Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2007Design for miniaturization of wireless sensor nodes based on 3D-packaging technologies
Niedermayer, M.; Thomasius, R.; Polityko, D.-D.; Schrank, K.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2007Entwurfswerkzeug fuer Art und Form einer Schaltungsrealisierung
Kuefer, K.; Schroeder, M.; Polityko, D.
Patent
2007Linking geometrical and electrical parameters of flex substrate vertical interconnects for 2.5D system-in-package design
Maaß, U.; Polityko, D.-D.; Richter, C.; Ndip, I.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2007Modulares mikroelektronisches Bauteil
Niedermayer, M.; Ostmann, A.; Guttowski, S.; Grundmann, S.; Thomasius, R.; Polityko, D.
Patent
2007Technology aware modeling of 2.5D-SiP for automation in physical design
Richter, C.; Polityko, D.-D.; Hefer, J.; Gutowski, S.; Reichl, H.; Berger, M.; Nowak, U.; Schroeder, M.
Conference Paper
2006Development of a 3D wafer-level re-routing, using dielectric lamination technology
Böttcher, L.; Ostmann, A.; Manessis, D.; Polityko, D.; Reichl, H.
Conference Paper
2006Entwurf kleinster energieautarker Funksensoren
Thomasius, R.; Niedermayer, M.; Polityko, D.-D.; Schrank, K.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Integration technology parameters for physical design of vertical system-in-package
Polityko, D.; Guttowski, S.; Reichl, H.
Conference Paper
2006Mikroelektronische Baugruppe und Verfahren zum Herstellen einer mikroelektronischen Baugruppe
Polityko, D.; Wenzel, S.; Jung, E.; Hefer, J.; Niedermayer, M.; Guttowski, S.
Patent
2006Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies
Niedermayer, M.; Guttowski, S.; Thomasius, R.; Polityko, D.; Schrank, K.; Reichl, H.
Conference Paper
20052,5-Dimensional System-In-Package Integration - Technology Oriented Parameter Model For Physical Design
Polityko, D.D.; Guttowski, S.; Reichl, H.
Conference Paper
2005Physical design and technology parameters for vertical system-in-package integration
Polityko, D.-D.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2004Design aspects of self-sufficient distributed MicroSystems
Niedermayer, M.; Polityko, D.-D.; Fotheringham, G.; Guttowski, S.; John, W.
Journal Article
2000Automated disassembly of PCBs for re-use and quality control of desoldered packages
Dembowski, H.; Pötter, H.; Polityko, D.; Schrank, K.; Stobbe, I.
Conference Paper