Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B.
Journal Article
2015Accelerated determination of interfacial fracture toughness in microelectronic packages under cyclic loading
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B.
Conference Paper
2015An in-situ numerical-experimental approach for fatigue delamination characterization in Microelectronic Packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B.
Conference Paper
2014An accelerated interfacial characterization method for microelectronic packages under automotive testing conditions - methodology and sample preparation
Poshtan, E.A.; Silber, C.; Rzepka, S.; Michel, B.; Wunderle, B.
Book Article
2014An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions
Poshtan, E.A.; Rzepka, S.; Michel, B.; Silber, C.; Wunderle, B.
Conference Paper
2012The effects of rate-dependent material properties and geometrical characteristics on thermo-mechanical behavior of TQFP package
Poshtan, E.A.; Rzepka, S.; Wunderle, B.; Silber, C.; Bargen, T. von; Michel, B.
Conference Paper