koch, Johannes; Rehschuh, Stephan; Gerlich, Lukas; Dhavamani, Abitha; Steinke, Philipp; Krause, Robert; Naue, Johannes; Bott, Sascha; Vasilev, Boris; Breuer, Dirk; Seidel, Robert; Preusse, Axel; Bartha, Johann Wolfgang; Uhlig, Benjamin
Conference Paper
2016The influence of adsorption kinetics on copper superfilling for dual damascene
Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel
Journal Article
2015Cobalt advanced barrier metallization: A resistivity composition analysis
Wislicenus, M.; Liske, R.; Gerlich, L.; Vasilev, B.; Preusse, A.
Journal Article
2015Theory of co-adsorption and its application to copper superfilling
Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel
Presentation
2014Advanced metallization concepts and impact on reliability
Hauschildt, Meike; Hintze, Bernd; Gall, Martin; Koschinsky, Frank; Preuße, Axel; Bolom, Tibor; Nopper, Markus; Beyer, Armand; Aubel, Oliver; Talut, Georg; Zschech, Ehrenfried
Journal Article
2014CMP process development for Cobalt liner integration at the 28-nm-node
Koch, J.; Bott, S.; Wislicenus, M.; Krause, R.; Gerlich, L.; Uhlig, B.; Liske, R.; Vasilev, B.; Preusse, A.
Conference Paper
2014Cobalt advanced barrier metallization: A resist composition analysis
Wislicenus, Marcus; Liske, Romy; Gerlich, Lukas; Vasilev, Boris; Preusse, Axel
Conference Paper
2012Analysis of pore sealing processes and TiN diffusion barrier deposition on a porous ultra low-k dielectric by ellipsometric porosimetry and PALS
Ahner, N.; Ecke, R.; Schulz, S.E.; Jungmann, M.; Krause-Rehberg, R.; Butterling, M.; Anwand, W.; Wagner, A.; Preusse, A.
Conference Paper
2012Electrical evaluation of Ru-W(-N), Ru-Ta(-N) and Ru-Mn films as Cu diffusion barriers
Wojcik, H.; Kaltofen, R.; Merkel, U.; Krien, C.; Strehle, S.; Gluch, J.; Knaut, M.; Wenzel, C.; Preusse, A.; Bartha, J.W.; Geidel, M.; Adolphi, B.; Neumann, V.; Liske, R.; Munnik, F.
Journal Article
2010Microstructure in copper interconnects - Influence of plating additive concentration
Neuner, J.; Zienert, I.; Peeva, A.; Preusse, A.; Kücher, P.; Bartha, J.W.
Conference Paper
2009Influence of additive coadsorption on copper superfill behavior
Liske, R.; Wehner, S.; Preusse, A.; Kuecher, P.; Bartha, J.W.
Journal Article
2008Electrochemical Cu deposition in sub-100-nm interconnects
Liske, R.; Preusse, A.; Wehner, S.; Kücher, P.; Bartha, J.W.
Conference Paper
2005Electromigration-induced copper interconnect degradation and failure: The role of microstructure
Zschech, Ehrenfried; Meyer, M.A.; Zienert, I.; Langer, E.; Geisler, H.; Preusse, A.; Huebler, P.
Conference Paper